1-2SMT三大工序简介ppt课件

1、SMT三大工序簡介.目 錄一 、錫膏印刷機二 、高速貼片機三 、FEEDER的認識四 、泛用機五 、回焊爐.一 、錫膏印刷機1.1 SMT三大關鍵工序1.2 錫膏印刷機UP2000.1.1SMT三大關鍵工序印刷貼片回流焊.1.2錫膏印刷(UP2000)相關制程條件:-印刷參數-錫膏/固定膠-鋼板設計-刮刀-PCB設計-自動鋼板清洁 -全視覺識別系統.Laser cut and electropolished stencilMetal squeegeeLength:14&16Solder paste.定位治具PCBCAMERA.印刷之OK產品.二、高速貼片機(MSH3)-反射識別系統 -16個旋

2、轉任务頭帶2種Nozzle -最快貼片速度: 0.075 Sec/Comp ,48000comps/hour -貼片零件種類:1005mm Chip18*18mmQFP ,6.5mmHeight.Head unitPCB camera.高速机料站陈列Feeder.三、供料器識別3.1 供料器識別3.2 料帶識別.3.1供料器(FEEDER)識別8*4膠帶FEEDER 8*4紙帶FEEDER16*12膠帶FEEDER16*8膠帶FEEDER.3.2 FEEDER&料帶識別泛用機FEEDER 泛用機FEEDER型號標示紙 帶 料膠 帶 料.何謂W*4P PAPER8W指該可容納料帶寬度為mmP指每

3、推動一下前進mmPAPER指該Feeder為紙帶Feeder.高速貼片機(MV2VB)相關制程條件:-貼片參數-Program-Feeder &Nozzle-來料-反射及透射識別系統-12個旋轉任务頭, 5種Nozzle -最快貼片速度: 0.1 Sec/Comp-貼片零件種類:0402mm Chip32*32mmQFP6.5mmHeight.PCB CameraRotaryHead unitParts recg. camera.四、泛用機(MPAV2B)-4 個任务頭,自動換Nozzle-Tape Feeder &Tray 供料方式-2D&3D識別系統-最快貼片速度: 0.53 Sec/QF

4、P,0.44Sec/chip.Head unitParts recg. camera-貼片零件種類:1005mm Chip55*55mm QFP L150*W55*H25 ,BGA,CSP.貼片OK之產品. 回焊爐(Heller 1800exl)相關制程條件:-Temp profile-錫膏/固定膠品質-來料品質-全熱風對流-鏈條+鏈网偉送-自動鏈條潤滑.五、回焊爐(Heller 1800exl)SP:設定溫度PV:實際溫度BELT:傳送速度.錫膏溫度曲線.SMT Reflow Soldering Profile for solder paste (1)Keep the slope low t

5、o minimize motherboard warping during preheat and cool down.Peak temp215+/-10deg CSlope 3degC/secTime above liquidus 45-90 secondsSlope -2-5degC/secHold at 140-183 deg C for 6090Seconds183 CBoard Temp(預熱區)(恆溫區)(回焊區)(冷卻區)Time 130-160C range:Extended period allows board temperature to stabilize(warp) and allows flux to finish cleaning prior