PCB清洁作业办法讲课教案

1、Good is good, but better carries it.精益求精，善益求善。PCB清洁作业办法-PCB清潔作業辦法CleanworkinstructionsofPCBApprovedbyCheckedbyDepartmentPreparedby張金華陳下平SMT課豐道坤RevisionHistoryDateRev.DescriptionEditor2011/05/10AINITIALRELEASE.豐道坤2011/07/27B修改內容5.7.5陳下平2011/11/21C修改內容5.5，5.7.5.原5.2.3，5.7.5刪除，增加5.4.32012/02/29D大幅度修改吳學

2、精1.0目的Purpose為了盡可能的避免洗板造成的品质问题，規範PCB印刷不良處理方式及清潔方法。Forasfaraspossibleavoidsthequalityquestionwhichwashestheboardtocreate,standardPCBprintsthebadprocessingmodeandthecleanmethod.2.0範圍Scope錫膏印刷、點膠、貼片偏移，亂件不良之PCB。Theprinting,glueandSMDmigration,disorderlyaadversePCB3.0權責單位ResponsibleDepartmentSMT課SMTsecti

3、on4.0定義Definition無Noting5.0作業內容Content5.1工程師P/R或T/R時在PCB上加一層試板膜調試印刷效果，待調試正常後再撕掉試板膜正常印刷，避免調試不良造成洗板。EngineersP/RorT/RinPCBwhenaddingalayertestplateprintingeffect,waitformembranedebuggingnormaltearoffagainaftertestplateprinting,avoiddebuggingmembranenormallycausedbypoorwashboards5.2印刷不良之PCB處理方式Printing

4、adverseofPCBprocessingmethod.5.2.1印刷空焊、錫少、漏印由產線工程師或產線領班組長負責採用重印的方法處理，避免洗板。Printingemptywelding,tin,lessbyitsengineerisresponsiblefortheproductionlineadoptsareprintofapproach,avoidwashingboard.5.2.2印刷短路、錫尖由操作員對其進行修正，使用針筆去除印刷短路部份。Printingshort-circuits,thetinpointcarriesontherevisionafterit。5.2.3印刷偏移不

5、超過PAD三分之一者直接流至後段待觀察。TheprintingdisplacementofnomorethanonehalfPADflowdirectlytotreattheobservationtotheobserve5.2.5點膠拉絲、孔塞、點膠偏移由操作員對其進行修正。Dispensingwiredrawing,holeplug,dispensingoffsetbyanoperatortoitsamended.5.2.6點膠量不足及漏點膠由操作員用手動方式進行補點膠。Dispensingquantitydeficiencyandwithbyanoperatorwhichgluedispe

6、nsingformanually.5.2.7以上所有動作進行後都需在PCB板邊位置貼上黃色圓形標籤，標籤上注明處理位置，提醒T/R段人員注意確認，沒有板邊的PCB板貼在v-cut或roating位置。AllofthefollowingactionsmustbeinPCBaftertreatmentwithredbadlabel,positiontoremindT/Usectionresearchersnote.5.3印刷不良必須要清洗之類型Printingbadmustcleanthetypes5.3.1整體印刷偏移超過PAD三分之一者需進行全面清洗。Overalltheprintingdis

7、placementmorethanonehalfPADthoroughcleaningplayersmust.5.3.2印刷空焊、錫少、漏印採用重印後之嚴重偏移(偏移超過Pad1/3)需進行全部清洗。Printingemptywelding,tinlessbytheseriousafteritsreprintshifts(offsetoverPadwithhalf)needtoundertakeallthecleaning.5.3.3清洗之PCB需在板邊位置或v-cut,roating位置貼上紅色圓形清洗Label，以示目檢重點檢查，檢查OK品由總檢人員將清洗Label撕除後流至下制程。The

8、PCBwithcleaningtocleanLabel,inordertoshowvisualinspectionkeycheck,checkOKproductbytheinspectionpersonnelwillcleanLabeltoreexcept5.4清洗PCB使用工具CleaningPCBtools橡膠鏟刀、聚合物手套、PC-25、氣槍、鋼網擦拭紙、毛刷、放大鏡Mask,polymergloves,PC-25,airgun,dustlessnesscleaningpaper,brush,handglass5.5清洗作業步驟Cleaningsteps5.5.1將印刷、點膠不良之PCB

9、，平放於清洗臺面上(如圖一)。Willprinting,dispensingadversePCB,lieincleaningmesa(figure1).5.5.2使用橡膠鏟刀將PCB上的錫膏尽可能的铲除干净(如圖二)。Sprayscatteredtoapplyintheblockofcleaningsolvent(figure2).(圖一)(圖二)5.5.3使用擦拭紙清潔PCB表面殘錫、殘膠後,再倒入PC25溶劑至PCB開設的孔壁內，以小刷來回的輕刷，並用擦拭紙將殘留的溶劑及錫膏紅膠擦掉(圖三、圖四)。Usingwipepapercleansurfaceresidualtin,PCBafter

10、incompleteglue,garnishsolventtoopenholewallofPCB,withinthelightwithabrush,brushandbackandforthwipepaperwillremainthesolventanderasethesolderpasteredrubber(figure3,figure4).(圖三)(圖四)5.5.4再以空氣槍將PCB上貫穿孔(Throughhole)位置可能殘留之錫膏紅膠吹出(圖五)。WillusetheairgunwillpassthroughPCB(Throughhole)ontheperforationtoremain

11、thetincosmeticsrubbertoblowout(Figurefive).5.5.5將PCB翻面清洗，重覆步驟圖二至圖四將PCB開孔皆清洗乾淨。ThePCBturnsurfacecleaning,repeatstepsfigure2tofigure4,willopenholesarecleanPCB.5.5.6清洗後，再以擦拭紙擦拭PCB表面及使用空氣槍清潔一次。然後用10倍的放大鏡檢查FinePitch元件，viahole，金手指。并貼上红色圆形標簽(貼標簽位置为板边位置，没有板边选取v-cut或roating位置)Aftertheclean,usesthewipepaperto

12、cleanthePCBsurfaceandusingairguncleanagain.Thenusingthe10timesofmagnifyingglassesinspectFinePitchcomponents,viahole,goldfinger.Andlabeledwhitetrianglelabel,(Pastesthelabelpositiontakenottoaffectprintingastheselectionprinciple.)5.5.7將PCB清洗時間及送至產線時間填寫在上；然後請領班或組長檢查是否還有錫膏紅膠殘留，如清洗OK立即上線生產，如有殘留物請继续清洗。依照上述

13、步驟再執行一次。ThePCBcleaningtimeandsenttoproductionlinefillin,andthePCBwassenttoproductionline.ThatasktoIPQCwhichthesolderpasteredrubberwhetherthereisresidual,IfcleaningOKproductionimmediatelyonlineandmakingoutifanyresiduepleasesendtoPCBcleaningareainaccordancewiththeabovestepsagain.(figure6)5.5.8清洗後之PCB流

14、至T/U段，由T/U段人員目檢确认是否OK，并在洗板记录表上签名AftercleaningthePCBflowtoT/Usegment,byT/UsegmentoftheoperatorvisualinspectionandOKscanningcleaningthebarcode(A059PCB).5.5.9由作業員將貼有红色圆形標簽的PCB送至X-RAY處檢查零件吃錫狀況。OK後產線作業人員撕掉红色圆形標簽流至下一站。BytheoperatorwillPCBlabeledwhitetrianglelabelsenttoX-RAYsolderinspectpartssituation.OKla

15、terproductionlinehomeworkpersonneltearwhitetriangletagflowtothenextstation.(圖五)(圖六)5.6注意事項Notes:5.6.1使用空氣槍做清潔時，請在垃圾桶上方作業，以避免錫膏顆粒飛濺。Useairgundoingthecleaning,pleaseinthetrashhomeworktoavoidabovethesolderpasteparticlessplashes.5.6.2有金手指及天線的PCB在清洗時，需用高溫膠將金手指處貼蓋,以免損傷。(圖七)清潔後移除金手指和其他區域的保護膠帶。WhenPCBcleanw

16、iththegoldfingersandantenna,needhightemperaturegluewillgoldfingerplace,avoidinjurypostedcover.(figure7)Aftercleaningremovedgoldfingerandotherregionalprotectiontape.5.6.3如一整塊連板中有單塊或多塊NG板，在清洗之前需用小刀在NG塊內劃損作記號，以免清凈后與好的單塊混亂。(圖八)IfapieceofsingleblockofevenpullormorepiecesNGboards,beforecleanneedstousethek

17、nifetodelimitintheNGblockdamagesmakesthesymbol,inordertoavoidaftercleaning,andthegoodmonolithischaotic.(Figure8)(圖七)(圖八)5.6.4清洗OK後的PCB立即上線生產(清洗後之PCB產線在半小時內必須上線生產)AftercleaningOKPCBtomakethePCBtolinetheproductionimmediately(ThePCBproductionlineaftercleaningmuston-lineproductioninhalfanhour)5.6.5若目前的清

18、洗方式無法滿足客戶的要求時,則不做清洗的動作.為盡可能避免印刷不良.在每次換線時,使用該機種之1pcsPCB板貼上試印膠膜試印，調試OK後方可正常印刷,公板如圖九。若印刷失敗,請按”5.2”方法作業，並用防焊膠貼於板邊，注明印刷不良位置，以利T/U重點檢查處理.例下圖例.（圖十）。Ifthecurrentcleaningmethodcannotmeettherequirementsofcustomers,theydontclean.Forasfaraspossibletoavoidpoorprinting.Ineverytimeitprintingline,pleaseusethismodeltypepreparationthecommunalboardtotryprint,debuggingOKrearcannormalprinting.Communalboardasshown