pcb封装设计规范v1.

1、-. z. - - s-PCB封装设计规*文件编号:受控标识:版本状态:发放序号: 日期： 日期： 日期：目 录TOC o 1-3 h z uHYPERLINK l _Toc2552199701、目的 PAGEREF _Toc255219970 h 3HYPERLINK l _Toc2552199712、适用*围 PAGEREF _Toc255219971 h 4HYPERLINK l _Toc2552199723、职责 PAGEREF _Toc255219972 h 4HYPERLINK l _Toc2552199734、术语定义 PAGEREF _Toc255219973 h 4HYPER

2、LINK l _Toc2552199745、引用标准 PAGEREF _Toc255219974 h 4HYPERLINK l _Toc2552199756、PCB封装设计过程框图 PAGEREF _Toc255219975 h 4HYPERLINK l _Toc2552199767、SMC外表组装元件封装及命名简介 PAGEREF _Toc255219976 h 5HYPERLINK l _Toc2552199778、SMD外表组装器件封装及命名简介 PAGEREF _Toc255219977 h 6HYPERLINK l _Toc2552199789、设计规则 PAGEREF _Toc25

3、5219978 h 6HYPERLINK l _Toc25521997910、PCB封装设计命名方式 PAGEREF _Toc255219979 h 7HYPERLINK l _Toc25521998011、PCB封装放置入库方式 PAGEREF _Toc255219980 h 7HYPERLINK l _Toc25521998112、封装设计分类 PAGEREF _Toc255219981 h 7HYPERLINK l _Toc25521998212.1、矩形元件标准类 PAGEREF _Toc255219982 h 7HYPERLINK l _Toc25521998312.2、圆形元件标准

4、类 PAGEREF _Toc255219983 h 16HYPERLINK l _Toc25521998412.3、小外形晶体管SOT及二极管SOD标准类 PAGEREF _Toc255219984 h18HYPERLINK l _Toc25521998512.4、集成电路IC标准类 PAGEREF _Toc255219985 h 24HYPERLINK l _Toc25521998612.5、微波器件非标准类 PAGEREF _Toc255219986 h 34HYPERLINK l _Toc25521998712.6、接插件非标准类 PAGEREF _Toc255219987 h 361、

5、目的本规*是为电子元器件的外表属性提供模版信息，即为外表器件焊盘图形设计提供模版尺寸，外形以及公差，以便检查和测试，确保外表装配产品的可靠性，从而规*电子元器件的PCB封装设计2、适用*围本规*适用于研发中心PCB部所有PCB封装的设计。3、职 责PCB封装库评审由PCB部门经理与工艺部门经理共同评审完成，特殊封装除外。PCB部门专职PCB封装设计人员负责PCB封装库的设计、评审和更新。4、术语定义PCBPrint circuit Board)：印刷电路板Footprint：封装ICintegrated circuits：集成电路SMCSurface Mounted ponents：外表组装元

6、件SMDSurface Mounted Devices：外表组装器件5、引用标准以下标准包含的条文，通过在本规*中引用而构本钱规*的条文。在规*归档时，所示版本均为有效。所有规*都会被修订，使用本规*的各方应探讨，使用以下标准最新版本的可能性。IPC Batch Footprint Generator ReferenceIPC-7351 Generic Requirements forSurface Mount Design andLand Pattern StandardIPC-SM-782ASurface Mount Design andLand Pattern Standard外表组装技

7、术根底与可制造性设计6、PCB封装设计过程框图器件部SCH封装库设计完成后，把DATASHEET输入给PCB部封装设计人员设计PCB器件封装评审载入PCB封装库更新上传封装设计人员把PCB封装定义名称返回给器件部SCH封装设计人员与之统一通过不通过 图 6.1 PCB封装设计过程框图7、SMC外表组装元件封装及命名简介SMC主要是指无源元件的机电元件，包括各种电阻器、陶瓷电容器、铝电解电容器、电感器、磁珠、陶瓷振子、滤波器、电阻网络、电容网络、微调电容器、电位器、各种开关、继电器、连接器等，封装形状有矩形、圆柱形、复合形和异形。SMC的封装是以元件的外形尺寸来命名的，其标称以3位或4位数字来表

8、示，SMC的封装命名及标称已经标准化。SMC常用外形尺寸长度和宽度命名，来标志其外形大小，通常有公制mm和英制inch两种表示方法。公制mm/英制inch转换式如下：25.4mm英制inch尺寸=公制mm尺寸例如：08050.08inch0.05inch英制转换为公制元件长度=25.4mm0.08=2.0322.0mm元件宽度=25.4mm0.05=1.271.25mm0805的公制表示法为21252.0mm1.25mm8、SMD外表组装器件封装及命名简介SMD主要是指有源器件，包括半导体分立器件二极管、三极管和半导体特殊器件、集成电路。SMD是贴在PCB外表的，而不是插在PCB通孔中；SMD

9、的体积小、重量轻、速度快；SMD可以两面贴装，焊接质量好、可靠性高。SMD封装命名是以器件的外形命名的。SMD的引出脚有羽翼形GULL、J形、球形、和无引线引线框架形。SMD的封装形式有：SOP(Small Outline Packages)羽翼形小外形塑料封装，其中包括SOICSmall Outline Integrated Circuits小外形集成电路，SSOICShrink Small Outline Integrated Circuits缩小型小外形集成电路，TSOPThin Small Outline Package薄型小外形封装；SOJ(Small Outline Integra

10、ted Circuits)，J形小外形塑料封装；PLCC(Plastic Leaded Chip Carriers)塑封J形引脚芯片载体；BGA(Ball Grid Array/Chip Scale Package)球形栅格阵列，根据材料和尺寸可分为六个类型：PBGAPlastic Ball Grid Array塑料封装BGA，CBGACeramic Ball Grid Array陶瓷封装BGA，CCGACeramic Column BGA陶瓷柱状封装BGA，TBGATape Ball Grid Array载带BGA，BGA微型BGA芯片级封装，FC-PBGAFlip Chip Plastic

11、 Ball Grid Array倒装芯片塑料封装BGA；CSP(Chip Scale Package)又称BGA；QFN(Quad Flat No-lead)四方形扁平无引线引线框架封装。9、设计规则由RF或控制人员预先给出需要设计PCB封装器件的DATASHEET至PCB封装设计人员，同时转给原理图封装设计人员同步设计原理图封装，同步设计完成后需统一其命名方式，即PCB封装的命名与原理图封装载入PCB设计时的封装命名一致，否则无法导入PCB设计。设计PCB时，必须使用我司标准的PCB封装库，不得自己创立PCB封装库。PCB封装库在不同的工程设计里同种类型器件必须使用同种类型的PCB封装库，保

12、证PCB封装库的唯一性与统一性，从而提高设计的正确率。非标准且无明显方向性的PCB封装有输入输出要求的必须在相应管脚增加输入IN输出(OUT)标识，有极性的器件PCB封装必须增加极性标识；标准且有方向性的PCB封装必须给出1Pin标识。有引脚序号标识的器件按DATASHEET标明PCB封装焊盘的引脚顺号，DATASHEET引脚序号标识模糊不清或根本没有标识引脚序号的按IC管脚焊盘序号来标识，即逆时针顺序标识。同一个PCB封装里不能有一样的引脚序号出现。PCB封装保存时封装信息包含PCB封装“命名，该封装“高度等，如有其他的可增加“描述等。属IPC标准封装的参考IPC标准封装来设计PCB封装库；

13、除IPC标准封装以外，DATASHEET有推荐封装的采用推荐封装设计PCB封装，特殊情况除外；非标准封装采用我司规定的标准来设计PCB封装。所有封装均用PAD设计焊盘；用PAD或keepout层设计定位孔；丝印与PADS的距离10mil。设计PCB封装外形丝印要求其自身的最大尺寸，IC除外。设计IC PCB封装自动生成的PAD上有过孔VIA时，其过孔的内径为0.25mm，外径为1520mil。10、PCB封装设计命名方式属于规则封装命名方式的统一用IPC的封装命名。属于不规则的单一的命名统一用其型号的全称命名。设计人员完成PCB封装设计后，要及时与原理图封装设计同步。11、PCB封装放置入库方

14、式目前我司PCB封装库分类有：标识.lib，SMA .lib，电位器.lib，电感.lib，电容.lib，晶体管.lib，电源.lib，开关.lib，插件.lib，微波.lib，功放管.lib，芯片.lib，时钟.lib等等，设计人员根据DATASHEET所属类型自行判断放置入库，如分类不够或不全可适当增减种类，其中设计人员可设计一个“新器件.lib类别以放置待评审类型或有疑问的PCB封装。PCB封装放置入库时以它封装本身的1pin中心或器件本身中心点为原点放置。12、封装设计分类电阻电容，晶体管，集成电路IC，功放管，隔离器与环形器，耦合器，接插件等，分为标准类与非标准类。12.1、矩形元件

15、标准类贴片电阻封装实际尺寸：图12.1 贴片电阻封装实际尺寸表12.1贴片电阻封装实际尺寸mm(in)ponentidentifierLSWTHminma*minma*minma*minma*ma*100504021.001.100.400.700.480.600.100.300.40160806031.501.700.701.110.700.950.150.400.60201208051.852.150.551.321.101.400.150.650.65321612063.053.351.552.321.451.750.250.750.71322512103.053.351.552.322

16、.342.640.250.750.71502520104.855.153.153.922.352.650.350.850.71633225126.156.454.455.223.053.350.350.850.71贴片电阻封装推荐尺寸：图12.2贴片电阻封装推荐尺寸表12.2贴片电阻封装推荐尺寸RLP No.ponent Identifiermm(in)Z(mm)G(mm)*(mm)Y(mm)C(mm)Placementgridrefref100A100504022.200.400.700.901.302*6101A160806032.800.601.001.101.704*6102A2012

17、08053.200.601.501.301.904*8103A321612064.401.201.801.602.804*10104A322512104.401.202.701.602.806*10105A502520106.202.602.701.804.406*14106A633225127.403.803.201.805.608*16贴片电容封装实际尺寸：图12.3 贴片电容封装实际尺寸表12.3 贴片电容封装实际尺寸ponent Identifiermm(in)LSWTHminma*minma*minma*minma*ma*100504020.901.100.300.650.400.6

18、00.100.300.60131005041.021.320.260.720.771.270.130.381.02160806031.451.750.450.970.650.950.200.500.85201208051.802.200.301.111.051.450.250.751.10321612063.003.401.502.311.401.800.250.751.35322512103.003.401.502.312.302.700.250.751.35453218124.204.802.303.463.003.400.250.951.35456418254.204.802.303.4

19、66.006.800.250.951.10贴片电容封装推荐尺寸：图12.4 贴片电容封装实际尺寸表12.4 贴片电容封装实际尺寸RLP No.ponent Identifiermm(in)Z(mm)G(mm)*(mm)Y(mm)C(mm)Placementgridrefref130A1005(0402)2.200.400.700.901.302*6131A1310(0504)2.400.401.301.001.404*6132A1608(0603)2.800.601.001.101.704*6133A2012(0805)3.200.601.501.301.904*8134A3216(1206)

20、4.401.201.801.602.804*10135A3225(1210)4.401.202.701.602.806*10136A4532(1812)5.802.003.401.903.908*12137A4564(1825)5.802.006.801.903.9014*12贴片电感封装实际尺寸：图12.5 贴片电感封装实际尺寸表12.5 贴片电感封装实际尺寸ponentIdentifier(mm)L(mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minma*minma*minma*minma*minma*ma*ma*2012 chip1.702.301.101.

21、760.601.200.100.301.203216 chip2.903.501.902.631.301.900.200.501.904516 chip4.204.802.603.530.601.200.300.801.902825 prec.w/w2.202.800.901.621.952.112.102.540.370.652.290.073225 prec.w/w2.903.500.901.831.401.800.501.002.000.504532 prec.w/w4.204.802.203.133.003.400.501.002.800.505038 prec.w/w4.354.95

22、2.813.512.462.623.413.810.510.773.800.763225/3230 molded3.003.401.602.181.802.002.302.700.400.702.400.514035 molded3.814.320.811.601.201.502.923.181.201.502.671.274532 molded4.204.802.303.152.002.203.003.400.650.953.400.505650 molded5.305.503.304.323.804.204.705.300.501.005.801.008530 molded8.258.76

23、5.256.041.201.502.923.181.201.502.671.27贴片电感封装推荐尺寸：图12.6 贴片电感封装推荐尺寸表12.6贴片电感封装推荐尺寸RLP No.ponentIdentifier(mm)Z(mm)G(mm)*(mm)C(mm)Y(mm)Placementgridrefrfe1602012 chip3.001.001.002.001.004*81613216 chip4.201.801.603.001.206*101624516 chip5.802.601.004.201.604*121632825 Prec3.801.002.402.401.406*101643

24、225 Prec4.601.002.002.801.806*101654532 Prec5.802.203.604.001.808*141665038 Prec5.803.002.804.401.408*141673225/3230 Molded4.401.202.202.801.606*101684035 Molded5.401.001.403.202.208*121694532 Molded5.801.802.403.802.008*141705650 Molded6.803.204.005.001.8012*161718530 Molded9.805.001.407.402.408*22

25、钽电容封装实际尺寸：图12.7 钽电容封装实际尺寸图12.7 钽电容封装实际尺寸ponentIdentifier(mm)L(mm)S(mm)W1(mm)W2(mm)T(mm)H1(mm)H2(mm)minma*minma*minma*minma*minma*minma*32163.003.400.801.741.171.211.401.800.501.100.701.8035283.303.701.102.042.192.212.603.000.501.100.702.1060325.706.302.503.542.192.212.903.501.001.601.002.8073437.007

26、.603.804.842.392.414.004.601.001.601.003.10钽电容封装推荐尺寸：图12.8钽电容封装推荐尺寸表12.8钽电容封装推荐尺寸RLP No.ponentIdentifier(mm)Z(mm)G(mm)*(mm)Y(mm)C(mm)Placementgridrefref180A32164.800.801.202.002.806*12181A35285.001.002.202.003.008*12182A60327.602.402.202.605.008*18183A73439.003.802.402.606.4010*2012.2、圆形元件标准类贴片二极管封装

27、实际尺寸：图12.9 贴片二极管封装实际尺寸表12.9 贴片二极管封装实际尺寸ponentIdentifierMm(in)L(mm)S(mm)W(mm)T(mm)ponenttypeminma*minma*minma*minma*SOD-80/MLL343.303.702.202.651.601.700.410.55DiodeSOD-87/MLL414.805.203.804.252.442.540.360.50Diode2012(0805)1.902.101.161.441.351.450.230.370.10mw resistor3216(1206)3.003.401.862.311.75

28、1.850.430.570.25mw resistor3516(1406)3.303.702.162.611.551.650.430.570.12w resistor5923(2309)5.706.104.364.812.402.500.530.670.25w resistor贴片二极管封装推荐尺寸：图12.10 贴片二极管封装推荐尺寸表12.10 贴片二极管封装推荐尺寸RLP No.ponentIdentifierMm(in)Z(mm)G(mm)*(mm)Y(mm)C(mm)ABPlacementgridrefref200ASOD-80/MLL344.802.001.801.403.400.

29、500.506*12201ASOD-87/MLL416.303.402.601.454.850.500.506*14202A2012(0805)3.200.601.601.301.900.500.354*8203A3216(1206)4.401.202.001.602.800.500.556*10204A3516(1406)4.802.001.801.403.400.500.556*12205A5923(2309)7.204.202.601.505.700.500.656*1812.3、小外形晶体管SOT及二极管SOD标准类SOT23封装实际尺寸：图12.11 SOT23封装实际尺寸表12.1

30、1 SOT23封装实际尺寸ponentIdentifierL(mm)S(mm)W(mm)T(mm)H(mm)P(mm)minma*minma*minma*minma*ma*nomSOT232.302.601.101.470.360.460.450.601.100.95SOT23封装推荐尺寸：图12.12 SOT23封装推荐尺寸表12.12 SOT23封装推荐尺寸RLP No.ponentidentifierZ(mm)G(mm)*(mm)Y(mm)C(mm)E(mm)PlacementGirdrefrefref210SOT233.600.801.001.402.200.958*8SOT89封装实

31、际尺寸：图12.13 SOT89封装实际尺寸表12.13 SOT89封装实际尺寸ponentIdentifierL(mm)T(mm)W1(mm)W2(mm)W3(mm)K(mm)H(mm)P(mm)minma*minma*minma*minma*minma*minma*ma*nomSOT893.944.250.891.200.360.480.440.561.621.832.602.851.601.50SOT89封装推荐尺寸：图12.14 SOT89封装推荐尺寸表12.14 SOT89封装推荐尺寸RLP No.ponentIdentifierZ(mm)Y1(mm)*1(mm)*2(mm)*3(m

32、m)Y2(mm)Y3(mm)E(mm)Placementgridminma*minma*refrefnom215SOT895.401.400.800.801.001.802.002.404.601.5012*10SOD123封装实际尺寸：图12.15 SOD123封装实际尺寸表12.15 SOD123封装实际尺寸ponentIdentifierL(mm)S(mm)W1(mm)W2(mm)T(mm)Hminma*minma*minma*minma*minma*ma*SOD1233.553.852.352.930.450.651.401.700.250.601.35SMB5.215.592.173

33、.311.962.213.303.940.761.522.41SOD123封装推荐尺寸：图12.16 SOD123封装推荐尺寸表12.16 SOD123封装推荐尺寸RLP No.ponentIdentifierZ(mm)G(mm)*(mm)Y(mm)C(mm)Placementgridrefref220ASOD1235.001.800.801.603.404*12221ASMB6.802.002.402.404.408*16SOT143封装实际尺寸：图12.17 SOT143封装实际尺寸表12.17 SOT143封装实际尺寸ponentIdentifierL(mm)S(mm)W1(mm)W2(

34、mm)T(mm)P1(mm)P2(mm)H(mm)minma*minma*minma*minma*minma*nomnomma*SOT1432.102.641.001.690.370.460.760.890.250.551.921.721.20SOT143封装推荐尺寸：图12.18 SOT143封装推荐尺寸表12.18 SOT143封装推荐尺寸RLP NO.ponentIdentifierZ(mm)G(mm)*1(mm)*2(mm)CE1E2YPlacementgridminma*refnomnomref225SOT1433.600.801.001.001.202.201.901.701.40

35、8*8SOT223封装实际尺寸：图12.19 SOT223封装实际尺寸表12.19 SOT223封装实际尺寸ponentIdentifierL(mm)S(mm)W1(mm)W2(mm)T(mm)H(mm)P1(mm)P2(mm)minma*minma*minma*minma*minma*ma*nomnomSOT2236.707.304.104.920.600.882.903.180.901.301.802.304.60SOT223封装推荐尺寸：图12. 20 SOT223封装推荐尺寸表12. 20 SOT223封装推荐尺寸RLP No.ponentIdentifierZ(mm)G(mm)*1(

36、mm)*2(mm)Y(mm)C(mm)E1(mm)E2(mm)Placementgridminma*refrefnomnom230SOT2238.404.001.203.403.602.206.202.304.6018*14特殊晶体管DPAK：图12.21 特殊晶体管DPAK-1表12.21 特殊晶体管DPAK-1ponentIdentifierLW1W2T1T2P1P2Hminma*minma*minma*minma*minma*basicbasicMa*TS-003*9.3210.410.640.914.355.350.510.804.005.502.284.572.38TS-005*14

37、.6015.880.510.916.226.862.292.798.009.002.545.084.83TO36818.7019.101.151.4513.3013.602.402.7012.4012.705.4510.905.10图12.22 特殊晶体管DPAK-2表12.22 特殊晶体管DPAK-2RLP No.ponentIdentifierZ(mm)Y1Y2*1*2CPlacementGridref235ATS-003*11.201.606.201.005.407.3024*16236TS-005*16.603.409.601.006.8010.1036*24237TO26819.80

38、3.4013.401.4013.6011.4042*3412.4、集成电路IC标准类所有对称IC都需增加1pin标识。SOIC系列封装实际尺寸：图12.23 SOIC系列封装实际尺寸表12.23 SOIC系列封装实际尺寸ponentIdentifierJEDECL(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)Pminma*minma*minma*minma*minma*minma*minma*nomSO8MS-012AA5.806.203.264.550.330.510.401.273.804.004.805.001.351.751.27SO8W10.0010.657.4

39、68.850.330.510.401.277.407.605.055.452.352.651.27SO14MS-012AB5.806.203.264.550.330.510.401.273.804.008.558.751.351.751.27SO14W10.0010.657.468.850.330.510.401.277.407.608.809.202.352.65SO16MS-012AC5.806.203.264.550.330.510.401.273.804.009.8010.001.351.751.27SO16WMS-013AA10.0010.657.468.850.330.510.40

40、1.277.407.6010.1010.502.352.651.27SO20WMS-013AC10.0010.657.468.850.330.510.401.277.407.6012.6013.002.352.651.27SO24WMO-119AA10.2910.648.219.010.360.510.531.047.407.6015.5415.852.342.641.27SO24*MO-120AA11.8112.179.7310.540.360.510.531.048.769.0215.5415.852.342.641.27SO28WMO-119AB10.2910.648.219.010.3

41、60.510.531.047.407.6018.0818.392.342.641.27SO28*MO-120AB11.8112.179.7310.540.360.510.531.048.769.0218.0818.392.342.641.27SO32WMO-119AC10.2910.648.219.010.360.510.531.047.407.6020.6220.932.342.641.27SO32*MO-120AC11.8112.179.7310.540.360.510.531.048.769.0220.6220.932.342.641.27SO36WMO-119AD10.2910.648

42、.219.010.360.510.531.047.407.6023.1623.472.342.641.27SO36*MO-120AD11.8112.179.7310.540.360.510.531.048.769.0223.1623.472.342.641.27SOIC系列封装推荐尺寸：图12.24 SOIC系列封装推荐尺寸表12.24 SOIC系列封装推荐尺寸RLP No.ponentidentifierZ(mm)G(mm)*(mm)Y(mm)C(mm)D(mm)E(mm)PlacementgridrefRefrefref300ASO87.403.000.602.205.203.811.27

43、16*12301ASO8W11.407.000.602.209.203.811.2724*12302ASO147.403.000.602.205.207.621.2716*20303ASO14W11.407.000.602.209.207.621.2724*20304ASO167.403.000.602.205.208.891.2716*22305ASO16W11.407.000.602.209.208.891.2724*22306ASO20W11.407.000.602.209.2011.431.2724*28307ASO24W11.407.000.602.209.2013.971.2724

44、*32308ASO24*13.008.600.602.2010.8013.971.2728*32309ASO28W11.407.000.602.209.2016.511.2724*38310ASO28*13.008.600.602.2010.8016.511.2728*38311ASO32W11.407.000.602.209.2019.051.2724*44312ASO32*13.008.600.602.2010.8019.051.2728*44313ASO36W11.407.000.602.209.2021.591.2724*48314ASO36*13.008.600.602.2010.8

45、021.591.2728*48SOPIC系列封装实际尺寸：图12.25 SOPIC系列封装实际尺寸表12.25 SOPIC系列封装实际尺寸ponentidentifiertypeL(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)P(mm)minma*minma*minma*minma*minma*ma*ma*nomSOP6I5.726.993.725.110.350.510.601.003.924.726.351.501.27SOP8I5.726.993.725.110.350.510.601.003.924.726.351.501.27SOP10I5.726.993.72

46、5.110.350.510.601.003.924.728.891.501.27SOP12I5.726.993.725.110.350.510.601.003.924.728.891.501.27SOP14I5.726.993.725.110.350.510.601.003.924.7211.431.501.27SOP16II7.628.895.627.010.350.510.601.005.026.2211.432.001.27SOP18II7.628.895.627.010.350.510.601.005.026.2213.972.001.27SOP20II7.628.895.627.01

47、0.350.510.601.005.026.2213.972.001.27SOP22III9.5310.807.538.920.350.510.601.006.338.1316.512.501.27SOP24III9.5310.807.538.920.350.510.601.006.338.1316.512.501.27SOP28IV11.4312.709.4310.820.350.510.601.008.2310.0319.053.001.27SOP30IV11.4312.709.4310.820.350.510.601.008.2310.0321.593.001.27SOP32V13.34

48、14.6111.3412.730.350.510.601.0010.1411.9421.593.501.27SOP36V13.3414.6111.3412.730.350.510.601.0010.1411.9424.133.501.27SOP40VI15.2416.5113.2414.630.350.510.601.0012.0413.8427.944.001.27SOP42VI15.2416.5113.2414.630.350.510.601.0012.0413.8427.944.001.27SOPIC系列封装推荐尺寸：图12.27 SOPIC系列封装推荐尺寸表12.27 SOPIC系列封

49、装推荐尺寸RLP No.ponentidentifierZ(mm)G(mm)*(mm)Y(mm)C(mm)D(mm)E(mm)PlacementGridrefrefrefnom360ASOP67.403.000.602.205.202.541.2716*14361ASOP87.403.000.602.205.203.811.2716*14362ASOP107.403.000.602.205.205.081.2716*18363ASOP127.403.000.602.205.206.351.2716*18364ASOP147.403.000.602.205.207.621.2716*24365A

50、SOP169.405.000.602.207.208.891.2720*24366ASOP189.405.000.602.207.2010.161.2720*28367ASOP209.405.000.602.207.2011.431.2720*28368ASOP2211.206.800.602.209.0013.971.2724*34369ASOP2411.206.800.602.209.0013.971.2724*34370ASOP2813.208.800.602.2011.0016.511.2728*40371ASOP3013.208.800.602.2011.0017.781.2728*

51、44372ASOP3215.0010.600.602.2012.8019.051.2732*44373ASOP3615.0010.600.602.2012.8021.591.2732*50374ASOP4017.0012.600.602.2014.8024.131.2736*56375ASOP4217.0012.600.602.2014.8025.401.2736*56TSOP系列封装实际尺寸：图12. 28 TSOP系列封装实际尺寸表12. 28 TSOP系列封装实际尺寸ponentIdentifierPinCountL(mm)S(mm)W(mm)T(mm)A(mm)B(mm)H(mm)P(

52、mm)minma*minma*minma*minma*minma*minma*ma*nomTSOP6*141613.8014.2012.4012.980.200.400.400.705.806.2012.2012.601.270.65TSOP6*162415.8016.2014.4014.980.100.300.400.705.806.2014.2014.601.270.50TSOP6*182817.8018.2016.4016.780.050.220.400.705.806.2016.2016.601.270.40TSOP6*203619.8020.2018.4018.980.050.150

53、.400.705.806.2018.2018.601.270.30TSOP8*142413.8014.2012.4012.980.200.400.400.707.808.2012.2012.601.270.65TSOP8*163215.8016.2014.4014.980.100.300.400.707.808.2014.2014.601.270.50TSOP8*184017.8018.2016.4016.780.050.220.400.707.808.2016.2016.601.270.40TSOP8*205219.8020.2018.4018.980.050.150.400.707.808

54、.2018.2018.601.270.30TSOP10*142813.8014.2012.4012.980.200.400.400.709.8010.2012.2012.601.270.65TSOP10*164015.8016.2014.4014.980.100.300.400.709.8010.2014.2014.601.270.50TSOP10*184817.8018.2016.4016.780.050.220.400.709.8010.2016.2016.601.270.40TSOP10*206419.8020.2018.4018.980.050.150.400.709.8010.201

55、8.2018.601.270.30TSOP12*143613.8014.2012.4012.980.200.400.400.7011.8012.2012.2012.601.270.65TSOP12*164815.8016.2014.4014.980.100.300.400.7011.8012.2014.2014.601.270.50TSOP12*186017.8018.2016.4016.780.050.220.400.7011.8012.2016.2016.601.270.40TSOP12*207619.8020.2018.4018.980.050.150.400.7011.8012.201

56、8.2018.601.270.30TSOP系列封装推荐尺寸：图12.29 TSOP系列封装推荐尺寸表12.29 TSOP系列封装推荐尺寸RLP No.ponentIdentifierZ(mm)G(mm)*(mm)Y(mm)C(mm)D(mm)E(mm)PinCountPlacementGridrefrefrefnom390ATSOP6*1414.8011.600.401.6013.204.550.651614*32391ATSOP6*1616.8013.600.301.6015.205.500.502414*36392ATSOP6*1818.8015.600.251.6017.205.200.

57、402814*40393ATSOP6*2020.8017.600.171.6019.205.100.303614*44394ATSOP8*1414.8011.600.401.6013.207.150.652418*32395ATSOP8*1616.8013.600.301.6015.207.500.503218*36396ATSOP8*1818.8015.600.251.6017.207.600.404018*40397ATSOP8*2020.8017.600.171.6019.207.500.305218*44398ATSOP10*1414.8011.600.401.6013.208.450

58、.652822*32399ATSOP10*1616.8013.600.301.6015.209.500.504022*36400ATSOP10*1818.8015.600.251.6017.209.200.404822*40401ATSOP10*2020.8017.600.171.6019.209.300.306422*44402ATSOP12*1414.8011.600.401.6013.2011.050.653626*32403ATSOP12*1616.8013.600.301.6015.2011.500.504826*36404ATSOP12*1818.8015.600.251.6017

59、.2011.600.406026*40405ATSOP12*2020.8017.600.171.6019.2011.100.307626*44SOJ系列A封装实际尺寸：图12.30 SOJ系列A封装实际尺寸表12.30 SOJ系列A封装实际尺寸ponentIdentifierL(mm)S(mm)W(mm)T(mm)B(mm)H(mm)P(mm)minma*minma*minma*minma*minma*ma*nomSOJ14/3008.388.764.385.060.380.511.602.009.659.963.751.27SOJ16/3008.388.764.385.060.380.511

60、.602.0010.9211.233.751.27SOJ18/3008.388.764.385.060.380.511.602.0012.1912.503.751.27SOJ20/3008.388.764.385.060.380.511.602.0013.4613.773.751.27SOJ22/3008.388.764.385.060.380.511.602.0014.7315.043.751.27SOJ24/3008.388.764.385.060.380.511.602.0016.0016.313.751.27SOJ26/3008.388.764.385.060.380.511.602.