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1、Substrate Design Training Manual8/4/2003Prepared by Neo Zhang1SummaryChapter 1:About BGA Substrate (Introduction)What is a BGAWhat is a substrateHow to design a substrateChapter 2: Substrate Fabrication ProcessThe raw material of a substrateThe base Process flow of the substrate FabricationChapter 3
2、: Substrate Design Rule IntroduceWhy we need the design ruleHow to use the design rule (RND-AB07)Chapter 3-1: Substrate Material SpecHow to choose the material. (Core; P.P; S/R)The cross-section design of the substrate.Substrate Design Training Manual8/4/2003Prepared by Neo Zhang2SummaryChapter 3-2:
3、 Wire Bonding SPECHow to layout the wire bonding (Fingers;GND/PWR rings)How to choose the wire diameter.Chapter 3-3: Substrate Fabrication SPECHow to choose the drill sizeThe Pitch and Space of the traceChapter 3-4: The base electrical concern in substrate layoutThe material of the H/S packageHow to
4、 reduce the noise in BGA packageChapter 4: The flow of substrate designWhat information we need to do a substrate designThe basic design flow Why we need confirm the Gerber form the substrate vender. Substrate Design Training Manual8/4/2003Prepared by Neo Zhang3SummaryChapter 5: How to use the APDHo
5、w to setup the design rule in APDHow to Setup the optionsHow to setup the cross-sectionHow to create a customer dieHow to create a BGAHow to input the Net-listHow to set the DRC checkHow to do the Auto W/BHow to align the fingers layoutHow to create the PWR/GND ringsHow to arrange the viasHow to smo
6、oth the traces Substrate Design Training Manual8/4/2003Prepared by Neo Zhang4SummaryHow to create the teardropsHow to setup the design rule in APDHow to run DRC checkHow to verify the design after the layoutChapter 6: Post designHow to create the GerberHow to check the GerberMake out the Fabrication
7、 Spec Chapter 7: CustomerHow to create substrate approved formWhy we need customer approve before we release it to Fabrication? How to do get the approve.Substrate Design Training Manual8/4/2003Prepared by Neo Zhang5SummaryChapter 8: Substrate SupplierWhat information we need to provide.How to confi
8、rm the Gerber from the suppliersHow to confirm the Fab Spec from the suppliers Chapter 9: Drawing Management How to submit you drawingGAPT coding method What information should be backup in RND serverChapter 10: OthersEveryone should complete a TFBGA 10 x10 2 layer substrate designSandy & David
9、should complete a PBGA 35x35 4 layer substrate designSandy & Sophia should know how to check the substrate design and how to confirm the suppliers Gerber.David should know how to complete a QFP design.Substrate Design Training Manual8/4/2003Prepared by Neo Zhang6Chapter 1About BGA Substrate (Int
10、roduction)We need to know:What is a BGAWhat is a substrateHow to design a substrateSubstrate Design Training Manual8/4/2003Prepared by Neo Zhang7BGA: Ball Grid Array (球栅阵列封装)PBGAFBGATBGAFCCSPSuper BGACBGAChapter 1Substrate Design Training Manual8/4/2003Prepared by Neo Zhang8SIPOther substrate type p
11、roductMMCLeadless Chip Carrier (LCC)Chapter 1Substrate Design Training Manual8/4/2003Prepared by Neo Zhang9What is a substrateSubstrate Substrate 是是BGA,PGA BGA,PGA 等封装中所用到的一种载体;目的是为了等封装中所用到的一种载体;目的是为了提供:提供:1.1.一种信号的通路;一种信号的通路;2.2.对芯片提供支撑;对芯片提供支撑;3.3.散热的途径散热的途径Chapter 1Substrate Design Training Manua
12、l8/4/2003Prepared by Neo Zhang10How to do a good designChapter 1Tool (Design Software)Persons with ability Good DesignDesign RuleDesign DatabaseSubstrate Design Training Manual8/4/2003Prepared by Neo Zhang11How to get a good BGA package Chapter 1EquipmentsPersons with ability A successful productA D
13、ependable Substrate VenderDesign DatabaseSubstrate Design Training Manual8/4/2003Prepared by Neo Zhang12Chapter 2Substrate Fabrication ProcessWe need to know:The raw material of a substrateThe base Process flow of the substrate FabricationSubstrate Design Training Manual8/4/2003Prepared by Neo Zhang
14、13Substrate Substrate 的制造工艺的制造工艺(硬板(硬板4 4layerlayer)双面覆铜板贴干膜曝光显影蚀刻去菲林Chapter 2Substrate Design Training Manual8/4/2003Prepared by Neo Zhang14Substrate Substrate 的制造工艺的制造工艺( (硬板硬板4 4layerlayer)层压钻孔镀通孔塞孔贴干膜曝光Chapter 2Substrate Design Training Manual8/4/2003Prepared by Neo Zhang15Substrate Substrate 的制
15、造工艺的制造工艺( (硬板硬板4 4layerlayer)显影蚀刻去菲林印绿油曝光绿油显影Chapter 2Substrate Design Training Manual8/4/2003Prepared by Neo Zhang16Substrate Substrate 的制造工艺的制造工艺(硬板(硬板4 4layerlayer)电镀镍金成型Chapter 2Note: Its only a typical flow. Since substrate fabrication is very complex. There are many different process in each s
16、ubstrate Fab.Substrate Design Training Manual8/4/2003Prepared by Neo Zhang17The raw material of a substrateChapter 2双面覆铜板1.BT core: 芯板厚度Core Thickness (mm)芯板覆铜层厚度Copper Clad (um)材料名称Material Name*0.0612/12HL832HS*0.0812/12HL832HS0.1012/12HL832HS or HL832*0.1018/18HL8320.1512/12HL832HS or HL8320.1518
17、/18HL8320.1535/35HL8320.212/12HL832*0.218/18HL832*0.412/12HL832注:*表示GAPT不建议使用之材料Note: These materials are not suggested which marked with a “*”Substrate Design Training Manual8/4/2003Prepared by Neo Zhang18Chapter 2层压2.P.P. (Prepreg)半固化片厚度Core Thickness (mm)铜层厚度Copper Foil(um)材料名称Material Name*0.041
18、2CCL-GHPL8300.0612CCL-GHPL8300.1112CCL-GHPL8300.1312CCL-GHPL830注:*表示GAPT不建议使用之材料Note: These materials are not suggested which marked with a “*”注:注:1.BT:1.BT:是三菱瓦斯公司的一种材料牌号!是三菱瓦斯公司的一种材料牌号!2.2.除了三菱瓦斯公司除了三菱瓦斯公司BTBT系列外,还有诸如系列外,还有诸如HitachiHitachi公司的公司的E679E679系列,也是系列,也是PBGAPBGA封装常封装常用的树脂材料。用的树脂材料。Substrate Design Training Manual8/4/2003Prepared by Neo Zhang19Chapter 23.Solder Mask印绿油AUS5TaiyoNormalAUS303TaiyoLead freeS/R Ink NameCompanyAUS308TaiyoHalogen free在在Solder MaskSolder Mask(绿油)的选用上,一般以绿油)的选用上,一般以TaiyoTaiyo公司的公司的PSR4000PSR4000系列为主
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