移动电源用贴片电感参数及封装尺寸_图文

1、 Modify ResumeDate modified Modify DetailsVersion No.2012-04-07 File formulation A 2012-5-14 Revise the temperature of relow soldering A-12012-8-24 偠乍Reliability Testing ItemsLow Temperat ure 偠乍 Reliability Testing ItemsStatic HumidityA-2Content1c 1 Dimension & Picture2c 1 Product Spec. Model3c

2、2 Electrical Characteristics List4c3-4 Reliability T esting Items5c 5 Packaging6c 6 Recommend Soldering Conditions7c 7 Cleaning8c 7 Storage Requirements9c 8 Environmental Protection Information10c 8 Notes11c 9 Samples feedback list Version Number A-2Page1/9 'LPHQVLRQ 3LFWXUH Unitmm Series A B C

3、E F G PIO31 3.5±0.3 3.0±0.3 1.6±0.3 1.6±0.3 0.8±0.1 3.5±0.3 PIO32 3.5±0.3 3.0±0.3 2.1±0.3 1.6±0.3 0.8±0.1 3.5±0.3 PIO42 4.5±0.3 4.0±0.3 2.15±0.3 1.75±0.3 1.5±0.1 4.5±0.3 PIO43 4.5±0.3 4.0±0.3 3.2±

4、;0.3 1.75±0.3 1.5±0.1 4.5±0.3 PIO52 5.8±0.3 5.2±0.3 2.1±0.3 2.15±0.3 1.7±0.1 5.5±0.3 PIO53 5.8±0.3 5.2±0.3 3.0±0.3 2.15±0.3 1.7±0.1 5.5±0.3 PIO54 5.8±0.3 5.2±0.3 4.5±0.3 2.15±0.3 1.7±0.1 5.5±0.3P

5、IO73 7.8±0.3 7.0±0.3 3.5±0.3 3.0±0.3 2.0±0.2 7.5±0.3PIO75 7.8±0.3 7.0±0.3 5.0±0.3 3.0±0.3 2.0±0.2 7.5±0.3PIO104 10.0±0.3 9.0±0.3 4.0±0.3 3.75±0.3 3.0±0.2 9.5±0.3PIO105 10.0±0.3 9.0±0.3 5.4±0.3 3.

6、75±0.3 3.0±0.2 9.5±0.32 Product Spec. Model 3 Electrical Characteristics List Part NO. Inductance &T olerance(H乥T est Freq.(kHzT est Vol.(VDC Resistance Max( 乱 Rated DCCurrent(APIO54-4R7MT 4.7±20% 100 0.5 0.040 2.3 7(67 (48 +3 % +3 % &+乱 The rated DC current is that which

7、 cause a 10% inductance reduction from the initial value or inductorsurface temperature to rise by 40, whichever is smaller. ( Reference ambient temperature 204 Reliability Testing ItemsNO.ItemsRequirementsT est Methods and Remarks1Operating T emperatureRange-40l+85 Including self-heating temperatur

8、erise.2Resistance to SolderingHeat ±10% dNo visible mechanical damage.Inductance change: Within ±10%260±5 96.5Sn/3.0Ag/0.5Cu10±1 dDip pads in flux and dip in solderpot (96.5Sn/3.0Ag/0.5Cu at260±5 for 10±1 seconds.3Solderability 90% d90% or more of electrode area shallbe

9、 coated by new solder.245±5 96.5Sn/3.0Ag/0.5Cu5±1 dDip pads in flux and dip in solderpot (96.5Sn/3.0Ag/0.5Cu at245±5 for5±1 seconds.4Insulation Resistance100M 100V 60100V DC between inductor coil andcore for 60 seconds.5( Component Adhesion(Push test2.0kgf 260±520±5sec

10、0.3mm 2.0kgf10sec dInductors shall be subjected to260±5 for 20±5sec Soldering inthe base whit 0.3mm solder. Andthen aplomb electrode way plus tax2.0kgf for ten seconds.6Over Loadingc c ±10% d1. There shall be no casedeformation or change inappearance.2. Inductance change: Within ±

11、;10% 2 ±2%,5dApply twice as rated current forfive minutes between inductorterminals, direct current error ±2%.Version NumberA-2Page4/94 Reliability Testing ItemsNO.ItemsRequirementsT est Methods and Remarks 7Mechanical Shock c dNo evidence of terminal peel off andwire broken. 1.0mm , 15cm

12、, 1.4Kg , 0.5m (X,Y ,Z Inductors shall be Soldering on the PCB with 1.0mm thick and fixed them in a 15cm big.,1.4Kg weight cube with brass base, let it nature fallenform 0.5m height (X,Y ,Z three axes8T emperature Change 1. 2. ±10d1. There shall be no case deformationor change in appearance.2.

13、Inductance shall not change morethan ±10%.+85 60 -40 60 5 d +85 60minutes -40 60minutes 5Cycles Inductors are to be tested after 1 hour at roomtemperature.9HighT emperature 1. 2. ±10d 1. There shall be no case deformation or change in appearance. 2. Inductance shall not change more than &#

14、177;10%. +85±5 96±2 1 dInductors shall be subjected to+85±5for 96±2 hours.Inductors are to be tested after one hour at roomtemperature. 10 LowT emperature 1. 2. ±10d1. There shall be no case deformation or change in appearance.2. Inductance shall not change morethan ±10

15、%. -40±2 96±2 1 dInductors shall be subjected to -40±2for 96±2 hours.Inductors are to be tested after one hour at room temperature.11 Static Humidity 1. 2. ±10d1. There shall be no case deformation or change in appearance.2. Inductance shall not change more than ±10%. 9

16、095%, 60±2 100 1 d Inductors shall be subjected to 9095% R.H. at 60±2 for 100 hours .Inductors are to be tested after having air dried for one hours.12Life1. 2. ±10d1. There shall be no case deformation or change in appearance.2. Inductance shall not change more than ±10%. 85

17、7;2 1000 d 4 d Inductors shall be store at 85±2 for 1000 hours with rated current applied.Inductors shall be tested after four hours at room temperature.5 Packaging1 Reel packing diagram 2 Peeling requiredèF 2 l 100g é 300mm/min±10%ê 165°l 180°d F force 20 100g Pee

18、ling speed 300mm/min±10%Peeling angle 165° 180°. 2 Packing quantityPart NO.REEL (PCSBOX(PCSMedium Carton PCS Size: 35.8*35.8*20cm Large Carton PCS Size: 35.8*35.8*29.5cm PIO31 3000 12000 24000 36000 PIO32 3000 12000 24000 36000 PIO42 2000 8000 16000 24000 PIO43 2000 8000 16000 24000 P

19、IO52 1500 6000 12000 18000 PIO53 1500 6000 12000 18000 PIO54 1500 6000 12000 18000 PIO73 1200 3600 7200 10800 PIO75 1000 3000 6000 9000 PIO104 750 1500 3000 4500 PIO105 750 1500300045006 Recommend Soldering Conditions dApplicable soldering process to the products is reflow soldering.1 S oldering Mat

20、erials Sn-3.0Ag-0.5Cu 0.2wt% d -3.0Ag-0.5CuSolder: SnFlux: Use rosin-based flux, but not strongly acidic flux (with chlorine exceeding 0.2 wt%. Do not use water-soluble flux.2 Soldering Profile Reflow Soldering Profile Soldering Iron150 1 è 350é 30Wê 1.0mmë <3 Reworking with S

21、odering Iron must preheating at 150 for 1 minute is required, and do not directly touch the core with the tip of the soldering iron. The reworking soldering conditions are as follows:T emperature of soldering iron tip: 350;Soldering iron power output: 30W max.Diameter of soldering iron end: 1.0mm ma

22、x.Soldering time: within 3 sec. 7 Cleaning 60 40 20 W/L 5 28l40kHz PCB dThe following conditions should be observed when cleaning the products:(40 max. for alcohol cleaning agentsmperature: 60 max.Cleaning T eUltrasonicOutput: 20 W/L max.Duration: 5 min max.Frequency: 28 to 40kHzCare should be taken

23、 not to cause resonance of the PCB and mounted products.8 Storage Requirements1 S torage Period 6 d 6 dT o maintain the solderability of terminal electrodes and to keep the packing material in good condition, product should be used within 6 months from the time of delivery. And the solderability of

24、products electrodes may decrease as time passes, so in case of storage over 6 months, slderability shall be checked before actual usage.2 S torage Conditions : -10 +40 : 3070%RH d d d c d c d Store products in a warehouse in compliance with the following condition:3070%RHT emperature: -10 to +40Humi

25、dity: Do not subject products to rapid changes in temperature and humidity.Do not store the products in chemical atmosphere such as one containing sulfurous acid gas or alkaline gas, that will causes poor solderability and corrosion of inductors.Do not store products in bulk packaging to prevent col

26、lision among inductors which causes core chipping and wire breakage. Store products on pallets to protect from humidity, dust, etc.irect sunlight, etc.Avoid heat shock, vibration, d9 Environmental Protection InformationRoHS RoHS dResponse to RoHS directiveOur products are RoHS compliance.10 Notes1 A

27、V c OA c c d2 d3 d4 5 6 d1Our products are designed and promoted for use in general enectronic devices such asaudio-equipment, office automation equipment, home electic appliance and information service.2In case of using the product for the purpose other than general electronics devices, we shallnot

28、 be held liable for any dysfunctions in or damage to the equipment with which the product is used.3Our specification limits the quality of the component as a single unit. Please ensure thecomponent is thoroughly evaluated in your application circuit.4Do not apply excessive vibration or mechanical shock to products.5Do not touch wire with sharp objects such as tweezers to prevent wire breakage.6Do not apply excessive stress to products mounted on boa