FPC_专业辞汇中英文对照

1、FPC名词中英对照1 .目的通过对行业标准的FPC工程名词引用及我司标准的整合,旨在为我司FPC名词的中英用语实现利用上的统一化2 .适用范围标准FPC相关工程上显现之不良工程,生产利用之材料、设备、治具和靠得住性实验等中英文名词3 .概念无类别一：FPC不良工程名词工程类别不良名称中义英 文导线VisualInspectionofConductors导线Conductors开路Open短路Short缺口Nicks针孔Pinholes额外铜刺Extraneous Copper Between Conductors毛刺Spurs结瘤Nodules蚀刻凹痕Etched Concave导线分层Con

2、ductor Delamination裂纹Cracks导线划痕Scratches on Conductor凹坑Dents变色Discoloration基底薄膜凹坑DentsVisualInspectionof划痕Scratches on Base FilmBase Film覆盖层和覆盖涂层凹坑Dents on Coverlay and CovercoatVisual划痕Scratches on Coverlay and CovercoatInspectionof空洞VoidCoverlayand偏位Coverlay MisalignCovercoat毛刺Coverlay Burrs导电性异物C

3、onductive Foreign Matters非电性异物Non-conductive Foreign Matters外来物起泡和分层Blistering and DelaminationForeign Matters覆盖层粘结剂挤出Squeeze-out of Adhesive of Coverlay覆盖涂层渗出Ooze-out of Covercoat覆盖涂层跳漏Skipping of Convercoat电镀金属或焊锡的外表条件Surface镀金Gold PlatingConditionofPlated Mentaland Solder镀金层缺陷Gold Plating Defects

4、镀锡Tin Plating电镀金属或焊料的渗透Penetration of Plated Metal or Solder变暗变黑DarkenedAppearance(BlackeningDiscoloration)镀铜孔内镀层空洞Plating Voids in Plated-though Hole镀金粗糙Rough Gold镀金白雾Gold Discoloration镀金变色Gold Discoloration镀金层龟裂Gold Crack镀金针孔Gold Pinhole电镀露铜Plated Expose Wetting剥离Plated Peeled Off电镀渗入Plated Wickin

5、g漏镀No Plating外表伤痕Plating Scratch电镀粗糙Rough Plated药水渗入Wicking外形和孔边缘VisualInspectionofEdgesof撕裂和缺口Tears and Nicks毛刺Burrs丝状毛刺Thready Burrs弯曲、变形WarpageOutlineandHoles微连筋不良Poor Micro-joint外形偏移Outline Misalign外形漏冲No Outline反折偏位Bending Line Misalign增强板VisualImperfectionsRelatedtoStiffenerBondingFPC与增强板之间的外来

6、物Foreign Matter Between Flexible PrintedBoard and StiffenerFPC与增强板之间的空洞Voids Between Flexible Printed Board andStiffener裂纹Cracks缺角Chip-off划痕Scratches义形Deformation外表附着物Affixed Substances on the Surface增强板贴偏移Stiffener Misalign热固胶Thermosetting Adhesive焊剂残渣Flux Residues金属粉末残渣Residue of Metal Powders粘结剂残

7、渣Residue of Adhesive突起Protrusions凹坑Dents弓曲Bow扭曲Twist标记 Marking尺寸检验Dimensional Inspections尺寸测量Measurement of Dimensions外部尺寸External Dimensions厚度Thickness孔Holes元件孔Component Holes导通孔Via Holes导通孔偏移Via Hole Misalign安装孔Mounting Holes导线宽度Conductor Widths导线之间的间距Clearances Between Conductors孔中央间距Distance Bet

8、ween Hole Centers板边和导线之间的最小距离Minimum Distance Between Board Edges andConductors标记错误Wrong Marking字符/、清楚Unclear Letter定位精度PositionalAccuracy孔的定位精度Positional Accuracy of Holes孔与焊盘的重合性Registration of Hole to Land覆盖层与焊盘的重合性Registration of Coverlay (or Covercoat) toLand增强板与FPC的重合性Registration ofStiffener

9、to FPC孔的重合性Registration of Holes外形的重合性Registration of Outlines冲外形与导线图形的重合性Registration of Punched Outline to ConductorPatterns压敏胶或热固胶与FPC和增强板的重合性Registration of Pressure Sensitive or HeatActivated Adhesives to FPC and Stiffener镀通孔的镀铜层厚度Plating Thickness of Copper Panted-throughHoles其它Other短装Shortage

10、混装Mixed Stowage/Packing离型纸脱落Released Paper Peeled off材料错误Wrong Material类别二：PFC工程用语工程类别中 文英 文板Board Type单面板Single Sided Flex Circuits单面双接触Double Access or Back-bared Flex Circuits双面板Double Sided Flex Circuits软硬结合板Rigid-flex Circuits模具Die模具图纸Die Drawing量产模具Mass Production Die样品模具Prototype Die钢模Steel D

11、ie刀模Die上模Top Die下模Bottom Die线切割Wire Cut外形模具Outline Cut保护膜模具Coverlay Die胶纸模具Pressure Sensitive Adhesive Die补强模具Stiffener Die银浆模具Silver Die导柱Post冲头Punch分割刀模Cutting Steel Rule Die销钉Pin治具Jig( Fixture)贴合治具Lamination Jig电测治具Electrical Check Jig假贴治具Tacking Jig曝光治具Exposure Jig丝印网框Screen Printing Frame孔Hole曝

12、光定位孔Guide Hole for Exposure模具定位孔Guide Hole for Die假贴定位孔Guide Hole for Tacking贴合定位孔Guide Hole for Adhesive电测定位孔Guide Hole for Electrical Test丝印定位孔Guide Hole for Screen Printing孔环Lifted Land渗锡孔Stannize Hole装配孔Fitting Hole制程ManufactureProcedure下料Material Preparation钻孔Drilling镀铜Copper Plating化学铜EleEletc

13、roless Plating Copper贴干膜Sensitive Dry Film丝印阻焊油墨Liquid Photosensitive SoldermaskExposure显影Developing蚀刻Etching脱膜Stripping贴保护膜Tacking Coverlay粗化Abrade层压Lamination固化烘烤Curing黑孔Black Hole外表处理Surface Treatment循环水洗Cascade Rinse微蚀Micro-etch酸洗Acid Cleaning水洗Water Cleaning防锈处理Anti-corrosion Treatment前处理Pre-tr

14、eatment刷板Brushing枯燥Dry up电镀金、锡、锲(Gold、Solder > Nickel) Plating闪镀(Gold ) Flash Plating/Strike Plating局部电镀Pattern Plate化学锲金Immersion Gold有机保焊膜Organic Solderability Preservatives (OSP)丝印字符Printing of Legend贴补强板Back Board Lamination电性能测试Electrical Inspection贴胶纸Double Faced Adhesive Tape打孔Punching雷射切割

15、Laser Cut自动光学检验Automatic Optical Inspection(AOI )外表贴装Surface Mounting Technology(SMT)外形冲切Punching冲孔Punching外观检查Final Inspection目视检查Visual Inspection (Final Inspection)线路显微镜检验镜检Conductor Microscope Inspection性能测试Reliability Test包装Packing原材料Material铜箔Copper Foil (CU)电解铜Electro-deposited Copper Foil (E

16、D)压延铜Rolled Annealed Copper Foil (RA)保护膜Coverlay (CVL)基材Base Material挠性覆铜板Flexible Copper Clad Laminate (FCCL)无胶基材Adhesiveless FCCL粘接剂胶Adhesives (Ad)压克力Acrylic顶层补强Top Stiffener底层补强Bottom Stiffener顶层银浆膜Top Silver Paste底层银浆膜Bottom Silver Paste银浆油墨Sliver Ink顶层线路Top Circuits/Conductors底层线路Bottom Circuit

17、s/Conductors半固化片Bonding Film (BOD)聚酰亚胺Polyimide(PI)聚酯Polyester Film (PET)钢片Sheet Steel玻璃纤维布Woven Glass ClothFR4补强板Fiberboard液态感光油墨Liquid Photoimageable Resist Ink压敏胶Pressure Sensitive Adhesive(PSA)离型膜Release Paper导电胶Conducting Resin导电布Electric Fabric泡棉Foam导向导电胶Anisotropic Conductive Film(ACF)导电泡棉Con

18、ductive/Electric Foam屏敝膜Shield Film金属薄膜开关Metal Dome (DOME)连接器Connector电容Capacitance ( C )电阻Resistance ( R )集成电路Integrated Circuit(IC)二极管Diode (D)静电Electro-Static Discharge (ESD)机械方向Machine Direction(MD)垂直方向Transverse Direction(TD)进刀Feed进刀量Chip Load转速Speed其它焊接SolderingOthers手工焊接Hand Soldering波焊Wave S

19、oldering品质允收标准Acceptable Quality Level ( AQL)菲林Film字符Legend烘箱Oven温度Temperature湿度Humidity速度Speed压力Pressure喷淋压力Spouting Pressure浓度Concentration原理图纸Schematic Diagram线宽Line Space线距Line Width线路间距Pitch类别三：FPC靠得住性测试工程中文英文电气性能Testing of Electrical Performance导线电阻Conductor Resistance外表层绝缘电阻Surface Insulation Resistance (SIR)外表介质层耐电压强度Dielectric Withstanding Voltage of Surface Layers机械性能测试Testing of Mechanical Property剥离强度Peel Strength孔和焊垫的拉脱强度Pull-out Strength for