VALOR基本操作步骤

1、VALOR基本操作指南基本操作指南LDC SIM Layout周先進/黃亞坽2021/12/232VALOR基本操作指南基本操作指南請選擇學習內容請選擇學習內容2021/12/233操作前准備操作前准備一、首先連接server,獲得license.具體操作如下：1.在我的電腦單擊右鍵出現如下界面2.單擊連線網路磁蝶機2021/12/2343.進入此界面後此處可任意選這一個盤符此處輸入8enterprise注意：如果server改變，上述也需相應改變。單擊2021/12/2354.進入此界面後輸入帳號：administrator輸入密碼ling!21967注意：如果此前有連接

2、的，直接在 我的電腦雙擊相應盤符，輸入密碼就OK。2021/12/2365.進入此界面就表示連接成功。2021/12/2371.打開需要check的board file2.單擊fileexportodb+如沒有，需要安裝。安裝程序上述server器F:.genesis下。暫時只介紹一種方法2021/12/2383.直至出現此界面，一般默認設置。Boradfile path輸出檔案path輸出檔案名稱只勾選此項單擊此項2021/12/239單擊出現如下對話框舊零件選擇place bound新零件選assembly主要是方便下面做dfm check勾選則刪除生成的.out檔案其余設置默認4.單擊此

3、項2021/12/23105.單擊此項2021/12/23116.直至出現此信息，表示完成。單擊此處返回2021/12/2312OPEN AND SHORT CHECK2021/12/23131.進入valor輸入ID:valor輸入PSSWORD:valor小寫2021/12/23142.出現此界面表示成功進入2021/12/23153.依次選擇：檔案匯入ODB+2021/12/2316一般選jobdb表示數據存放在自己電腦上。選擇上述生成ODB文檔路徑為此文件命名4.單擊OK注意文件名不能用大寫字母2021/12/23175. 找到此文檔並雙擊2021/12/23186.雙擊此文檔2021

4、/12/23197.雙擊此文檔8.打開後再雙擊PCB文檔2021/12/23209.進入此工作界面(僅介紹常用工具）相關層面單擊鼠標右鍵上下左右移動視圖快捷鍵放大縮小快捷鍵page upPage down10. 單擊Netlist分析2021/12/232111.出現此界面單擊compare2021/12/2322Open兩個Short一個單擊可分別打開2021/12/2323單擊short出現選這net tdogx2出現單擊分析2021/12/2324tdojx2tdi5535tdojx2tdi5535上述兩根net短路，在valor中編號為net00396對應各層面對應各層面同時可結合pa

5、ge up page down等快捷鍵2021/12/2325單擊brolen出現選這net gnd出現單擊分析2021/12/2326Net gnd 開路對應valor中，open的net編號為00001 net00002此為boardfile對應坐標，單位inch。單擊此處可查更多信息2021/12/2327總結：open or short check 基本操作步驟已經介紹完，但還需大家平時多加練習和操作。Open or short情況比較多，比較復雜，但又非常重要，大家分析時，一般要結合boradfile仔細分析，一一排除。找到其根本原因，將其徹底根治掉。注意：可按F1鍵獲得幫助信息。單

6、擊此處返回2021/12/2328DFM CHECK2021/12/2329接上述介紹第20頁2021/12/2330依次選擇78654321服務器盤符此部操作的目的，主要對valor裡的零件進行細分類。方便後面做check。2021/12/2331開始做DFM CHECK依次選擇123451768接 2接 22021/12/23321312任選一個111092021/12/2333分別出現分別出現此處統一選foxconn需檢查就勾選細項設定(一般默認具體信息請按F1)一般帶一般帶 是需要重點注意的項目是需要重點注意的項目2021/12/2334Assembly Analysis - Part

7、ial ListComponent Analysis1.Comp Pitch (Summary) 2.Comp Height (Summary) 3.Comp Rotation (Summary) 4.Comp Spacing (Spacing) 5.Comp to Toeprint (Spacing) 6.Other Side Area Keepout (Spacing) 7.Other Side Pins Keepout (Spacing) 8.Rout Spacing (Low Comp) (Rout) 9.Rout Spacing (High Comp) (Rout) 10.SMT C

8、omponent To Conveyed Edge (Primary) (Rout) 11.SMT Component To Conveyed Edge (Secondary) (Rout) 12.Component to Conveyed Edge (Rout) 13.Comp Touch Silkscreen (Silkscreen) 14.Comp. to Reference Designator (Silkscreen)15.Comp. Without Reference Designator (Silkscreen) 16.Carrier Wall Spacing (Comp ) 1

9、7.Carrier Wall Spacing (Wall) (Carrier Wall Spacing) 18.PTH to Carrier Wall (Carrier Wall Holes) 19.NPTH To Carrier Wall (Carrier Wall Holes) 20.Via to Carrier Wall (Carrier Wall Holes) 21.Label to Component (Label) 22.Comp to Gold Fingers (Gold Fingers) 1.零件的Pitch(兩Pin的間距)-可不看2.零件的高度-可不看3.零件的旋轉角度-可

10、不看4.零件的間距-重要嚴格遵守我們的DFM Rule5.零件與其他零件Pin的間距-重要嚴格遵守我們的的DFM Rule6. 另一面零件限制區與零件距離)-可不看7.另一面零件限制區與Pin距離)-可不看8.矮零件與板邊的距離-可不看9.高零件與板邊的距離-可不看10.SMT零件到夾板邊的距離(TOP side)-重要11.SMT零件到夾板邊的距離(Bottom side)-重要12.零件到夾板邊的距離-重要13.零件到夾板邊的距離-重要14.零件到文字面的距離-可不看15.沒有零件編號的零件-可不看16.零件到載具內零件的距離-可不看17.零件到載具內零件的距離-可不看18.PTH孔到載具

11、的距離-可不看19. NPTH孔到載具的距離-可不看20. Via孔到載具的距離-可不看21.Label到零件的距離-可不看22.零件到金手指的距離-重要2021/12/233523.Component To Mounting Hole (Primary) (Hole Spacing) 24.Component To Mounting Hole (Secondary) (Hole Spacing) 25.Component To Tooling Hole (Primary) (Hole Spacing) 26.Component To Tooling Hole (Secondary) (Hol

12、e Spacing) 27.Hole Under Component (Hole Spacing) 28.Uncapped Via Under Component (Hole Spacing) 29.Wave Solder Component Orientation (Orientation) 30.Component Relative Orientation (Orientation) 31.Component Uncommon Orientation (Orientation) 32.No Orientation Indication (Orient Indication) 33.No S

13、quare Pad on THMT pin #1 (Orient Indication) 34.Chip Corner Protection Missing (Guarded Comps ) 35.Chip Edge Protection Missing (Guarded Comps ) 36.Comp. Outside Keepin Area (Keepin/Keepout)37.Comp.Within Keepout Area (Keepin/Keepout)38.Comp. Exceed Max Height (Height Restriction)39.Comp. Under Min

14、Height (Height Restriction) 23.TOP零件到螺絲孔的距離-重要24.Bottom零件到螺絲孔的距離-重要25.Top零件到Tooling Hole的距離-重要26.Bottom零件到Tooling Hole的距離-重要27.零件下的Hole-重要28.零件下面沒蓋Marsk的Via-重要29.過錫爐的零件方向-可不看30.相關零件的方向-重要31.相關零件的非正常方向-重要32.非極性零件的方向(可能缺少Pin 1標識)-重要33.DIP零件的第1 Pin不是方形的-重要34.Chip零件的角沒有加保護-可不看35.Chip零件的邊沒有加保護-可不看36.零件沒在

15、Keepin區域-重要37.零件在Keepout區域-重要38.零件超過最大高度限制區-重要39.零件超過最低限制區-重要2021/12/2336Testpoints Analysis1.Toeprint Testpoints (Review) 2.Via Testpoints (Review) 3.Nets Without Testpoints (Review) 4.Nets With Multiple Testpoints (Review) 5.Testpoint Wrong Shape (Review)6.Testpoint to Toeprint (Spacing)7.Testpoin

16、t to Testpoint (Spacing) 8.Testpoint To Capped Via (Spacing) 9.Testpoint To Uncapped Via (Spacing) 10.Testpoint to Exposed Copper (Spacing) 11.Testpoint to Unexposed Copper (Spacing)12.Testpoint to NPTH (Drill) 13.Testpoint To THMT Toeprint (Drill) 14.Testpoint to Rout (Rout) 15.Testpoint To Compone

17、nt (Component) 16.Testpoint Under Component (Component) 17.Testpoint To Component Angle (Component) 18.Testpoint To SM (Solder Mask) 19.Capped Testpoint Vias (Via Capping) 20.Via Capped On Both Sides (Via Capping) 21.Uncapped Non-Testpoint Vias (Via Capping) 22.Testpoint to Conveyed Edge (Rout)23.Te

18、stpoints Outside Keepin Area (Keepin/Keepout)24.Testpoints Within Keepout Area (Keepin/Keepout)1.Padstack測試點分析2.Via測試點分析3.沒有加測試點的Net4.有多個測試點的Net5.測試點的錯誤Shape-可不看6.測試點到Pin的間距7.測試點到測試點的間距8 .測試點到蓋Mask Via的距離9.測試點到未蓋Mask Via的距離10.測試點到裸露銅箔的距離11.測試點到蓋Mask Shape的距離12.測試點到NPTH Drill距離13.測試點到 PTH Drill的距離14.

19、測試點到板邊的距離15.測試點到零件的距離16.零件下的測試點17.測試點與零件的角度18.測試點到Solder mask的距離19.蓋Mask的測試點20.兩邊都蓋Mask的Via21.未蓋Mask的非測試點22.測試點到夾板邊的距離23.Keepin區域以外的測試點24.Keepout區域以內的測試點2021/12/2337Fabrication Analysis - Partial ListSignal Layers Checks1.Toeprint to Toeprint (Spacing)2.SMD to SMD (Spacing)3.Via to Via (Spacing)4.PT

20、H to PTH (Spacing)5.SMD to Via (Spacing)6.SMD to TH (Spacing)7.Via to TH (Spacing)8.Pad to Pad (Spacing)9.Pad to Circuit (Spacing)10.Circuit to Circuit (Spacing)11.Text to Text (Spacing)12.Spacing Length (Spacing)13.Same Net Spacing (Spacing)14.CAD Short (Spacing)15.CAD Self Spacing (Spacing)16.NPTH

21、 Registration (Drill)17.Exposed to Exposed (Spacing)18.Covered to Covered (Spacing)19.Exposed to Covered(Spacing)20.Shaved Lines (Size)21.Text Fields (Size)22.Shaved Arcs (Size)23.Etch Outside Keepin Area (Keepin/Keepout)24.Etch Within Keepout Area (Keepin/Keepout)25.Trace Within Keepout Area (Keepi

22、n/Keepout)26.Via Within Keepout Area (Keepin/Keepout)1.Pin到Pin的間距2.SMD Pad到SMD Pad的間距3.Via到Via的間距4.PTH到PTH的間距5.SMD Pad到Via的間距6.SMD到Through hole的間距7.Via到Through hole的間距8.Pad到Pad的間距9.Pad到線路的間距10.Trace到Trace的間距11.文字到文字間距(有電氣特性的)12.平行線的長度檢查13.相同Net name的間距14.短路分析15.不同層面上相同Net的間距16.None-PTH的drill中心與Pad中心

23、偏移分析17.相鄰裸露區域的間距18.相鄰蓋Mask的線或銅箔間距19.裸露區域和蓋Mask的線或銅箔間距20.被非電氣特性的孔線等刮到的Cline21.文字區域-可不看22.被非電氣特性的孔線等刮到的圓弧23.Keepin區域外的蚀刻24.Keepout區域內的蚀刻25.Keepout區域內的Trace26.Keepout區域內的Via2021/12/2338Silk Screen Checks1.SM Clearance (SM Clearance)2.SMD Clearance (SMD Clearance)3.PTH Pads Clearance (Pad Clearance)4.Via Pads Clearance (Pad Clearance)5.NPTH Pads Cle