PCB常用英文词汇汇编

1、PCB常用英文词汇汇编A aA.O.I(Automatic Optical Inspection)自动光学检查Apparatus设备，仪器Acceptable quality level (AQL)可接受质量水平Area面积Accuracy精确度Artwork菲林Activating活化Artwork Drawing菲林图形Active carbon treatment活性碳处理Artwork Film原装菲林After Pressed Thickness压板后之厚度Artwork Modification菲林修改Alignment校直，结盟Artwork No.菲林编号Annular rin

2、g锡圈Assembly组装，装配Anti-Static Bag静电胶袋Axis轴B bBackplane背板Blistering起泡/水泡Back-up垫板Board Cutting开料Baking 烘板Board Thickness板厚Ball Grid Array (BGA)球栅阵列Bottom side底层Bare board裸板Breakaway tab打断点Base Copper底铜Brushing磨刷Base material基材Build-up积层Bevelling斜边Bullet pad子弹盘Black Oxide黑氧化Buried hole埋孔Blind via hole盲孔

3、C cC/M(Component Marking)元件字符Conductor width/space导体线宽/线隙Carbon ink碳油Contact接点Carrier带板Copper area铜面积Ceramic substrate陶瓷Copper clad铜箔Certificate of Compliance合格证书Copper foil铜箔Chamfer倒角Copper plating电镀铜Chemical cleaning化学清洗Corner角线Chemical corrosion化学腐蚀Corner mark板角记号Chip Scale Package (CSP)晶片比例包装Cor

4、ner REG.Hole角位对位孔Circuit线路Cracking裂缝Clearance间距/间隙Creasing皱折Color颜色Criteria规格,标准Component Side(C/S)元件面Crossection area切面Composite layers复合层Cu/Sn Plating镀铜锡Computer Aided Design (CAD)电脑辅助设计Current efficiency电流效率Computer Aided Manufacturing (CAM) 电脑辅助制作Customer客户Computer Numerial Control (CNC)数控Custom

5、er Drilling File客户钻孔资料Conductor导体Customer P/N客户产品编号D dD/F Registration Hole干菲林对位孔Diamond钻石D/F(Dry Film)干膜Diazo film重氮片Date Code日期代号Dielectric breakdown介电击穿Datum hole基准参考孔Dielectric constant介电常数Daughter board子板Dielectric Thickness介电层厚度Deburring去毛刺Dielectric Voltage Test绝缘测试Defect缺陷Dimension尺寸Definiti

6、on定义Dimensional stability尺寸稳定性Delamination分层Direct/indirect直接/间接Delay耽搁Distribution发放Delivery交货Document type文件种类Densitomefer透光度计Documentation Control文件控制PCB常用英文词汇汇编Density密度Double sided board双面板Department部门Drill bit钻咀Description说明Drilling钻孔Design origin设计原点Drilling Roughness钻孔粗糙度Desmear去钻污,除胶Dry Fil

7、m 干菲林Dessicant防潮珠Dry Film-Pattern干膜线路Developer显影液,显影机Dynamic动态E eECN(Engineering Change Notification)工程更改通知Entek有机涂覆Effective date有效期Epoxy glass substrate环氧玻璃基板Electrical Test Fixture电测试 针床Epoxy resin环氧基树脂Electro migration漏电Etch蚀刻Electroconductive paste导电胶Etchback凹蚀Electroless无电沉Etching蚀刻Electroless

8、 copper无电沉铜E-Test Marking电测试标记Electroless Ni无电沉镍E-Test(Electrical Test)电测试Electroless Gold/Au无电沉金Exposure曝光Engineering drawing工程图纸External layer外层F fFiducial mark基准点Fixture夹具Filling填充Flammability可燃性Film Fabrication菲林制作Flash Gold薄金Final QC最终检查Flexible易曲的,能变形的Finish Overall Board Thickness成品总板厚度Flux助焊

9、剂G gGeneral information一般资料Golden board金板Ghost image重影Grid网格Glass transition temperature玻璃化湿度Ground plane地线层Gold Finger(G/F)金手指H hHAL(Hot Air Leveling)热风整平Hole density孔的密度Hand Rout手锣Hole Diameter孔径Hardness硬度Hole location孔位Heat Sealed热密封Hole Location Chart孔位座标表Heat Shrink-warp热收缩Hole Position Toleran

10、ce孔位误差Holding time停留时间Hole size孔尺寸Hole孔Hot Air Leveling(HAL)热风整平Hole breakout破环Humidity湿度I Identification标识,指标Inter Plane Separation内层分离Image影像Interleave Paper隔纸Imaging transfer图形转移Internal layer内层Impedance阻抗Internal stress内应力Impedance Test阻抗测试Ionic cleanliness离子清洁度Inner copper foil 内层铜箔Isolation孤立I

11、nspection检验Isolation Resistance绝缘电阻Insulation resistance Test绝缘测试Item项目K kKEY board按键盘Kraft paper牛皮纸Key slot槽孔PCB常用英文词汇汇编L lLaminate板材Legend Width字符宽度Laminate Thickness材料厚度Length长度Lamination void 层间空洞Lifted Lands残铜Landless hole破孔Line Width线宽Laser plotter激光绘图机Liquid液体Laser plotting激光绘图Location位置Laser

12、 via hole激光穿孔Logic diagram逻辑图形Layup层压配本Logo唛头,标记Lay-up Instruction压板指示Lot size批卡Legend字符M mMark标记Min. Nickel Thickness最小镍厚Master drawing菲林图形Min. Tin-Lead Thickness (After HAL)（喷锡后）最小锡厚Material Thickness材料厚度Min.Annular Ring最小环宽Material Type材料类型Min.Spacing between Line to Line线与线之间的最小距离Max. X-out坏板上限M

13、in.Spacing between Line to Pad线与焊盘之间的最小距离Max.Board Thickness After Plating电镀后总板厚度之上限Min.Spacing between Pad to Pad焊盘与焊盘之间的最小距离Measling白斑Minimum 最小Mech Drawing No.图纸编号Mirroring镜像Mechanical cleaning机械清洗Missing 缺少Metal金属Model No.产品名称Method方法Molded模塑MI(Manufacturing Instruction)生产制作指示Mother board主板Micro

14、strip微条线Moulding模房Min Conductor Copper Thickness最小线路铜厚Mounting hole安装孔Min Hole Wall Copper Thickness最小孔壁铜厚Multilayer多层板Min. Gold Plating Thickness最小金厚Multi-layer Laminate多层板材料 N nNegative反面的No.of Panel per Stack每叠板数Net list网络表No.of Panel/Sheet每张大料拼板数Network网络No.of Pcs Per Bag每包数量Nick缺口No.of Unit/Arr

15、ay每套单元数No. of holes孔数Normal value标准值No.of Array/Panel每个拼板套板数O oOblong椭圆形的Organic Solerability Peservatives(OSP) 有机保护剂Offset 偏移Originator原作者Open/short开路/短路Outer copper foil外层铜箔Optimization(design)最佳化(设计)Outline外形P pPacking包装Pitch间距Packing包装Placement放置Pad焊盘Plated Though Hole(PTH)沉铜Panel Area拼板面积Platin

16、g电镀Panel Plated Crack板镀缺口Plating Crack电镀裂缝Panel plating整板电镀Plating line电镀线Panel Size拼板尺寸Plating rack电镀架Panel Size After Outerlayer Cutting外层切板后拼板尺寸Plating Void电镀针孔PCB常用英文词汇汇编Panel Utilization拼板利用率Plug Hole塞孔Pass rate通过率Polymer聚合体Passivation钝化Porosity孔隙率Pattern线路Positive绝对的Pattern Inspection线路检查Power

17、 plane电源层Pattern plating图形电镀Prepreg半固化片PCB(Printed Circuit Board)印制线路板Primary side首面Peck drilling啄钻Print印刷Peel strength 剥离强度Probe point针床测点Peelable可剥性Process工序Peelable 剥离强度Process flow工序流程Peelable Mask可脱油Product Planning Dept.生产计划部Peeling剥离Production生产板Permanent永久性Profile外形PH valuePH值Profiling 外形加工P

18、hoto plotting图形输出Profiling Process外形加工Photo via hole菲林过孔Project No.产品编号Photographers照片靶标PTH Thermal Seress TestPTH热冲击测试Photoplotler光绘机PTH(Plating Through Hole)沉铜Physical物理的Pull away拉离Pin hole销定孔Punch啤模Pink ring粉红环Punching冲切Pinning hole钻孔管位Punching Mould Drawing啤模图形Q qQA Audit品质审计Quality质量QA(Quanlity

19、 Assurance)品质部Quantity数量Quad Palt Pack (QFP)四边扁平林整器件R rRaw Material Utilization原材料利用率Resist抗蚀剂Recall回收Resolution分辨率Rectifier整流器Rigid精密的Register mark对位点Roller coating涂覆Registration重合点Roughening粗化Remark备注Round pad圆盘Resin树脂Routing外形加工,铣板Resin Recession流胶S sS/M Material绿油物料Solder mask on bare copper (sm

20、obc)裸铜覆盖阻焊膜S/M(Solder Mask)阻焊Solder side焊接面Sales 销售Solder Side C/M阻焊面字符Sample样板Solder Side Cir.焊接面线路Sampling inspection抽样检验Solder Side Circuit焊接面Scaling factor缩放比例因素Solder Side S/M焊接面阻焊Scope范围Solderability可焊性Scoring刻槽Solvent Test可溶性测试Scratch划痕Spacing线距Secondary side第二面Special requirement 特殊要求Section

21、 Code组别代号Specification详细说明，规范Section Code Change组别代号更改Spindle主轴Segment部分,片段Split裂片Separated分离Square pad方块Sequence顺序Standard标准值Sets套Static静态Sheet Size大料尺寸Stencial网版PCB常用英文词汇汇编Shematic diagram原理图Step drilling分布钻Shiny有光泽的,发光的Step scale光梯尺Silk screen丝印Store货仓Silver film银盐片Supplier供应商Single/double单层/双面Suppor