印制电路专业词汇中英文对照

1、印制电路专业词汇中英文对照一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、e卩制元件：printed component7、印制接点：printed contact8、印制板装西己：printed board assembly9、板：board10、单而印制板：single-sided printed board(ssb)11、双面印制板：double-sided pr

2、inted board(dsb)12、多层印制板:mulitlayer printed board (mlb)13> 多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15> 刚性印制板：rigid printed board16> 刚性单面印制板:rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18> 刚性多层印制板：rigid multilayer pri

3、nted board19> 挠性多层印制板：flexible multilayer printed board20> 挠性印制板：flexible printed board21 > 挠性单面印制板:flexible single-sided printed board22> 挠性双面印制板:flexible double-sided printed board23> 挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路:flexible printed wiring25> 刚性印制板：flex-rigid print

4、ed board, rigid-flex printed board26> 刚性双面印制板:flex-rigid double-sided printed board, rigid-flex double-sided printed27> 刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board28、齐平印制板：flush printed board29> 金属芯印制板:metal core printed board30> 金属基印制板：metal base prin

5、ted board31> 多重布线印制板：mulit-wiring printed board32> 陶瓷印制板：ceramic substrate printed board33> 导电胶£卩制板：electroconductive paste printed board34、模塑电路板：molded circuit board35> 模压印制板：stamped printed wiring board36> 顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring boar

6、d38> 微线印制板：micro wire board39> 积层印制板：buile-up printed board40、积层多层印制板:build-up mulitlayer printed board (bum)41> 积层挠印制板：build-up flexible printed board42> 表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh mul

7、tilayer printed board46、载芯片板：chip on board (cob)47> 埋电阻板：buried resistance board48、母板：mother board49、了板：daughter board50> 背板：backplane51> 裸板：bare board52、键盘板夹心板：copper-invar-copper board53> 动态挠性板：dynamic flex board54、静态挠性板：static flex board55> 可断拼板：break-away planel56> 电缆：cable57、挠

8、性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membranetch59、混合电路:hybrid circuit60、厚膜：thick "im61、厚膜电路：thick f订m circuit62、薄膜：thin film63、薄膜混合电路:thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contac

9、t70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔

10、层压板:copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10> 金属基覆铜层压板：metal base copper-clad laminate11> 挠性覆铜箔绝缘薄膜：flexible copper-clad dielectr

11、ic film12> 基体材料：basis material13> 预浸材料：prepreg14、粘结片：bonding sheet15> 预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17> 力 口成法用层压板：lam in ate for additive process18> 预制内层覆箔板：mass lamination panel19、内层芯板： core material20> 催化板材：catalyzed board , coated catalyzed lam

12、inate21 > 涂胶催化层压板：adhesive-coated catalyzed laminate22> 涂胶无催层压板：adhesive-coated uncatalyzed laminate23> 粘结层：bonding layer24、粘结膜：f订m adhesive25> 涂胶粘剂绝缘薄膜：adhesive coated dielectric film26> 无支撑胶粘剂膜：unsupported adhesive film27> 覆盖层：cover layer (cover lay)28、增强板材：stiffener material29&g

13、t; 铜箔面：copper-clad surface30> 去铜箔面：foil removal surface31、 层压板面：unclad laminate surface32> 基膜面：base film surface33> 胶粘剂面：adhesive faec34、原始光洁面：plate finish35> 粗面：matt finish36> 纵向：length wise direction37、模向： cross wise direction38、剪切板：cut to size panel39> 酚醛纸质覆铜箔板:phenolic cellulos

14、e paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42>环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epox

15、ide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide

16、synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板:ultra thinlaminate50、陶瓷基覆铜箔板：ceramicsbase copper-clad laminates51、紫外线阻挡型覆铜箔板：uvblocking copper-clad laminates、基材的材料1、a 阶树脂：a-stage resin2、b 阶树脂：b-stage resin3、c 阶树脂：c-stage resin4、环氧树脂：epoxy

17、 resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10> 三聚氧胺甲醛树脂：melamine formaldehyde resin11> 多官能环氧树脂：polyfunctional epoxy resin12> 漠化环氧树脂：brominated epoxy resin13> 环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅

18、树月旨：silicone resin16、硅烷：silane17> 聚合物：polymer18、无定形聚合物：amorphous polymer19> 结晶现象：crystalline polamer20> 双晶现象：dimorphism21> 共聚物：copolymer22> 合成树脂：synthetic23> 热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25> 感光性树脂：photosensitive resin26> 环氧当量：weight per epoxy equivalen

19、t (wpe)27、环氧值：epoxy value28> 双氧胺：dicyandiamide29> 粘结剂：binder30、胶粘剂：adesive31> 固化剂：curing agent32> 阻燃剂：flame retardant33> 遮光剂：opaquer34、增塑剂:plasticizers35> 不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38> 聚四氟乙烯：polytetrafluoetylene (ptfe)39> 聚全氟乙烯丙烯

20、薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e 玻璃纤维：e-glass fibre43、d 玻璃纤维：d-glass fibre44、s 玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布： non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：f订ament50> 绞股：strand51> 纬纱：weft yarn52>

21、经纱：warp yarn53> 但尼尔：denier54、经向：warp-wise55> 纬向：weft-wise, filling-wise56> 织物经纬密度：thread count57、织物组织：weave structure58> 平纹组织：plain structure59> 坏布：grey fabric60、稀松织物：woven scrim61> 弓纬：bow of weave62、断经：end missing63> 缺纬：mis-picks64、纬斜：bias65> 折痕：crease云织：waviness 鱼眼：fish eye

22、 毛圈长：feather length 厚薄段:mark 裂缝：split 捻度：twist of yarn 浸润剂含量： size content 浸润剂残留量：size residue 处理剂含量：finish level 浸润剂：size 徜联剂：couplint agent 处理织物：finished fabric 聚酰胺纤维：polyarmide fiber 聚酯纤维非织布： non-woven polyester fabric 浸渍绝缘纵纸：impregnating insulation paper 聚芳酰胺纤维纸:aromatic polyamide paper 断裂长：brea

23、king length 吸水高度：height of capillary rise 湿强度保留率：wet strength retention 口度：whitenness 陶瓷：ceramics导电箔：conductive foil 铜箔：copper foil 电解铜箔：electrodeposited copper foil (ed copper foil) 压延铜箔：rolled copper foil 退火铜箔：annealed copper foil压延退火铜箔：rolled annealed copper foil (ra copper foil) 薄铜箔：thin copper

24、foil 涂胶铜箔:adhesive coated foil涂胶脂铜箔:resin coated copper foil (rcc) 复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99> 箔(剖面)轮廓：foil profile100、光面：shiny side101> 粗糙面：matte side102> 处理面：treated side103> 防锈处理：stain proofing104、双面处理铜箔：double treated foil 四、设计1、原理图：shematic dia

25、gram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计:design-for-manufacturability6、计算机辅助设计：computer-aided design. (cad)7、计算机辅助制造：computer-aided manufacturing. (cam)8、计算机集成制造：computer integrat manufacturing. (cim)9、计算机辅助工程：computer-aided engineering. (cae)10> 计算机辅助测试：co

26、mputer-aided test. (cat)11> 电了设计自动化：electric design automation (eda)12> 工程设计自动化：engineering design automaton (eda2)13> 组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15> 计算机控制显示：computer controlled display (ccd)16、布局：placement17> 布线：routing18>布图

27、设计：layout19> 重布：rerouting20> 模拟：simulation21> 逻辑模拟：logic simulation电路模拟:circit simulation 时序模拟：timing simulation 模块化：modularization 布线完成率：layout effeciency 机器描述格式：machine descriptionm format （mdf） 机器描述格式数据库：mdf databse 设计数据库：design database 设计原点：design origin 优化（设计）：optimization （design） 供设

28、计优化坐标轴：predominant axis 表格原点：table origin 镜像：mirroring 驱动文件:drive file 中间文件：intennediate file 制造文件：manufacturing documentation 队列支撑数据库：queue support database 元件安置：component positioning 图形显示：graphics dispaly 比例因了： scaling factor 扫描填充：scan filling 矩形填充：rectangle filling 填充域：region filling 实体设计:physica

29、l design 逻辑设计：logic design 逻辑电路：logic circuit 层次设计：hierarchical design 自顶向下设计：top-down design 自底向上设计：bottom-up design 线网：net 数字化：digitzing 设计规则检查：design rule checking走(布)线器：router (cad)网络表：net list计算机辅助电路分析：computer-aided circuit analysis 子线网：subnet目标函数：objective function设计后处理：post design processing

30、 (pdp) 交互式制图设计：in teractive drawing design 费用矩阵：cost metrix工程图：engineering drawing 方块框图：block diagram 迷宫：moze元件密度：comp on ent density巡刨售货员问题：traveling salesman problem 口 由度：degrees freedom入度：out going degree出度：incoming degree曼哈顿距离：manhatton distance欧儿里德距离：euclidean distance 网络：network阵列：array段：segme

31、nt逻辑：logic逻辑设计自动化:logic design automation分线：separated time分层：separated layer 定顺序：def in ite sequence 形状与尺寸：导线(通道)：conduction (track)导线(体)宽度：conductor width 导线距离：conductor spacing 导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no. 17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamon

32、d pad10>长方形焊盘：oblong pad11> 子弹形盘:bullet pad12> 泪滴盘：teardrop pad13、雪人盘： snowman pad14、v 形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circiilar pad17> 隔离盘：isolation pad18、非功能连接盘：monfunctional pad19>偏置连接盘：offset land20> 腹(背)裸盘：back-bard land21> 盘址：anchoring spaur22、连接盘图形：land patte

33、rn23>连接盘网格阵列：land grid array24、 孑l环：annular ring25> 元件孑l： component hole26> 安装孑l： mounting hole27、支撑孔：supported hole28> 非支撑孔：unsupported hole29>导通孔：via30、镀通孔：plated through hole (pth)31> 余隙孔：access hole32> 盲孔：blind via (hole)33> 埋孔：buried via hole34、埋/盲孔：buried /blind via35&g

34、t; 任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38> 无连接盘孔：landless hole39> 中间孔：interstitial hole40、无连接盘导通孔：landless via hole41> 引导孔：pilot hole42、端接全隙孑l： terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在

35、连接盘中导通孔：via-in-pad46、孑l位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50> 装配图：assembly drawing51 > 印制板组装图：printed board assembly drawing52> 参考基准：datum referance54、 基准尺寸：reference dimension55> 参考尺寸：reaerence dimension56> 直接量定尺寸：direct dimensioning57> 基准图：dat

36、um feature58、 基准边：reference edge59> 导线设计距离：design space of conductor60> 导线设计宽度：design width of conductor61、 中尤'品巨：center to center spacing62> 线宽/间距：conductor width/space63> 节距：pitch64、精细节距：fine pitch65> 层：layer66> 层间住layer-to-layer spacing边距:edge spacing外形线：trim line截面积：crossec

37、tion area真实值表测量：truth table test 准确位置：true position tolerance 精确位置：accuracy精确位置误差：cumulative tolerance 精确度：accuracy累积误差：cumulative tolerance焊垫：footprint 夕卜层：external layer内层：internal layer接地层:ground plane 接地层隔离：ground plane clearance 电压层：voltage plane电源层隔离：voltage plane clearance 电源层：power plane, bu

38、s plane导通网络：basic grid 导通网格：track grid 导通孔网格：via grid连通盘网格：pad (land) grid定位偏差：positional tolerance 对准靶标：bornb sight 梳状图形：comb pattern 对准标记：register mark 散热层：heat sink plane 电气互连表面间连接：interlayer connection 层间连接：interlayer connection 内层连接：inn erlayer conn ection 非功能表面连接：nonfunctional interfacial conn

39、ection5、跨接线：jumper wire6、节（交）点：node7、附加线：haywire8、端接（点）：terminal9、连接线：terminated line10、端接：term in ation11、连接端：pad, land12、贯穿连接：through connection13、支线：stub14、印制插头：tab15、键槽：keying slot16、连接器：connector17、板边连接器：edge board connector18、连接器区：connector area19、直角板边连接器:right angle edgeconnector20、偏槽口： polar

40、izing slot21、偏置端接区：offset terminal area22、接地：ground23、端接隔离（空环）：terminal clearance24、连通性：continuity25、连接器接触：connector contact26、接触面积：contact area27、接触间距：contact spacing28、接触电阻：contact resistance29、接触尺寸：contact size30、元件引腿（脚）：component lead31、元件插针：component pin32、最小电气间距:minimum electricalspacing33、导电性

41、：conductivity34、边卡连接器：card-edge connector35、插卡连接器：card-insertion connector36> 载流量：current-carrying capacity37、錨径：path38> 最短路径：shortest path39> 关键路径：critical path40、倒角：miter41> 串推：daisy chain42、斯坦纳树：steiner tree43、最小生成树：minimum spanning tree (mst)44、瓶颈宽度：necked width45、短叉长度：spur length46、短柱长度：stub length47> 曼哈顿路径：manhattan path48、连接度(性)：connectivity七、其它1、主面：primary side2、辅面：secondary side3、支撑面：supporting plane4、信号：signal5、信号导线：signal conductor6、信号地线：signal ground7、信号速率:signal rate8、信号标准化：signal stan