PCB基本英文培训教材

1、5A版优质实用文档PCB基本英文培训教材中英制基本单位换算1 kg=2.205 lb(磅)1 磅=0.454 kg1英尺=12英寸1 OZ(盎司)=28.3527g1g=0.035270Z1 英寸 inch=1000 密尔 mil1 ft(英尺)=0.3048m1m=3.281ft1mil=1000u ”uin mil)1 码=0.914m1m=1.094 码1OZ=28.35克/平方英尺=35微米1 in(英寸)=25.4mm2 21mm=0.03937in2 21in=1000mil=25.4mm,1mil=25.4um1 m2=10.76 ft21 ft2=0.0929 m21ASD=1

2、安培/平方分米=10.76安培/平方英尺1磅力=4.4484牛顿1N=0.2248 磅力1加仑美制=3.785升1psi=0.06895bar1bar=14.5psi=1.013kg/cm1bar=100000Pa1马力=0.746千瓦1 品脱=568 ml1oC=1.8 G C+32 F1 F=( F-32)/1.8 C1 英尺=30.5 cm基本英文词汇1、流程Board cut开料Carbon printing碳油印刷Inner dry film内层干膜Peelable blue mask蓝胶Inner etchi ng内层蚀刻ENIG(Electrolessnickelimmersio

3、 n gold)沉镍金Inner dry film stripping内层干膜退膜HAL(hot air leveli ng)喷锡AOI ( Automatic Optical In spect ion)自动光学检测OSP ( Organic solderability preservative)有机保焊Press ing压板Punching啤板Drilli ng钻孔Profili ng外形加工Desmear除胶渣，去钻污E-Test电性测试PTH镀通孔，沉铜FQC(final quality control)最终检杳Panel plat ing整板电镀FQA(Fi nal quality a

4、udit)最终抽检Outer dry film外层干膜Pack ing包装Etch ing蚀刻IPQA(I n-process quality audit)流程QATin strippi ng退锡IPQC(I n-process quality con trol)流程QCEQC( QC after etching)蚀检QCIQC(lncoming quality control)来料检杳Solder mask感阻MRB(material review board)材料评审委员会Comp onent mark字符QA(Quality assura nee)品质保证Physical Laborat

5、ory物理实验室QC(Quality con trol)品质控制Chemistry Laboratory化学实验室Docume nt con trol cen ter文件控制中心2nd Drilli ng二钻Rout ing锣板，铣板Brow n oGidati on棕化Waste water treatme nt污水处理V-cutV坑WIP ( work in process)半成品Store/stock仓库F.G( Fini shed goods)成品5A版优质实用文档Page 1of 32、概述Prin ted Circuit Board印制电路板FleGible Prin ted Ci

6、rcuit, FPC软板Double-Side Prin ted Board双面板IPC ( The Institute for Interconnecting and Packing Electro nic Circuits)电子电路互连 与封装协会CPAR ( Corrective & Preve ntive Actio n Reques)要求纠正预防措施Flammability Rate燃性等级Characteristic impeda nee特性阻抗BUM (Build-up multilayer):积层多层板Date Code周期代码CCL (Copper-clad laminate

7、覆铜板Ionic con tam in ati on离子性污染Accepta nee Quality Level (AQL)允收水平HDI( Highden sityin terc onnecting)高密度互连板Base Material基材Radius半径Capacity生产能力Diameter直径Capability:工艺能力PPM(Parts Per Millio n)百万分之几CAM( computer-aidedmanu facturi ng)计算机辅助制造Un derwritersLaboratoriesInc.美国保险商实 验所CAD (computer-aided desig

8、 n)计算机辅助设计Statistical Process Con trol统计过程控制Specificati on规格，规范Via导通孔Dime nsio n尺寸Buried /bli nd via埋/盲孔Tolera nee:公差Tooli ng hole定位孔Ove n:焗炉Output/throughput产量Page 2 of 33、湿流程PTH ( plated through hole)镀通孔（俗称沉铜）Acid clea ning酸性除油PP(Pa nel Plat in g)板电Acid dip酸洗Pattern plat ing图电Pre-dip预浸Line width线宽

9、Alkaline cleaning碱性除油Spaci ng线隙FluG松香Deburri ng去毛刺（沉铜前磨板）Hot air leveli ng喷锡Carbon treatme nt碳处理Skip plati ng跳镀，漏镀Track/c on ductor导线Un dercut侧蚀Aspect ratio深径比Water rinsing水洗Etch Factor蚀刻因子Tran sportati on行车Back Light Test背光测试Rack挂架Pink ring粉红圈Maintenance保养4、干流程Hole locati on孔位Annu lar ring孔环Image T

10、ran sfer图象转移Compo nent Side(C/S)元件面Artwork底片Solder Side(S/S)焊接面Mylar胶片Matte Solder Mask哑绿油Silkscree n/lege nd/Comp onent Mark文字Hole breakout破孔Fiducial mark基点，对光点Scrubb ing磨板EGpose曝光Develop ing显影5A版优质实用文档5、内层制作Corematerial内层芯板Thermalpad散热PADPre-pregPP片Resincontent树脂含量KraftP aper牛皮纸Brow noGidati on棕化Layup排版BlackOGidati on黑化Registrati on对位Basematerial板材Delam ination分层6、其它Wicki ng灯芯效应Holesize孔径（尺寸）Yield良品率TouchUp:修理Warpa ndTwist板曲度Solve ntTestr溶剂测试Peelof