日本东京精密

1、东京精密株式会社公司简介东京精密株式会社是日本著名半导体制造设备之一,公司总部设在日本东京都三鹰市, 在美国,欧洲,新加坡,中国等地设有分公司,研发基地或生产厂等.We develop our businesses in two key areas: semiconductor manufacturing equipment and precision measuring systems. Our philosophy is to generate long-term growth through the creation of WIN-WIN, or mutually beneficial,

2、 relationships, with all our stakeholders - customers, business partners, shareholders and employees.（公司网站原文）东京精密主要从事半导体加工设备及精密测量仪器制造及开发. 半导体加工设备有硅片加工用地倒角机、内圆切片机, 半导体加工前道工序用的光刻机（LEEPL）、CMP、晶片表面综合检查设备及测试封装用的探针台、划片机、硅片背面抛光机等.过去，东京精密简称“TSK”，在国内半导体行业享有盛誉。现在东京精密采用了新的商标“ACCRETECH”，她是由英文成长ACCRETE和技术TECHNOL

3、OGY的合成词，是融合公司”以WIN-WIN精神工作，创世界一流产品“经营理念的新标志。参展产品：硅片材料的内圆切片机、硅片倒角机，光刻机，CMP，硅片表面检查系统，探针台背面减薄抛光机，划片机。网址： http:/www.accretech.jp/Semiconductor Manufacturing Equipment:Product listWafer Manufacturing SystemVariety of products line for wafer manufacturers including Wafer Slicing Machine and Wafer Edge Gri

4、nding Machine.Sliced Wafer Carbon Demounting and Cleaning Machine : C-RW-200/300Feature 1Automatic demounting of wafers from the slicing base, cleaning and storing into the cassette.Wafer Edge Grinding: W-GM-5200 Newly-developed grinding unit enhances the rotative precision of the spindle, and impro

5、ves the surface roughness. The non-contact measuring method achieves the stable alignment. Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer. The modular concept to make the optimum process line possib

6、le. Low damage grinding method is available.Feature 1Machine specification ready for 300 mm and 200 mm wafer.Feature 2Visual system (optional) for measuring the chamfer width of periphery and notch.Wafer Edge Grinding: W-GM-4200 Newly-developed grinding unit enhances the rotative precision of the sp

7、indle, and improves the surface roughness. The non-contact measuring method achieves the stable alignment. Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer. The modular concept to make the optimum pro

8、cess line possible. Low damage grinding method is available.Feature 1Machine specification ready for 75 - 150 mm wafer or for 150 - 200 mm wafer.Feature 2Capable of various material processes, such as chemical compound semiconductor.Wafer Slicing Machine: S-LM-116GPrecise slicing machine for fragile

9、 materials such as glass, ceramics, ferrite.Feature 116-size blade for easy handling, lifting and adjustment.Feature 2Open-structure loading unit for easy mounting of the workpiece.Feature 3Easy setting of slicing speed and wafer thickness with digital switch.Feature 4Strong frame, highly rigid tabl

10、e provides long-term stability in performance.Feature 5Easy coolant adjustment and dressing operation.Wafer Slicing Machine: A-WS-100SScribes wafer substrate with high precisionFeature 1Easy alignmentWith fine adjustment in horizontal and rotative directionsFeature 2Easy scribe settingWith the touch

11、 panel to set the index amount, number of times of scribing, etc. CMPCMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.ChaMP: For 300mm WafersC

12、ombining the technological expertise built up by Accretech in precision measuring equipment and semiconductor manufacturing equipment, we now offer the ChaMP Series, the CMP systems compatible with 300 mm wafers, with process performance required by design rules for 90 nm and 32 nm devices, and able

13、 to keep up with the most advanced volume-production fabs.Feature 1Air-float Head Sylphide Reference polishing is made possible via an air cushion that provides uniform pressure distribution. Wafer pressure is applied by an airbag independent of ring pressure, providing excellent low-pressure contro

14、llability and stability. Zone control is available.Feature 2Edge Exclusion of 1 mm!Feature 3Wafer Pressure Controllability & RepeatabilityFeature 4Simple Maintenance for Polishing Heads - Ring ChangeDemounting (approximately 5 seconds)Slide the snap ring cover up with both handsSpread the snap ring

15、with your thumb (the retaining ring drops off)Completely remove the retaining ringMounting (approximately 10 seconds)1. Grip the snap ring with both hands and push the retainer into the carrier. Rotate it slightly to align the faces where the positioning frame slips into place.2. Attach the snap rin

16、g round the whole circumference and slide the cover down.ChaMP: For 150 or 200mm WafersFor 150 or 200mm WafersChaMP: Compact CMP SystemSmall footprint Wafer Probing MachinesWafer probing machines perform electrical tests of each chip on a wafer, ensuring the quality of semiconductor devices.Wafer Pr

17、obing Machines: UF3000EXNext-generation high-spec probing machine the world No.1 supplier presentsPhenomenal levels of throughput have been made possible with the synergistic effects of high-speed wafer handling enabled by a new algorithm, and the high-speed and low-noise XY Stage enabled by a newly

18、 developed purpose-built drive unit for probes. The Z axis ensures world-class load capacity and high precision, and offers excellent contact via an optimal structural design that employs topology which reliably eliminates changes in flatness due to positioning.With advanced OTS latest positioning s

19、ystem technology and by colorizing wafer alignment imaging and equipping a light super magnification function, the UF3000EX has improved dramatically in terms of precision and operability.Wafer Probing Machines: UF3000EX-eAssimilating the up-to-date technologies such as originative OTS, QPU and TTG,

20、 this super high-spec system provides the testing system which meets your needs for the miniaturization of the next-generation devices and various testing environment.Feature 1OTS - the newest positioning technology (Optical Target Scope)OTS enables to measure the relative position of the cameras wi

21、th absolute accuracy, which improved dramatically. Based on the ACCRETECH metrology technology, OTS enables the self-correlation of the alignment optical system.Feature 2QPU - super high-rigid chucking (Quad-Pod Unit)To effectively attain the accuracy in positioning, the high rigidity of every part

22、is greatly important. The UF3000 uses the new technology of 4 axes driving mechanism (QPU) for Z-axis, enabling the high-rigid, stable probe contact.Feature 3Load-portTesting environment satisfying the users needs is available by the common platform of 8-inch and 12-inch cassettes and the front allo

23、cation of the inspection tray. The machine is also ready for AMHS (Automated Material Handling System).Feature 4TTG (Touch To Go)Pursuing the easy operation, the UF3000 adopts the function to move to the position you touch on the map or image shown on the touch panel. Setting up is easy, and screen

24、configuration is possible by the user definition.Wafer Probing Machine: UF2000Tokyo Seimitsu, now known as Accretech, has continued to lead the semiconductor industry as the worlds number one manufacturer of wafer probing machines. The newly developed UF2000 high-precision 200mm wafer prober is desi

25、gned for devices with decreasing pad pitches typified by LCD drivers and other such devices, and features enhanced functionality in all areas, while offering the same functions and operating ease as the previous model.Feature 1Achieves overall precision of 1.5m.Feature 2Adopts new processor, newly d

26、esigned loader and image processing system with enhanced performance, dramatically boosting throughput.Wafer Probing Machine: UF200REvolving and Proliferating Wafer Probing Machine, UF Series Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are

27、varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.Feature 18-inch multipurpose machine.Wafer Probing Machine: UF190REvolving and Proliferating Wafer Probi

28、ng Machine, UF Series Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the w

29、afer level burn-in system.Feature 1High-performance, high-throughput, and excellent cost performance machine.Feature 2The UF190A features the same high-performance and excellent operability as the UF200 earned a reputation including the automatic needle alignment function and the color LCD touch pan

30、el.Wafer Probing Machine: FP200AEvolving and Proliferating Wafer Probing Machine, UF Series Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used

31、for processing very thin wafers and can be used as a handler for the wafer level burn-in system.Feature 1Frame transfer ready for the thinner wafer.Wafer Probing Machines Network: VEGANETThe operation status of the wafer probing machines can be centralizedly monitored to further improve the operatio

32、n rateSystem monitorOperation rate controlProber status monitorData analysisWafer Probing Machines Network: LIGHTVEGAThe resource control will be centralized on the user hostWafer Probing Machines Network: GEM Network SystemWafer Probing Machines Network: VEGA PLANETDedicated terminals contributing

33、to the efficiency enhancement of test areasFeature 1Device data compile terminalFeature 2Remote operation terminalFeature 3Logging data analysis terminalFeature 4Map viewerPolish GrindersPolish grinders simultaneously thin wafers while performing damage removal caused by the grinding process, and of

34、fer various applications for peripheral processes in the one system.Polish Grinder: PG3000/PG200PG3000PG200The product of a unique ACCRETECH innovation, this Polish Grinder combines the wafer thinness required for IC cards and three-dimensional mounting technology with damage removal functions in a

35、single device.Feature 1Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.Feature 2All the processes are completed without moving the wafer on the same chuck table.Feature 3The smallest footprint in the worldFeature 4Envir

36、onmental - friendly - subsurface damage reduction without chemicals.Feature 5System configurationPolish Grinder: PG3000RM/PG200RMPG3000 RM : For 300mm WafersPG200 RM : For 200mm WafersACCRETECH also offers the RM option, having the additional process of the tape removing for thinner wafer after the

37、tape mounting, in addition to the standard process of PG300/200.Feature 1Optional RM moduleThe RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames.Feature 2Performs th

38、e processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.Feature 3All the processes are completed without moving the wafer on the same chuck table.Feature 4The smallest footprint in the world.Feature 5Environmental - friendly - subsurface

39、damage reduction without chemicals.Feature 6System configurationWafer Dicing MachinesWafer dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.Wafer Dicing Mach

40、ines：AD3000T/STokyo Seimitsu Wafer Dicing Machine realizes the remarkable “CoO (Cost of Ownership)” by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of the up-to-date technology. Wafer Dicing Machines:A-WD-200THigh throughput achieved by a

41、 new concept The A-WD-200T uses an opposing, twin spindle arrangement. This unique concept minimizes motion and delivers a massive boost in throughput. Wafer Dicing Machines:A-WD-250SFully automated dicing machine for 8 inch wafer and large-sized substrates Wafer Dicing Machines: AD20TRevolutionary

42、axis design orientation creates the smallest twin spindle Dicing Saw Wafer Dicing Machines:A-WD-10BThis multipurpose dicing machine realizes ease of use with the adaptation of the much sought-after space saving factor, slide cover system and function management system. Wafer Dicing Machines:PS280Now

43、, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible! New connected handlers, shorten coordination time - bringing increased operation efficiency and substantial savings in processing time. Automatic

44、Cleaning System:A-CS-100AStand-alone wafer cleaning unit, A-CS-100A will provide best solution for cleaning and drying the wafer such as sawn with semi-automatic dicing saws. High-pressure water spray up to 10 MPa driven by horizontal swinging arm will achieve excellent cleaning quality. Wafer Dicing Machines:ML300High performance laser dicing machine for 300 mm waf