wire-bonding-详细学习资料PPT课件

1 WIREBONDPROCESSINTRODUCTION 2 CONTENTS ASSEMBLYFLOWOFPLASTICICWireBond原理M CIntroductionWireBondProcessMaterialSPECCalculatorDEFECT 3 封裝簡介 晶片Die 金線GoldWire 導線架Leadfram 4 WaferGrinding DieBonding WaferSaw toaster WireBonding DieSurfaceCoating Molding LaserMark SolderBallPlacement Singulation Packing 封裝流程 DejunkTRIM SolderPlating SolderPlating DejunkTRIM TRIM FORMING BGA SURFACEMOUNTPKG THROUGHHOLEPKG 5 WireBond原理 pad lead Goldwire BallBond 1stBond WedgeBond 2ndBond 6 Al B PRINCIPLE 7 銲接條件 HARDWELDINGPressure Force Amplify FrequecyWeldingTime BondTime WeldingTempature Heater THERMALBONINGThermalCompressureUltrasonicEnergy Power 8 BondHeadASSY LowimpactforceRealtimeBondingForcemonitoringHighresolutionz axispositionwith2 5micronperstepresolutionFastcontactdetectionSuppressedForcevibrationFastForceresponseFastresponsevoicecoilwireclamp 9 XYTable Linear3phaseACServomotorHighpowerACCurrentAmplifierDSPbasedcontrolplatformHighX Ypositioningaccuracyof 1mmResolutionof0 2mm 10 W HASSY changeover Fullyprogrammableindexer tracks Motorizedwindowclampwithsoftclosefeature OutputindexerwithleadframejamprotectionfeatureToollessconversionwindowclampsandtopplateenablesfastdevice 11 Eagle BondingSystemBondingMethod Thermosonic TS BQMMode ConstantCurrent Voltage PowerandNormal Programmable LoopType Normal Low Square JXYResolution 0 2umZResolution capillarytravellingmotion 2 5umFinePitchCapability 35mmpitch 0 6milwireNo ofBondingWires upto1000ProgramStorage 1000programsonHardDiskMultimodeTransducerSystem Programmableprofile controlandvibrationmodes MACHINESPECIFICATIONS I 12 Eagle VisionSystemPatternRecognitionTime 70ms pointPatternRecognitionAccuracy 0 37umLeadLocatorDetection 12ms lead 3leads frame LeadLocatorAccuracy 2 4umPostBondInspection FirstBond SecondBondWireTracingMax DieLevelDifferent 400 500umFacilitiesVoltage110VAC optional100 120 200 210 220 230 240VAC MACHINESPECIFICATIONS II 13 Eagle MaterialHandlingSystemIndexingSpeed 200 250ms 0 5 pitchIndexerResolution 1umLeadframePositionAccuracy 2milApplicableLeadframe W 17 75mm bondingareainY 65mm 17 90mm bondingareainY 54mmL 280mm Maximum T 0 075 0 8mmApplicableMagazine W 100mm Maximum L 140 300mmH 180mm Maximum MagazinePitch 2 4 10mm 0 09 0 39 DeviceChangeover 4minutesPackageChangeover 5minutesNumberofBufferMagazine 3 max 435mm MACHINESPECIFICATIONS III 14 BondingProcess 15 TheWireBondTemp PREHEATBONDSITECUL F200 10200 10ALL F210 10230 10BGA150 10160 10TFBGA150 10160 10LBGA150 10160 10NOTINCLUDEDEDICATELINE 16 pad lead Freeairballiscapturedinthechamfer 17 pad lead Freeairballiscapturedinthechamfer SEARCHHEIGHT 18 pad lead Freeairballiscapturedinthechamfer SEARCHSPEED1 SEARCHTOL1 19 Freeairballiscapturedinthechamfer pad lead SEARCHSPEED1 SEARCHTOL1 20 Freeairballiscapturedinthechamfer pad lead SEARCHTOL1 SEARCHSPEED1 21 Freeairballiscapturedinthechamfer pad lead SEARCHTOL1 SEARCHSPEED1 22 Freeairballiscapturedinthechamfer pad lead SEARCHTOL1 SEARCHSPEED1 23 Formationofafirstbond pad lead SEARCHSPEED1 SEARCHTOL1 24 Formationofafirstbond pad lead SEARCHSPEED1 SEARCHTOL1 IMPACTFORCE 25 FormationofafirstbondContact pad lead heat PRESSURE UltraSonicVibration 26 FormationofafirstbondBase pad lead UltraSonicVibration heat PRESSURE 27 Capillaryrisestoloopheightposition pad lead 28 Capillaryrisestoloopheightposition pad lead 29 Capillaryrisestoloopheightposition pad lead 30 Capillaryrisestoloopheightposition pad lead 31 Capillaryrisestoloopheightposition pad lead 32 Capillaryrisestoloopheightposition pad lead RH 33 Formationofaloop pad lead RD ReverseDistance 34 Formationofaloop pad lead 35 pad lead 36 pad lead CalculatedWireLength WIRECLAMP CLOSE 37 pad lead CalculatedWireLength 38 pad lead SEARCHDELAY 39 pad lead TRAJECTORY 40 pad lead TRAJECTORY 41 pad lead TRAJECTORY 42 pad lead TRAJECTORY 43 pad lead TRAJECTORY 44 pad lead TRAJECTORY 45 pad lead TRAJECTORY 46 pad lead TRAJECTORY 47 pad lead TRAJECTORY 48 pad lead TRAJECTORY 49 pad lead 2ndSearchHeight SearchSpeed2 SearchTol2 50 pad lead SearchSpeed2 SearchTol2 51 pad lead SearchSpeed2 SearchTol2 52 Formationofasecondbond pad lead heat 53 FormationofasecondbondContact pad lead heat heat 54 pad lead heat heat FormationofasecondbondBase 55 pad lead 56 pad lead 57 pad lead 58 pad lead Taillength 59 pad lead 60 pad lead 61 pad lead Disconnectionofthetail 62 pad lead Disconnectionofthetail 63 pad lead Formationofanewfreeairball 64 Material LeadframCapillaryGoldWire 65 Leadfram I 66 Leadfram II 67 CAPILLARY I CapillaryManufacturer SPT GAISER PECO TOTO CapillaryData Tip Hole CD FA OR IC 68 CAPILLARY II 69 CAPILLARY III HowToDesignYourCapillary TIP PadPitchPadpitchx1 3 TIPHole WireDiameterWirediameter 0 3 0 5 HCD Padsize open 1stBallCD 0 4 0 6 1stBondBallsizeFA OR Padpitch um FA 1000 4 90 1004 8 11 9011 15ICtype looptype 70 GoldWire GoldWireManufacturer Nippon SUMTOMO TANAKA GoldWireData WireDiameter Type 71 SPEC PadOpen BondPadPitchBallSizeBallThicknessLoopheightWirePullBallshortCraterTest 72 BPO BPP 單位 umorMilBPO 是指Pad內層X方向及Y方向的size 一般是取最小值為我們的dataBPO 是指Pad如左邊內層至右邊Pad左邊外層邊緣其它依此類推 或著一個Die上出現不同Pad大小那就是以兩個Pad中心距離為BPP 但是一般我們要取一個Die上最小的BPP BondPadPitch BondPadOpen BondPadOpen 73 BallSize BallThickness BallSize BallThickness 單位 um Mil量測倍率 50XBallThickness計算公式60umBPP 1 2WD 50 60umBPP 1 2WD 40 50 BallSize 74 LoopHeigh 單位 um Mil量測倍率 20X LoopHeight 線長 75 WirePull 1LiftedBond Rejected 2Breakatneck Referwire pullspec 3Breakatwire Referwire pullspec 4Breakatstitch Referstitch pullspec 5Liftedweld Rejected 76 BallShort 單位 gramorg mil BallShear計算公式Intermetallic IMC 有75 的共晶 SHEARSTRENGTH標準為 6 0g mil SHEARSTRENGTH BallShear Area g mil BallShear x BallSize y Area y 2 x y 2 zg mil 77 C Ballbond Testspecimen Specimenclamp Shearingram Wire Bondshoulder Interfacialcontactballbondweldarea Bondingpad h A Unsheared C L C Ballbond C L Testspecimen Specimenclamp Bondingpad Fullballattachedtowire exceptforregionsofintermetallicvoiding Ballseparatedatbondingpad Ballinterface residualintermetallic andsometimesportionofunalloyedballandmetal onpadinbondinteractionarea D Ballbond bondingpadinterfaceseparation typicalAutoAl C Testspecimen Specimenclamp Shearingram Wire Minorfragmentofballattachedtowire Bondingpad C L Ballshearedtoohigh offline etc onlyaportionofshoulderandballtopremoved Interfacialcontactballbondweldarea B Wire balltopand orside shear C Ballbond C L Testspecimen Specimenclamp Bondingpad Majorportionofballattachedtowire Interfacialcontact ballbondweldareaintact C Belowcenterlineshear ballshearedthrough typicallyAutoAu C Ballbond C L Testspecimen Specimenclamp Bondingpad Padmetallizationseparatesfromunderlyingsurface Residualpadonballball padinterfaceremainsintact E Bondpadlifts Testspecimen Specimenclamp C Ballbond C L Bondingpad Bondingpadlifts takingportionofunderlyingsubstratematerialwithit F Cratering Residualpadandsubstrateattachedtoball ball padinterfaceremainsintact ShearFailureModes 78 CraterTest 79 Calculate I UPTime TotalActualProductionTimes TotalRepairTime TotalActualProductionTime DOWNTIMERATE TotalRepairTime TotalActualProductionTimes TotalOperatorActualRepairTime TotalOperatorRepairFrequencyStoppages TotalActualProductionTimes TotalOperatorRepairTime TotalOperatorRepairFrequencyStoppages TotalTechnicalActualRepairTimes TotalTechnicalRepairFrequencyStoppages MTTS MEANTIMETOSTOP MTBS MEANTIMEBETWEENSTOP MTTA MEANTIMETOASSISTANCE 80 Calculate II MTBA MeanTimeBetweenAssistance TotalActualProductionTimes TotalTechnicanRepairTimes TotalTechnicalRepairFrequencyStoppages MTBF MeanTimeBetweenFailure TotalActualProductionTimes TotalTechnicianRepairTime TotalChangePartsRepairFrequencyStoppage 規格寬度 製程寬度 規格上限 規