微系统技术（北理内部讲义）讲解课件

MEMS 绪论,吴* 材料学院 Email: Tel:,5/14/2019,2,Introduction,1. 1、什么是微系统(MICROSYSTEMS) 1. 2、微系统相关技术基础 1.2.1、微电子技术(Microelectronics Technology) 1.2.2、射频与无线电技术(RF and Wireless Technologies) 1.2.3、光学技术(Optical Technology) 1.2.4、MEMS技术(MEMS Technology) 1. 3、什么是微系统封装(Micro System Packaging) 1. 4、什么是微电子封装(Microelectronic Packaging) 1. 5、微电子封装发展进程(Development) 1. 6、微系统封装技术的地位和作用(Role) 1. 7、微系统封装中的技术挑战(The Challenge),5/14/2019,3,1.1、What Is MICROSYSTEMS,微系统是以微电子技术、射频与无线电技术、光学(或光电子学)技术、微机电系统(MEMS)等技术为核心，从系统工程的高度出发，通过包封、互连等微细加工技术，在框架、基板等载体上制造、装配、集成微小型化功能装置。 我们所讨论的微系统大量应用于信息工程领域，因此微系统也可以称为信息工程微系统。 这些微系统包括计算器、个人电脑、移动电话、视频产品等消费类电子产品，以及计算产品、通信产品、汽车、航空航天产品、医疗电子等信息类产品，当今人类活动与技术进步都与这些各种各样的集成多功能微小系统密切相关。,1.1、What Is MICROSYSTEMS,Micro System regard microelectronic technology, RF and wireless technology, optical (or optoelectronics) technology, micro-electromechanical systems (MEMS) technology as the core, and it manufacture、assemble、 integrate functional micro devices from systems engineering perspective, through encapsulation, interconnection and other micro-processing technology in the framework, such as vector substrate. Micro System also known as micro-information system project. These micro-system, including consumer electronics products, information products, todays technological advances and human activities are closely integrated with the wide range of small-system.,The status of micro-system technology,5/14/2019,7,Microsystems Products And Related Yechnologies Relations,5/14/2019,8,微系统能迎来真正的蓬勃发展很大程度上归功于微电子技术的进步，因为超大规模集成电路的诞生为集成系统实现微型化提供了制造条件。 对于微系统的关键技术-微制造技术来说，微电子工程中的微细加工技术只是一个重要的基础部分，并不是全部，这是由微系统与微电子电路结构方面的差异决定的。 微系统可能包含一些可动构件以及传感器等，是光机电等多功能复杂系统高度集中的立体结构，而集成电路加工技术主要是平面二维的或浅表层，而且主要是对硅材料的加工。 因此，微系统的整个制造过程，即芯片加工、集成组装、封装测试等要比集成电路制造过程复杂得多。,微系统与集成电路制造的关系,The Relationship Between Micro-systems And The IC Manufacturing,Microelectronics technology promote the progress of the development of the micro-system，as it created the conditions of the realization of Microsistem . Micromachining technology of Microelectronics engineering is only an important part of the foundation for the key of Micro System Technology - micro-manufacturing technology, but it is not all, it was decided by the difference between a micro-systems and microelectronic circuit structure . Micro System may contain movable components and sensors, it is a multi-functional complex system of the three-dimensional structure of a highly centralized in optical and electrical machinery,by the contray，integrated circuits and processing technology is a two-dimensional surface or shallow, but the main thing is processing silicon . Therefore, the entire manufacturing process of Microsistem,such as chip processing, integrated assembly, packaging and testing of integrated circuits, is much more complicated than the manufacturing process of integrate circuit.,5/14/2019,10,微系统技术的发展已经使许多高速信息处理、大容量存储、超低功耗的电子产品成为现实，未来的微系统产品将覆盖人类生活的方方面面。 The development of Micro-system technology has many electronic products become a reality，such as high-speed information processing, large capacity storage, ultra-low power , the future of micro-system products will cover all aspects of human life.,5/14/2019,11,Smart Watches,5/14/2019,12,Multimedia Personal Communication Terminal,5/14/2019,13,Medical Spinal Cage Vsadek,5/14/2019,14,Micro-robot,5/14/2019,15,1.2 微系统相关技术基础,定义：微电子技术是基于半导体材料采用微米级加工工艺制造微小型化电子元器件和微型化电路的技术。 微电子技术特点： 技术渗透力强、附加价值高。 微电子器件与电路由原材料加工到成为产品，附加价值大幅度增加。 市场敏感、更新周期短。 集成电路以集成度每三年增加四倍、特征尺寸每三年缩小1. 414倍的摩尔定律发展。 技术密集、信息含量大。 微电子技术包括相关的设计、制造和封装技术，融合了材料、器件物理、计算机、光学、化学、真空、精密机械、理化分析等科学技术的最新成就。,微电子技术,1.2 Micro-system Technology Based,Microelectronics Technology Microelectronics technology is a technology which is based on semiconductor materials and using micro-processing technology manufacturing miniaturized electronic components and micro-circuit. Strong technology penetration and high value-added Market-sensitive and short-cycle update Technology-intensive and informative,5/14/2019,17,射频与无线电技术,射频和无线频段一般指10kHz-1000GHz，其技术发展可以追溯到1901年Marconi进行的无线电首次发送试验。 无线传播的优点使人们彻底从电线电缆连接中解放出来，使得人们可以在任何地点、任何时候进行通信联系、信息操作。 小型化、多功能、便携式、低成本射频装置成为无线通信推广应用的关键，也成为微系统技术应用的重要领域。 同时，采用先进射频模件的汽车防撞系统、全球定位导航系统(GPS)等一大批非通信类新型微系统日益受到市场的青睐。,RF & Wireless Technology,RF and wireless band generally refers to 10 kHz-1000GHz The advantages of wireless communication make people completely liberate from wires and cables connecting , can be made at any location、 any time communication links, and information operations. Small, versatile, portable, low-cost radio frequency wireless communication devices become a key application, also has become an important area of application of micro-system technology. At the same time, a large number of new non-communications-system，such as the use of advanced RF module vehicle collision avoidance system, global positioning navigation system (GPS)， is increasingly favored by the market.,RF / Wireless Applications,5/14/2019,20,光学技术,光学技术包括光信号的获取、处理、传输和显示，其中光电子技术是光学技术的重要部分。 人类正步入以互联网链接、海量数据处理为代表的信息社会，为克服传统的信号传输手段越来越不能适应技术发展的瓶颈，光纤技术得到了飞速发展。 现有光纤技术就可以在一根单模光纤上以10Tbit/s的速度传送信息；采用波分复用（WDM）技术，可以大幅度提高光信号传输的容量，并实现在同根光缆上传输不同波长（不同颜色）的光信号。 预计到2010年，光纤光缆不仅在主干通信网络上得到应用，而且可能在城市网、社区网，甚至家庭接人上得到应用，这将大大改变人类的生活质量和生活方式。,Optical Technology,Optical technology include optical signal acquisition, processing, transmission and display, photonics technology, optical technology is an important part. To overcome the traditional means of signal transmission can not meet the increasing technological development bottleneck, optical fiber technology has made rapid development. Existing optical fiber technology can be in a single-mode fiber to 10 Tbit / s speed transmission of information; using wavelength division multiplexing (WDM) technology,it will greatly increase the capacity of optical signal transmission and fiber optic cable can achieve the same root transmiting different wavelengths (different colours) optical signal.,The Potential Of Optical Technology Developing,MicroElectroMechanical Systems,In the United States, the technology is known as microElectroMechanical systems (MEMS); in Europe it is called microsystems technology (MST). MEMS is a portfolio of techniques and processes to design and create miniature systems; It is a physical product often specialized and unique to a final application-one can seldom by a generic MEMS product from the electronic shop; MEMS is a way of making things. These things merge the functions of sensing and actuation with computation and communication to locally control physical parameters at the microscale.,This Subject is Called,MicroElectroMechanical System (MEMS) in the United States. Microsystem in Europe Micromachines in Japan.,History,1750s Electrostatic motors demonstrated by Benjamin Franklin and Andrew Gordon. 1824 Discovery of Silicon by Berzelius. 1927 Field effect transistor patented to Lilienfield. 1947 Invention of the transistor (made from germanium). 1954 Piezoresistive effect in Germanium and Silicon invented by C. S. Smith. 1958 Silicon strain gauges available in the market. 1961 Silicon pressure sensor demonstrated by Kulite 1967 Surface micromachining invented. 1970 First silicon accelerometer demonstrated by Kulite. 1977 First capacitive pressure sensor demonstrated in Stanford. 1980 Silicon torsional Scanning Mirror demonstrated by K. E. Petersen. 1982 Demonstration of disposable blood pressure transducer.,History, Cont.,1982 Active on-chip signal conditioning. 1984 First polysilicon MEMS device (Howe, Muller). 1988 Rotary electrostatic side drive motors (Fan, Tai, Muller). 1989 Lateral comb drive (Tang, Nguyen, Howe). 1991 Polysilicon hinge (Pister, Judy, Burgett, Fearing). 1992 Grating light modulator (Solgaard, Sandejas, Bloom). 1992 MCNC starts MUMPS. 1993 Digital mirror display by Texas Instruments 1993 First surface micromachined accelerometer sold. 1994 XeF2 used for MEMS. 1999 Optical network switch by Lucent Technologies. Adapted from: Veljko Milanovic, Lecture Notes at Bekerly,What are MEMS?,MEMS is a class of systems that are physically small. These systems have both electrical and mechanical components. MEMS originally used modified integrated circuit (computer chip) fabrication techniques and materials to create these very small mechanical devices. Today there are many more fabrication techniques and materials available. Sensors and actuators are the two main categories of MEMS. Sensors are non-invasive while actuators modify the environment. Micro sensors are useful because their physical size allows them to be less invasive. Micro actuators are useful because the amount of work they perform on the environment is small and therefore can be very precise.,Precision Engineered Gears are shown here to be fabricated by a deep X-ray lithography and electrodeposition process. Each gear is 100 microns tall, made of nickel, and are held to submicron dimensions. MEMS can be used to create parts of systems where high tolerances are necessary. These gears bridge the gap between MEMS and traditionally machined precise components.,Magnetic Micro Motors can also be fabricated by a deep X-ray lithography and electrodeposition process. The rotor is magnetically salient to allow a magnetic field applied to each of the two poles to cause the rotor to turn. External loading gears have been added. This motor has been used to test the friction in gear trains by using an external magnetic field to drive the salient rotor. This is an example of a rotational actuator.,But, Not Only Miniaturization,MEMS devices are manufactured in a similar fashion to computer microchips. The biggest advantage here is not necessarily that the system can be minuaturized, but rather that the lithographic techniques that now mass-produce thousands of complex microchips simultaneously can also be used to manufacture mechanical sensors and actuators. As the price of these components is reduced to nearly zero, as has happened with microprocessors, they can deployed pervasively, revolutionizing future society to a greater extent, possibly, than even the microprocessor.,What are Microsystems? A microsystem is defined as an intelligent miniaturised system comprising sensing, processing and/or actuating functions. These would normally combine two or more of the following: electrical, mechanical, optical, chemical, biological, magnetic or other properties, integrated onto a single or multichip hybrid. Microsensors detect changes in the parameter to be controlled, electronic control logic then operates microactuators based on information from the sensors, to bring the parameter to be controlled within the desired limits.,Level demanded,Control Logic Circuit,Actuator,Parameters to be Controlled,Sensor,Sensors,Micro sensors measure the environment without modifying it. Micro sensors are useful because their small physical size allows them to be less invasive and work in smaller areas. So far, microengineering as a manufacturing technology has been applied most successfully to sensors. The pay-off in terms of miniaturization, improved performance, and reduced production cost have transformed the market in pressure sensors in particular. Microphones. Accelerometers. Vibration analyzers. Flow meters. Gas sensors. Radiation detectors. Chemical sensors. Ion sensors.,Comparison,Actuators,Actuation refers to the act of effecting or transmitting mechanical motion, forces, and work by a device on its surroundings in response to the application of a bias voltage or current. Microactuators interact with the environment. The first applications that were identified for microengineering were sensors. The notion of using these techniques for actuators has developed from them. Examples of actuators near or already on the market are listed below: Micropumps Pressure pulse ink jet actuators Thermal ink jets Thermal print heads Fluidic amplifiers Optical communications elements Scanning mirrors,Microstructures,There is a diverse range of mechanical objects that fall into neither the sensor nor the actuator category. They are best described as microstructures. These items are often no more than arrays of simple shapes such as grooves, holes, nozzles, grids etc. Examples include: Microsieves Optical elements Silicon hybrid circuit boards Microelectronic component cooling Silicon vacuum electronic valves Fluid isotope separators Microconnectors (electrical and optical).,Application Areas of MEMS,Invasive and noninvasive biomedical sensors Miniature biochemical analytical instruments Cardiac management systems (e.g., pacemakers, catheters) Drug delivery systems Neurological disorders Engine and propulsion control Automotive safety, braking, and suspension systems Electromechanical signal processing Distributed sensors for condition-based maintenance and monitoring structural health Distributed control of aerodynamic and hydrodynamic systems.,Why is MEMS Useful?,MEMS are physically small, this is the reason why MEMS is useful. MEMS used for sensors is useful because small sensors interfere less with the environment they are measuring than larger devices. An array of small sensors can also be used for redundancy. MEMS is useful for actuators because the motion they deliver can be very precise. MEMS devices can also be placed in small spaces such as inside automobile engines, small appliances, and living organisms to measure and/or affect their environment.,What is Microengineering?,Microengineering refers to the technologies and practice of making three dimensional structures and devices with dimensions in the order of micrometers. The two constructional technologies of microengineering are microelectronics and micromachining. Microelectronics, producing electronic circuitry on silicon chips, is a very well developed technology. Micromachining is the name for the techniques used to produce the structures and moving parts of microengineered devices. One of the main goals of Microengineering is to be able to integrate microelectronic circuitry into micromachined structures, to produce completely integrated systems (microsystems). Such systems could have have the same advantages of low cost, reliability and small size as silicon chips produced in the microelectronics industry.,Microengineering Enables,The production of smaller, lighter, and faster versions of existing mechanical devices, with increased dimensional accuracy, e.g. micromotors. The production of sensors, mainly exploiting the electromechanical properties of silicon, where electrical characteristics change in response to a change in a particular external parameter, e.g. temperature, pressure, acceleration, humidity and radiation. The use of materials and processes common to integrated microelectronics with micromechanical components bringing improvements in performance and cost. Batch processing to fabricate large volumes of miniature components at low cost, e.g. ink jet nozzles. The opportunity to extend process technology to include materials and techniques not used in microelectronics, but which offer specific advantages to micromechanical devices. The economic integrated manufacture of complete systems to include sensing, computation and actuation.,Markets for Microengineered Products,Microengineering not only provides a new manufacturing route for existing products, but also, importantly, allows the creation of completely new products and new markets. Microengineering is already established in the sensor market, providing large volumes of low cost sensors to the automotive industry, and low volume high performance, small and light weight sensors to aerospace and defence. The sensor market is expected to grow significantly in the next few years, with exceptional growth in the sub-category of miniaturized sensors. The projected MEMS market for the year 2002 is expected to reach 6.7B$.,Successful Applications,Automotive Industry Manifold air pressure sensors Air Bag Sensors Health and Medicine Blood Pressure Sensors Muscle Simulator Digital Mirror Display Video Projection System Printers HP and Canon.,MEMS在航空、航天、汽车、生物医学、环境监控、军事以及几乎人们接触到的所有领域中都有着十分广阔的应用前景 微惯性传感器及微型惯性测量组合能应用于制导、卫星控制、汽车自动驾驶、汽车防撞气囊、汽车防抱死系统(ABS)、稳定控制和玩具 微流量系统和微分析仪可用于微推进、伤员救护 MEMS系统还可以用于医疗、高密度存储和显示、光谱分析、信息采集等等 已经制造出尖端直径为5m的可以夹起一个红细胞的微型镊子，可以在磁场中飞行的象蝴蝶大小的飞机等,MEMS技术的应用,CCD camera : drivers and occupants status rain sensor(humidity) : wind brush action InfraRed, ultrasound, laser sensor : obstacle detection, navigation ice alert, twilight, radiation, humidity, rain, battery charge, intrusion, engine/steering torque etc. Temperatures : external/internal/treated air, exhaust (recirculated) gases, fuel, oils, seats, tires etc.,Pressure sensor(MAP, GAS from EGR, Barometric, Cylinders, ABS oil, Brake oil, Engine oil, Gear oil),Speed/Position sensor : engine RPM, Wheel speed, Steering speed,Mass flow : engine intake air, treated air, fuel,Inertial : navigation,Position : accelerator, pedal, butterfly, crankshaft, camshaft, mirrors, seats, steering, wheels,Inclination : body trim,Odor sensor, CO, NOx sensor : auto air conditioning,Oxygen sensor,Air, damper,Air, tire,Side impact,Acceleration : engine oscillation, body vertical/horizontal acceleration, crash detection-airbag, knock detection, ABS, Steering system, suspension system,MEMS技术的应用,在生物医学方面，将光、机、电、液、生化等部件集成在一起，构成一个微型芯片实验室，用于临床医学检测，为医生甚至家庭提供简单、廉价、准确和快捷的检测手段 光显示、高密度存储、汽车、国防等微系统,MEMS技术的应用,美国提出的硅固态卫星的概念图，这个卫星除了蓄电池外， 全由硅片构成，直径仅15cm,5/14/2019,51,MEMS技术呈现以下特征：,（1）研究方向多样化 MEMS技术的研究日益多样化，研究范围涉及多个学科、多个领域，如微惯性器件、RF MEMS(射频MEMS)、微型光学器件、Bio MEMS(生物MEMS)、数据存储等各种微传感器和微执行器; （2）制造工艺多样化 如传统的体硅加工工艺、表面牺牲层工艺、溶硅工艺、深槽刻蚀与键合工艺相结合、SCREAM工艺、LIGA和准LIGA加工工艺、厚胶与电镀相结合的金属牺牲层工艺、体硅工艺与表面牺牲层工艺相结合等; （3）MEMS传感芯片与信号处理电路单片集成化 （4）MEMS芯片制造与封装统一考虑。,5/14/2019,52,1.3 什么是微系统封装,微系统封装技术是指将若干个功能芯片，辅以必要的配件和装配平台，按照系统最优的原则集成、组合、构建成应用产品的相关工程技术。 微系统封装技术包括微电子封装技术、光电子封装技术、射频封装技术、MEMS封装技术和多功能系统集成封装等多个方面的封装技术。,1.3 What Is Micro System Packaging,Microsystems Packaging Technology is a applications manufacturing technology which refered to