用于微型 LED 封装的焊膏

深圳市福英达工业技术有限公司/一站式锡膏解决方案供应商SolderPasteforMiniLEDPackageMiniLEDisanewtypeofdisplaytechnologythatuses50-200micronLEDchipsasbacklightorpixelunits,achievingexcellentdisplayeffectssuchashighbrightness,highcontrastandhighcolourgamut,etc.ThechippackageprocessofMiniLEDmainlyadoptsflip-floppackage,wherebytheLEDchipisinvertedonacarrierboardandsolidifiedandelectricallyconnectedbysolderpasteorsolderadhesive.Thisprocessnotonlyeliminatesthestepofgoldwirebonding,butalsoimprovestheheatdissipationperformanceandreliabilityofthechip.DuetothesmallsizeofMiniLEDchips,therequirementsforsolderpastesolderarehigher,includingparticlesize,meltingpoint,wettability,voidrateandresidue.CurrentlyonthemarketcommonlyusedMiniLEDpackagingsolderpastesolderismainlydividedintotwotypes:mediumtemperaturesolderandlowtemperaturesolder.

Mediumtemperaturesolderreferstothemeltingpointbetween200-250degreesCelsiuslead-freealloysolder,themostcommonisSAC305(Sn96.5Ag3Cu0.5)alloy.Thisalloyhasgoodwettabilityandsolderstrengthandissuitableforuseintheformofsolderpasteorsolderglue(epoxyresinbasedsolderpaste).TheadvantageofmediumtemperaturesolderisthatitiscompatiblewithtraditionalSMTprocessesandcanbesolderedusingexistingequipmentandparameters.Thedisadvantageisthehighermeltingpoint,whichmaycausethermalstressandthermaldamagetotheLEDchipandcarrierboard.

Low-temperaturesolderreferstolead-freealloysolderwithameltingpointbelow200degreesCelsius,themostcommonbeingtheSnBi/SnBiAgseriesofalloys.Themeltingpointofthisalloyisonly139degreesCelsius,nearly80degreesCelsiuslowerthanSAC305,whichcaneffectivelyreducethethermalimpactontheLEDchipandthecarrierboard,improvethequalityandreliabilityofwelding.Theadvantageoflow-temperaturesolderisthatthethermalstressissmall,suitableforhigh-density,high-precisionMiniLEDpackage.Thedisadvantageispoorwettability,requiringtheuseofspecialfluxesandequipmentforsoldering.

Fitech8PowderMiniLEDMediumandLowTemperatureSolderPasteProductSeriesShenzhenFitechistheworld'sleadingmanufacturerofmicroelectronicsandsemiconductorpackagingultra-finesolder,itsmediumtemperaturesolderpasteFitechmLED1550(T8)withSAC305(Sn96.5Ag3Cu0.5)solderalloy,meltingpointbetween217-219degreesCelsius,withgoodsolderstrengthandwettability.FitechmLED1370(T8)lowtemperaturesolderpasteadoptstin-bismuth-silveralloy(Sn42Bi57.6Ag0.4),whichhastheadvantageoflow-temperaturesoldering,lowrequirementforhightemperatureresistanceofthedevice,andcanbeusedforsecondaryreflow.AsSn42Bi57.6Ag0.4adds0.4Ag,itssolderingperformanceandpost-solderreliabilityisbetterthanSn42Bi58.Forhigherreliability,youcanchooseourtinglueproducts,whichuseepoxyresinaroundthesolderjointstoformareinforcingeffect.

FT-170/180/200low-temperaturesolderpasteisakindoflow-temperaturesolderwithbothlow-temperatureandmechanicalreliability,themeltingpointcanbeselectedfrom170/180/200°C.Unliketraditionaltin-bismuth-silveralloys(Sn42Bi57.6Ag0.4)andtin-bismuthalloys(Sn42Bi58),thebrittlenessofthesolderjointsissmaller.Theproductusesmicroandnanometalparticlestochangeth