ecs0ecs h110aio intel1g独显主板技术规格书

送：■台式产品中 ■行业台式产品中 ■客户服务中 ■供应品质管理 拟制：认证工程师： 文件序号 日期产品种类：主料品代号 型号及版本：ECSH110-AIO H1101G（920M）独显AIO主评测工程师：供应厂商：制造厂商/生产厂商：2、贵司产品变更，必须向提出申请，待批准后方可交付：新产品引主板使用后I/O□厂商自带挡片，型 备注：如果使用厂商自带挡片，则需同时在下面的“附件”编号1I/O片无2主板BIOSBIOS（BIOS应有影响EMI的选项）智能驱动光盘对应驱动光盘路径（按操作系统分类1、EMI&WHQL结果辐射骚扰BB六类非平衡五类非平衡1.2部件适用的同方整机机型、部件的信CCC整机产品同方CCC报告号同方计算机30M-1GEMI1IN网口个数：11G-6GEMI号□百兆传告2（PCB材*GY(SHEN3*4*1G5*orCorp.3、有害物铅镉六价 多溴二苯主板▲○○○○○：表示该有害物质在部件所有均质材料中的含量均在GB/T26572-2011规定的▲：表示该有害物质至少在该部件的某一均质材料中的含量超出GB/T26572-×：表示该有害物质至少在部件的某一均质材料中的含量超出GB/T26572-规定的限量要求，且也不符合欧盟RoHS指令（包括其豁免条款注1：新厂家引入要求提供环保并加盖公章注2：新部件引入要填写“有害物质或元素的名称及含量标识”表，并提供相注3：部件变更（有料件变更时）要求填写“有害物质或元素的名称及含量标44台式主板节能和能效指（主板可装配CPU类别可为多2能报告中每类的最高配

主板新品引入按照B配置：新主板+双核最高主频CPU+920M+4G内存 LINUX三种操作系统主板型号 ；制造商 BWIN7在空闲状态下：一级≤31.0W;二级≤45.0W; 主板可装配CPU双 型号 主频：-_3.5_GHz制造商B类 WIN10在空闲状态下：一级≤31.0W;二级≤45.0W; 主板可装配B类 LINUX操作系统在空闲状态下：一级≤31.0W;二级 三级主频 GHz制造商 主板可装配双 型号□双核GHz制造商：B评测结果:■台式及一体机显卡节能和能效辅助 DR=2002 16独立显示单元（GPU）附加功能功耗因子：46kWh( 6方+企业自己共同出具（第必须是CNAS；企业自己出具报定型检验报告模板参考TFPC/DD-N-08《方电脑产品定型检验和周期检验规范》第1.5版本附录《产品定型周期检验报告》的模板。6.1（GB/T9813-1P23电源（除电源适配器456P789幅射骚扰应符合GB9254-2008且检测值低于B级标准线4有I/O卡、键盘、鼠标、显示器、LCD电路、含LCDP符合GB9254-2008且低于B5dB(µV骚扰应符合GB9254-2008低于B级标准线4dB(µV)。P谐波电流应符合GB抗扰度应符合GB/T机箱、I/O扰分浪涌（冲击(运行burnintest版本PPPPP落P应符合GB/T26572-2011GB/T26125-2011、P应符合GB28380-2012。所配0.2946m(11.6P应符合GB28380-2012。所配GB20943-2007HJ/T313-2006P1：2：部件的定型检验报告参考选取整机定型检验报告模板的相关部分出具。注3：判定格式：通过—P；不通过—F；不适用—N。4：5：所有部件：除CPU，软件、虚拟物料及辅料以外的其它所有部件均需定型检6：本技术规格书仅适用实物物料，CPU一 技术规ProcessorINSKYLAKE-HSocketLGAChipsetINPCBPCBPCBPCBModelPCBVRDVRMIC.ISL95858HRZ-QFNAXGDFN3Main Dual2133TotalMAX2ECCYICName&ICSUPERBX..LQFPICName&ICCG..QFNYICName&2.1(5.1viaAMPVGAICF/W066(R)..QFN32POnboardOnboardUSBICName&BIOSICSPIROM.64M.W25Q64FVSSIG.WINBONDICSPIROM.64M.MX25L6433FM2I-08G.ICSPITotalUSB2PCSConnectorTotalUSB4PCSConnector2OnboardPCI-EPCI-EPCI-EMiniPCIEMiniPCIEM.2M.2Rear AudioFrontMonoFront2PCS(TouchFrontWIFI/BT/LANCaseThermalHI-TOP/MOSTRAIDWakePowerYACPIRTCYNOnboardYNPS/2YMotherboardMainComponentChipsetList（total SOCSYSCHIP ICPCH.SKYLAKE-HH110D1..FCBGAIN1151Processors:INSKYLAKE-HProcessorsMemorytype:DDR4Supportmax□√A:B:C:（4）支持CPU最大功率（6）SupportUSB:Support6USB2.0/3.0(USB2.0Conn*2pcs;AUDIO(U34，AMP1)□√A:B:C:LANOnBoard □√A:B:C:SUPERI/O □√A:B:C: ICGPU.N16V-GMR1-S-A2.(BUY- □√A:B:C:BIOS □√A:□√B:√C: □√A:B:C:DISY SU1□√A:B:C: □√A:□√B:□√C:CLOCKCHIP A:B:C: □√A:□√□√C: □√A:□√B: X2□√A:□√B: X3□√A:□√B: □√A:□√B:ImportantelectroniccomponentLIST（total：20_CPU_H/(QC3,QC4,QC5)MOSFETDUALN-CH.SM7340EHKPC-TRG..OHM.DFN5X68P...LEAD-.SINOPOWERMOSFETDUAL□√A:□√B:□√C:OHM.DFN5X68P.....LEAD-MOSFETDUALN-Vgs=20V.Id=18A/38A.Rds(on)=3.5mOHM.PG-TISON8-4.....LEAD- NAA:B:C: NA)A:B:C: QC1,QC2MOSFETDUALN-CH.SM7340EHKPC-TRG..OHM.DFN5X68P...LEAD-□√A:□√B:□√C:MOSFETDUALOHM.DFN5X68P.....LEAD-MOSFETDUALN-Vgs=20V.Id=18A/38A.Rds(on)=3.5mOHM.PG-TISON8-4.....LEAD- QC6MOSFETDUALN-CH.SM7340EHKPC-OHM.DFN5X68P...LEAD-.SINOPOWER□√A:□√B:□√C:MOSFETDUALOHM.DFN5X68P.....LEAD-MOSFETDUALN-Vgs=20V.Id=18A/38A.Rds(on)=3.5mOHM.PG-TISON8-4.....LEAD-MOSFET_SB1(,QD5H2Vgs=20V.Id=50A.Rds(on)=7mOHM.KPAK.....LEAD-MOSFETN-CH.PK516BA..Vds=30V,Vgs=20V.Id=51A.Rds(on)=7mOHM.POWERDFN5X68P.....LEAD-.NIKO-MOSFETN-CH.QM3106M6..Vds=30V,Vgs=20V.Id=56A.Rds(on)=8.2mOHM.PRPAK5X68P.....LEAD-□√A:□√B:NIKO-□√C:MOSFET_SB2QD5L2)MOSFETN-CH.SM4364NAKPC-TRG..Vds=30V,Vgs=20V.Id=60A.Rds(on)=5.7mOHM.KPAK.....LEAD-.SINOPOWERMOSFETN-CH.PK618BA..Vds=30V,Vgs=20V.Id=59A.Rds(on)=5.5mOHM.POWERDFN5X68P.....LEAD-.NIKO-SEMMOSFETN-CH.QM3110M6..Vds=30V,Vgs=20V.Id=81A.Rds(on)=4.9mOHM.PRPAK5X68P.....LEAD-□√A:□√B:NIKO-□√C:(EC12,EC18)E/COperatingTemperatureRange:-55℃toESR:30mΩ(at□√A:□√B:□√C:□√D(EC10,EC11,EC14,EC15)E/COperatingTemperatureRange:-55℃toESR:8.0mΩ(at□√A:□√B:□√C: NA)A:B:C:ECAP_MEM_2 N/A)A:B:C:ECAP_M.2 OperatingTemperatureRange:--55℃toESR:2.38Ω(at120Hz);0.28Ω(at□√A:□√B:□√C: N/AA:B:C:(EC34,EC35OperatingTemperatureRange:--40℃□√A:□√B:□√C:ESR:0.310Ω(at NAA:B:C: POWER□√A:□√B:□√C:MAG POWER□√A:□√B:□√C:MAGJUMPERSANDCONNECTORSLIST(total:31CPUSOCKET □√A:□√B:□√C:(ERSOCKET.MEMORYCARD3IN1..19P□√A:√B:C:2DDR4SODIMMSO-DIMM2:SOCKET.S.ODIMMDDR4..260PSMD.P0.5mmH9.2mm.15u.BLACKSMD.P0.5mmH5.2mm.15u.□√A:□√B:□√C:(NGFF1,M1NGFF1:SLOT.NGFFM.2..67P2R90DSMD.H3.2.BLACK□√A:□√B:□√C:PCIE_1X N/AA:B:C: N/AA:B:C:()□√A:□√B:HI-□√C: CONN.D-TYPEMTIN..9P2R□√A:□√B:HI-□√C:CONN.D-TYPEFM□√A: □√B:□√C:HI-LPTConnector A:B:C:(IN1,HDMIOUT1)CONN...19P90D□√A:CO-□√B:□√C:HI- CONN.LVDS..40P1R90D□√A:□√B:C: MARK:CONSER/□√A:□√B:HI-□√C: USB3_0)USB3_1,USB3_2:CONN.USB3.0..9PUSB3_0:CONN.USB(3.0)DUALPORT..18P90D□√A:□√B:□√C:HI- MARK:JACK□√A:□√B:□√C:()MARK:RUIYE/JACK□√A:□√B: N/A)A:B:C:(CPU_FAN1HEADER.BH..4*190D□√A:JOINT□√B:□√C: A:B:C: □√A:□√B:□√C: A:B:C: N/AA:B:C:KB_MSHeader N/A)A:B:C: A:B:C:Front F_PANELEADER.BH..15*190D□√A:□√B:JOINTC:TouchHeader HEADER.BH..5*190D□√A:□√B:JOINTC: WEB_MICDMIC1:HEADER.BH..5*190DSMDWEB_MIC:HEADER.BH..9*190DSMD□√A:□√B:JOINTC:(CLR_CMOSHEADER...3*1□√A:□√B:□√C: N/AA:B:C:(SPEAKER1HEADER.BH..4*190