目视检验规范演示文稿

目视检验规范演示文稿目前一页\总数三十三页\编于十点目视检验规范目前二页\总数三十三页\编于十点目視檢驗規范標准IPC6101.允收標准

2.拒收標准

目前三页\总数三十三页\编于十点零件本體僅下方有二接觸點的零件

(ChipComponents/BottomOnlyTerminationscont.)

–偏移(Shift)允收(TargetCondition)零件黏焊於錫墊中心位置,沒有任何偏移.

Nosideoverhang.

允收極限(Acceptable)零件往錫墊寬邊(A)偏移,但零件本體寬邊(C)有75%以上焊接於錫墊上.零件本體與電路板錫墊間(G)錫厚至少0.2mm.Sideoverhang(A)isallowedifminimumendjointwidth(C)requirementsaremet.Minimumis75%.Minimumthickness(G)is0.2mmunlesssatisfactorycleaningcanbedemonstratedwithreducedclearance.

拒收(NonconformingDefect)零件往錫墊寬邊(A)偏移,且零件本體小於75%寬邊(C)焊接於錫墊上.零件往錫墊長邊(B)偏移.Sideoverhang(A)isallowedifminimumendjointwidth(C)requirementsaremet.Minimumis75%.Minimumthickness(G)is0.2mmunlesssatisfactorycleaningcanbedemonstratedwithreducedclearance.

目前四页\总数三十三页\编于十点零件本體有1,3,5面矩形金屬焊接點

(RectangularEndComponents-1,3or5sideTermination)–偏移(Shift)允收(TargetCondition)零件金屬部份黏焊於錫墊中心位置,沒有任何偏移.零件本體錫墊完全沾錫.Nosideoverhang.Sidejointlength(D)equalscomponentterminationlength.允收極限(Acceptable)零件往錫墊寬邊(A)偏移,但零件本體金屬焊墊寬邊(W)75%以上焊接於電路板錫墊上.Endjointwidth(C)is75%widthofcomponentterminationarea(W)or75%widthofPBland(P),whicheverisless.

拒收(NonconformingDefect)零件往錫墊寬邊(A)偏移,但零件本體不足75%寬邊(C)以上焊接於電路板錫墊上.零件往錫墊長邊偏移(B).Sideoverhang(A)causesminimumendjointwidth(C)requirementsnottobemet.Endoverhang(B)isnotpermitted.

目前五页\总数三十三页\编于十点零件本體有1,3,5面矩形接觸點

(RectangularEndComponents-1,3or5sideTermination)–偏移(Shift)允收(TargetCondition)零件黏焊於錫墊中心位置,沒有任何偏移.零件本體錫墊完全沾錫.Nosideoverhang.允收極限(Acceptable)零件往錫墊寬邊偏移,但零件之焊接面佔75%以上.Endjointwidthis75%widthofcomponentterminationareaor75%widthofPBland,whicheverisless.拒收(NonconformingDefect)零件往錫墊長邊偏移.Endoverhangisnotpermitted.

目前六页\总数三十三页\编于十点圓柱體零件(CylindricalEndCapTermination)–偏移(Shift)允收(TargetCondition)零件黏焊於錫墊中心位置,沒有任何偏移.吃錫面在圓筒零件直徑(W)與板上錫墊長(P)之間.Nosideoverhang.Endjointwidthisequaltoorgreaterthanthecomponentwidth(W)orwidthoftheland(P),whicheverisless.允收極限(Acceptable)零件往錫墊寬邊偏移(A),側邊偏移度允收極限為零件直徑(W)的25%或錫墊長度(P)的25%.Sideoverhang(A)is25%diameterofcomponentwidth(W)orlandwith(P).拒收(NonconformingDefect)零件側邊偏移度(A)超出25%零件直徑(W)或錫墊長度(P)的25%.零件往錫墊長邊偏移(B).Sideoverhang(A)is25%diameterofcomponentwidth(W)orlandwith(P).Endoverhangisnotpermitted.目前七页\总数三十三页\编于十点無導腳零件

(LeadlessChipCarrierswithCastellatedTerminations)–偏移(Shift)允收(TargetCondition)零件未偏移.零件延伸引腳長等於電路板上錫墊長.零件立於電路板上錫墊中心.Nosideoverhang.Filletextensionequalslandwidth.Filletheightcoversterminal.允收極限(Acceptable)零件偏移向錫墊寬邊之間(A),偏移度小於電路板上錫墊面(W)的25%.Maximumsideoverhang(A)is25%W.拒收(NonconformingDefect)零件偏移向錫墊寬邊之間(A),偏移度大於電路板上錫墊面(W)的25%.零件偏移向錫墊長邊之間(B).Maximumsideoverhang(A)is25%W.Endoverhang(B)isnotpermitted.目前八页\总数三十三页\编于十点允收(TargetCondition)零件腳未偏移.Nosideoverhang.允收極限(Acceptable)零件偏移向錫墊寬邊之間(A),偏移小於電路板上錫墊寬度(W)的25%或偏移小於0.5mm.Sideoverhang(A)is25%Wor0.5mm.拒收(NonconformingDefect)零件偏移向錫墊寬邊之間(A),偏移大於電路板上錫墊寬度(W)的25%或偏移大於0.5mm.不允許任何的零件趾端偏移如(B).Sideoverhang(A)isgreaterthan25%Wor0.5mmwhicheverisless.Toeoverhang(B)isnotspecified

平緞腳(L型)/鷗翼腳/圓柱L腳

(FlatRibbon"L"/GullWingleads/Roundleads)–偏移(Shift)目前九页\总数三十三页\编于十点"I"腳(“I”Leads)–偏移(Shift)允收(TargetCondition)零件腳未偏移.Nosideoverhang.允收極限(Acceptable)零件偏移向錫墊寬邊之間(A),偏移大於錫腳寬度(W)的25%仍不允許.不允許任何的偏移.Overhang(A)exceeds25%leadwidth(W).Nooverhangallowed.拒收(NonconformingDefect)不允許任何的零件趾端偏移如(B).

Toeoverhang(B)isnotspecified.目前十页\总数三十三页\编于十点範例(Example)-平緞腳(L型)/鷗翼腳/圓柱L腳

(FlatRibbon"L"/GullWingleads/Roundleads)允收(TargetCondition)允收極限(Acceptable)拒收(NonconformingDefect)目前十一页\总数三十三页\编于十点範例(Example)-平緞腳(L型)/鷗翼腳/圓柱L腳

(FlatRibbon"L"/GullWingleads/Roundleads)拒收(NonconformingDefect)拒收(NonconformingDefect)拒收(NonconformingDefect)目前十二页\总数三十三页\编于十点範例(Example)-"J"腳/"I"腳允收極限(Acceptable)拒收(NonconformingDefect)拒收(NonconformingDefect)ë目前十三页\总数三十三页\编于十点範例(Example)拒收(NonconformingDefect)高翹/LIFTED目前十四页\总数三十三页\编于十点範例(Example)高翹/LIFTEDOKNG目前十五页\总数三十三页\编于十点範例(Example)拒收(NonconformingDefect)折腳/BENT缺件/MISSING

偏移/SHIFT目前十六页\总数三十三页\编于十点範例(Example)拒收(NonconformingDefect)破損/DAMAGE

目前十七页\总数三十三页\编于十点範例(Example)拒收(NonconformingDefect)撞件/BROKEN撞件/BROKEN

目前十八页\总数三十三页\编于十点範例(Example)允收極限(Acceptable)偏移/SHIFT

錫洞/SolderHole

目前十九页\总数三十三页\编于十点範例(Example)ASR1:LED2反向/REVERSE拒收(NonconformingDefect)ë缺口端為負極/Nicksideis“－”

5168:SW4反向/REVERSESwitch數字與PCBA同向/NumberoncomponentsamedirectionwithPCBA.目前二十页\总数三十三页\编于十点目前二十一页\总数三十三页\编于十点範例(Example)折腳/PINBENT包焊/PoorSolder拒收(NonconformingDefect)目前二十二页\总数三十三页\编于十点範例(Example)拒收(NonconformingDefect)NG

OK退PIN

目前二十三页\总数三十三页\编于十点TravisM/BDIPcomponentcosmetic1,整体高翘，且最大不可以超过0.3mm2.后邊、前邊緣高翹不可超過0.2mm整體高翹單邊高翹目前二十四页\总数三十三页\编于十点TravisM/BDIPcomponentcosmetic1.水平高翘，最大允许限度为0.3mm.2.不允许單边高翘。目前二十五页\总数三十三页\编于十点TravisbasesampleRAM的卡勾不可出现变形等不良。目前二十六页\总