南亚PNHF材料介绍20110108课件

CCLTechnicalDept.,ElectronicMaterialsDiv.NanYaPlasticsCorporationTAIWANNanYaMultilayerPCBLaminatesEnvironmentalProtectionSignalSpeed&IntegrityReliabilitySmallerFormFactorPCBTechTrendsBuildup/HDIPhosphorousFreeImpedanceControlNarrowerLineSpacingFlexibleEmbeddedPassivesHighLayerCountLowDk/LowLossHiTgInsulationLowCTEHalogenFreeLowWaterAbsorptionCAF-Resistant產品開發與應用LeadFreeCompatible•NP-200(BTGrade)

•NP-180F(HiTg&LowCTE)•NP-175(F)•NP-155(F)•NP-170•NP-150•

NP-140M(LowTg/HiTd)•Anti-CAFMaterials•HighCTIFR4•NPGNPGN-150NPG-170NPGN-170•

NPX-200(ForSubstrates)•

Bendable

CCL•

LaserPrepreg•

RCC•2mil&3milCores•Ultrathinglassyarn1037•EmbeddedCapacitance•NPLDII&

LowDkglass南亞產品列表TG℃

TgbyDSC

SuitableforLeadFree

OptionalforLeadFree◎NPG(HalogenFree)NPG-200NPG-170NP-LDII

NP-175/FNP-170NP-155/FNP-150FR-4D/S200NPG-180

HighTg(H.F)highlayercountMLBICSubstrateNP-200BTLaminateICSubstrates

BTLaminate(H.F)ICSubstrateNP-180/FFR-5GradehighlayercountMLBICSubstrateRCCFR-4GradehighlayerCountMLB

HighTg(H.F)highlayercountMLBHighperformanceFR-4SpecialapplicationFR-4-86UVFR-4-98CTI600NPGNPGN-150

HalogenFreeFR-4NP-140MNP-140FR-4Tetra-functionalforMLB180CEM-3CEM-1CEM-3-86/CEM-3-01HalogenfreeCEM-1-87/CEM-1-97CTI600LaserPP

LaserdrillableprepregforHDI175150140135130LowDk/DfHighfrequency/lowloss

ResincoatedcopperforHDI180180O

O

O

O

O

O◎◎◎◎“無鉛”對元件組裝影響●無鉛組裝之焊錫材料熔點更高●回流焊過程有更高的溫度曲線焊錫類型熔點(℃)I.R最高溫度（℃)高溫.Sn-Ag-Cu(96.530.3)217～220245～260較高溫度.Sn-Ag-Cu-Bi(in)210～220235～245一般Pb-Sn(3367)183225～230

Soaktime

Ramp-uprate

℃

Leadfreereflow(SnAgCu)

Tin/Lead(63/37)reflow

迴流焊溫度曲線比較T:30-44℃T:20-30℃PeakTempTimeaboveliquidus(TAL)500100150200250Meltingpoint

LFMeltingpoint高耐熱性(Br-樹脂)覆銅板產品系列NP-150NP-200NP-180TG(℃)NP-140200180175150140BTLaminateFR-5GradeMediumTgFR-4

FR-4NP-180(F)

NP-175NP-175F

NP-155NP-155FNP-140Modify(New)HighThermalStabilityMaterialNP-170HighTgFR-4IPC規范vsNanYa材料ItemFR4NPGNPGN-150NPG-170NPGN-170NPG-180NPG-200ResinsystemBr.EpoxyHalogenFreeHalogenFreeHalogenFreeHalogenFreeHalogenFreeHalogenFreeCuringagentDicyDicyNonDicyDicyNonDicyNonDicyNonDicyTg(℃,DSC)140150145(TMA)170170190(DMA)205(DMA)CTE(%,50~250℃)4.12.42.42.32.42.22.0T-260(min)25>60>60>60>60>60>60T-288(min)2>5>20>5>20>40>40Td(℃,TGA)310350360359360367370Dk(@1GHz)4.504.604.504.604.534.824.40Df(@1GHz)0.0160.0120.0130.0120.0130.0150.013Rigidconstruction:4ply7628NPG:“G”forGreen(HF)Materials南亚各系列无卤材料特性比較HATS冷热冲击测试结果MaterialAconditionPre-condition245℃reflowx6Pre-condition260℃reflowx6一般材料162-247150-266142-227Mid-Tg

PN+填充材>1000>1000800-900Hi-TgPN+填充材>1000>1000>1000无卤材料>1000>1000>1000TestCondition:-40-145℃/1000cyclesSample:12-layertestvehicle线路板加工之影响一般材料无卤材料钻孔2,000钻1,500钻除渣OK需调整制程条件黑棕化药水OK接着力较低

压合操作空间較广需调整制程条件印刷线路板加工条件之建议钻孔条件MachineHolesizSpeedInfeedRTRThkPNL/StsckSchmollLZ0.30mm160Kr/min134IPM437IPM1.62ply钻头磨损比较1000hit2000hit3000hitTotal(48000hit)NPG

24.46%30.72%36.52%30.56%NPGN-15025.28%27.32%32.93%28.51%

NPG&NPGN-150鑽孔比對測試钻孔精度比較NPGNPGN-150Cp/Cpk1.334/0.7851.859/1.204Target(>2.0mil)1325/48098660/481042.75%1.37%MaterialtypesBlackOxideBrownOxideChemicalABCDStandardFR44.933.854.563.57NPG3.233.123.012.74NPGN-1503.693.463.593.12Unit:lb/in无卤材料内层黑棕化接着强度比较無鹵材性能比較表-CCLNPG(Dicy)NPGN-150(PN)PCBLayer10L14LThicknessmm1.8-2.02.4-2.5DSC-Tg℃155150.6288℃Solderfloating10”->6cycles>10cycles260℃IRReflowcycles-6-