HDMI-114A-版本介绍及生产工艺

1、HDMI SPEC & HDMI Cable制程.低压差分信号传输:LVDSLow VoltageDifferential Signaling)笔记本和液晶显示器内部用于衔接驱动模块和屏幕面板常用内部界面外部界面电视上常用RF射频、Composite复合视频、S-VideoS端子、Component色差端子回想当前显示领域的多种界面.外部界面RF界面Composite界面S端子色差端子端子回想当前显示领域的多种界面.外部界面PC常用VGA、DVI、IEEE 4回想当前显示领域的多种界面 这些界面大多是随着时代提高而不断更新的产物，种类过于繁多，且规范各不一致。随着显示器件的分辨率不断提升，彩色

2、深度不断提升，对于传输驱动信号的界面要求也不断提升，以上这些界面技术曾经无法满足需求 .HMDI的诞生HDMI，英文全称是High Definition Multimedia Interface，中文称号是高明晰多媒体界面的缩写。2002年4月，日立、松下、飞利浦、新力、汤姆逊、东芝和Silicon Image七家公司结合组成HDMI组织 ，随后发行HDMI规范:2002/12/09V1.02004/05/20V1.12005/08/22V1.22005/12/14V1.2a2006/06/22V1.32006/11/10 V1.3a2007/03/26 V1.3b2021/03/04 V1.

3、4a.HMDI Version HistoryHDMI 1.0HDMI 1.1HDMI 1.2HDMI 1.3HDMI 1.3aHDMI 1.3bHDMI 1.4/1.4aInitial SpecificationAdded support for DVD AudioAdded supportIncreases bandwidth to 10.2Gbps (340Mhz)修改Cable and Sink的HDMI C Type 接头主要是修改HDMI 测试规格(HDMI Testing specification), 而 HDMI Specification依然是HDMI 1.3a。所以第一次

4、出现当时的主要的HDMI Specification 跟测试规格(HDMI Testing specification)是不同版本的情况发生。HDMI Ethernet Channel Adds high-speed networking to an HDMI link, allowing users to take full advantage of their IP-enabled devices without a separate Ethernet cable. (more)for SACD AudioPermitted PC applications to use only RGB

5、color spaceOffers support for 16-bit color, increased refresh rates (ex. 120Hz), support for 1440p/WQXGA resolutionsSource termination recommendationHDMI Testing specification 1.3b 修改部分： Audio Return Channel Allows an HDMI-connected TV with a built-in tuner to send audio data upstream to a surround

6、audio system, eliminating the need for a separate audio cable. (more)Supported low-voltage (AC-coupled sources) in PCsSupports xvYCC color space standard移除上升时间(rise time)和下降时间(fall time)的最高最低限制1.3b 2007/03/26 Modifications to TE overview and policy description (4.1),Addition of Agilent TDR to Recomm

7、ended TE (4.2.1.11),Clarification of tentative cable emulators (4.2.1.17)3D Defines input/output protocols for major 3D video formats, paving the way for true 3D gaming and 3D home theater applications. (more)Adds mini connector改变CEC电容限制Jitter tolerance test changes (8-7),Added cable tests for TMDS_

8、CLOCK channel (5-3),New VL triggering (7-2)4K Support Enables video resolutions far beyond 1080p, supporting next-generation displays that will rival the Digital Cinema systems used in many commercial movie theatres. (more)Adds support for Dolby TrueHD and DTS-HD Master Audio standards澄清RGB 影像量化范围Ed

9、itorial and clarifications on CEC Line Degradation (7-15, 8-14),Added testing of additional source-supported Deep Color formats (7-34,)Additional HDMI VSDB EDID checks (8-3)Content Type Real-time signaling of content types between display and source devices, enabling a TV to optimize picture setting

10、s based on content type (more)增加CEC指令关于时间及声音控制Additional TTC usage (5-3, 8-5, 8-6, 8-7),Incorporated Tek-recommended setup and calibration for TDR (8-8),Clarification on Sink Deep Color Recommended Test Method (8-25)Additional Color Spaces Adds support for additional color models used in digital pho

11、tography and computer graphics. (more)同时Released认证的测试规格文件 Added long cable or cable emulator use for Repeater test (9-3),Added color-depths for each format in Source_Video_Formats (App. 3),Removed test for filler bytes (8-3),Removed Tektronix part number of cable emulator EFF-HDMI-CE-01 HDMI Micro C

12、onnector A new, smaller connector for phones and other portable devices, supporting video resolutions up to 1080p. (more)Automotive Connection System New cables and connectors for automotive video systems, designed to meet the unique demands of the motoring environment while delivering true HD quali

13、ty. (more) .HMDI Version ComparisonHDMI version1.0-1.2a1.31.4Maximum clock rate (MHz)165340340 51Maximum TMDS throughput per channel (Gbit/s)1.653.43.4Maximum total TMDS throughput (Gbit/s)4.9510.210.2Maximum video throughput (Gbit/s)3.968.168.16Maximum audio throughput (Mbit/s)36.8636.8636.86Maximu

14、m color depth (bit/px)2448A48Maximum resolution over single link at 24-bit/pxB19201200p6025601600p7540962160p24Maximum resolution over single link at 30-bit/pxCN/A25601600p6040962160p24Maximum resolution over single link at 36-bit/pxDN/A19201200p7540962160p24Maximum resolution over single link at 48

15、-bit/pxEN/A19201200p6019201200p60.HMDI Version ComparisonHDMI version11.11.21.31.3a1.4 511.2a1.3b1.3b11.3csRGBYesYesYesYesYesYesYCbCrYesYesYesYesYesYes8 channel LPCM, 192 kHz, 24 bit audio capabilityYesYesYesYesYesYesBlu-ray Disc and HD DVD video and audio at full resolutionFYesYesYesYesYesYesConsum

16、er Electronic Control (CEC)GYesYesYesYesYesYesDVD-Audio supportNoYesYesYesYesYesSuper Audio CD (DSD) supportHNoNoYesYesYesYesDeep ColorNoNoNoYesYesYesxvYCCNoNoNoYesYesYesAuto lip-syncNoNoNoYesYesYesDolby TrueHD bitstream capableNoNoNoYesYesYesDTS-HD Master Audio bitstream capableNoNoNoYesYesYesUpdat

17、ed list of CEC commandsINoNoNoNoYesYes3D Over HDMINoNoNoNoNoYesEthernet ChannelNoNoNoNoNoYesAudio Return ChannelNoNoNoNoNoYes4k 2k Resolution SupportNoNoNoNoNoYes.HMDI 1.4新特性HDMI Ethernet Channel Adds high-speed networking to an HDMI link, allowing users to take full advantage of their IP-enabled de

18、vices without a separate Ethernet cable.Audio Return Channel Allows an HDMI-connected TV with a built-in tuner to send audio data upstream to a surround audio system, eliminating the need for a separate audio cable.HMDI 1.4新特性4K Support Enables video resolutions far beyond 1080p, supporting next-gen

19、eration displays that will rival the Digital Cinema systems used in many commercial movie theatres. 3D Defines input/output protocols for major 3D video formats, paving the way for true 3D gaming and 3D home theater applications. Content Type Real-time signaling of content types between display and

20、source devices, enabling a TV to optimize picture settings based on content type Additional Color Spaces Adds support for additional color models used in digital photography and computer graphics.HMDI 1.4新特性Automotive Connection System New cables and connectors for automotive video systems, designed

21、 to meet the unique demands of the motoring environment while delivering true HD quality. HDMI Micro Connector A new, smaller connector for phones and other portable devices, supporting video resolutions up to 1080p.HMDI Connector & Cable OverviewType A : 19 Pin / 14*4.5*6.8mmType B : 29 Pin / 21.3*

22、4.55*6.8mmType C( Micro HDMI Conn.) : 19 Pin / 10.5*2.5*5mm.HMDI Type A Pin Assignments.HMDI Contact sequence.HMDI Mechanical PerformanceItemTest ConditionRefre Std.振动振幅:1.52mm P-P or 147 m / S2 15G时间: 50200050 HZ in 20 minutes.时间: 12 times in each X,Y, Z axes ( total 36Times)ANSI/EIA - 364 - 28 Con

23、dition III冲击脉波宽度11 msec波形半弦波, 490m / S2 50G 3 strokes in each X,Y,Z axes.ANSI/EIA - 364 - 27 Condition A耐久性After tests:Type A: 10,000 cycles at 100 50 cycles /HType C: 10,000 cycles at 100 50 cycles /H接触阻抗:比原始阻抗变化30M ohms Max，铁壳比原始阻抗变化30M ohms MaxN/A插拔力插拔速度:25mm/minutes拔出力Type A: 9.8N1.0kgf Min , 39

24、.2N1.0kgf MaxType C: 7 N min , 25N max插入力44.1N4.5kgf MaxANSI/EIA - 364 - 13Calbe Flex100 Cycle in each of 2 Planes Dimension X = 3.7 x Cable Diameter.ANSI/EIA - 364 - 41C, Condition I.HMDI Electrical PerformanceItemTest ConditionRefre Std.接触阴抗Mated connectorsContact: Dry circuit, 20 mV max, 10m AShe

25、ll: Open circuit, 5 V max, 100m AANSI/EIA - 364 - 06B介电强度Unmated connectors, aplly 500V AC/ Mated 300V AC(RMS) between adjacent terminal and ground. ( no Breakdown)ANSI/EIA - 364 - 20C,method A绝缘阻抗Unmated connectors, aplly 500V DC/ Mated 150V DC between adjacent terminal and ground.ANSI/EIA - 364 -

26、21C接触电流定额55oC , Maximum ambient85 oC , Maximum temperature change0.5 A MinANSI/EIA - 364 - 70A应用电流定额40 V AC (RMS.) Continuous max, on any signal pin with respect to the shield. ( No Breakdown )NA静电释放Test unmated each connectors form 1KV to 8 KV in 1 kV steps using 8mm ball probe.IEC - 801- 2TMDS信号时域

27、阻抗Rise tiem 200 psec ( 10% - 90%)ANSI/EIA - 364 - 108TMDS信号时域、串扰Rise tiem 200 psec ( 10% - 90%)ANSI/EIA - 364 - 90.HMDI Environmental CharacteristicsItemTest ConditionRefre Std.温度冲击10 cycles of:a). - 55 oC for 30 minutes.b). + 85 oC for 30 minutes.ANSI/EIA - 364 - 32C温湿度mated connectors together:+25

28、 + 85 oC ,相对湿度: 80 95%,持继: 4 Cycles (96 H)ANSI/EIA - 364 - 31B端子老化Expose to +105 2 oC for 250 Hours,ANSI/EIA - 364 - 17B, Condition B, Method A.HMDI Cable Assy TMDS Parameters.Type A Receptacle.Type A ReceptacleThe shell shall have springs for locking. Additional springs may be used for EMI reductio

29、n.The spring property for locking shall be activated by the locking hole of the plug shell.Type A PulgThe dimension of *13.9mm(+0.04/-0.05)(on main diction)should be measured at the point *7mm(on view D). The taper(on view D)shall be one degree max.Cable Adapter type A to type APinAssignment.Cable A

30、dapter type A to type BPinAssignment.Cable Adapter type A to type CPinAssignment.HMDI 1.4制程简介1裁线治工具裁线刀任务阐明将线裁生长度为15154mm。本卷须知1.裁线尺寸应在公差范围内.2.应检查线材有无来料不良情况如:刮伤线径、外被凸起 、外被异色、外表斑点等.任务阐明将线材绕成圈状,两端各留400mm REF,将线圈套入PE袋内,袋口处以魔带束紧,以利后段作业.HMDI 1.4制程简介2绕线本卷须知1.应检查线材有无来料不良等情形如:刮伤线经、外被凸起、外被异色、外被扭曲等.2.扎魔带时,不可扎太紧

31、,以免使线材变形.握线材距去皮机约50mm处,线端顶住顶杆,脚踩开关,将两端外被去皮231mm.1.线材去皮时线端务必确实顶住顶杆,且与刀片坚持垂直,不可歪斜.2.去皮处端面须平正,不可凹凸不平,且去皮尺寸须在规格范围内.3.去皮时不可伤及外被与芯线.4.留意平安(单人单机操作).HMDI 1.4制程简介3两端外被去皮.28任务阐明两端编织360度均匀后翻于外被上,将铝箔齐外被去皮处撕净.本卷须知1.编织须360度均匀后翻于外被上.2.挑铝箔时,不可伤及色线及外被.3.铝箔须齐外被切口处撕净.HMDI 1.4制程简介4两端编织整理.29任务阐明两端PP带捻成一股后翻于外被上,在外被去皮处贴W5

32、*L60mm*2PCS的铜箔于编织及PP带上.本卷须知1.铜箔须贴紧,不可松脱.2.PP带及编织不可散乱.HMDI 1.4制程简介5两端贴铝箔.任务阐明将两端铝箔麦拉齐外被去皮处留4.04.5mm刺破摇断.本卷须知1.刺铝箔麦拉时,不可刺伤对线的绝缘皮.2.摇断铝箔麦拉时动作幅度不要超出30度,以免伤及发泡PE.3.去好铝箔麦拉后,不可有掐伤、折伤及割伤发泡PE.4.铝箔麦拉去留尺寸须正确.4.0-4.5HMDI 1.4制程简介6去铝箔麦拉.任务阐明将两端铝箔麦拉拔掉,并将对线之地线分别捻紧.本卷须知1.地线不可散乱,须捻紧.2.捻地线时,留意不可弄散铝箔麦拉.HMDI 1.4制程简介7捻地线

33、.任务阐明将两端各对线之地线套0.6*L15mm*8PCS的套管,再于两端铝箔麦拉切口处对半套1.5*L6mm*8PCS的套管.本卷须知1.不可漏套及套错套管.HMDI 1.4制程简介8套套管.任务阐明将两端各对线之地线套管及铝箔麦拉切口处的套管烘紧.本卷须知1.不可烘伤绝缘皮,且烘套管后发泡PE不可变形.2.将两端向下套管只须不零落即可,不可烘的过紧.3.手指不可离热烘机口过近,以免烫伤.HMDI 1.4制程简介9烘套管.任务阐明依DWG-2线位依序将各对线、对线之地线及色线整齐陈列至扁平电缆治具上定位.治工具扁平电缆治具本卷须知1.扁平电缆后外被去皮处至扁平电缆治具前端的尺寸为11mm M

34、ax.2.扁平电缆时,不可用指甲掐伤及压伤绝缘皮,且发泡PE不可变形.3.扁平电缆后,线材外被与治具手柄部分须平行.4.扁平电缆时不可有绞线景象.1#19#HMDI 1.4制程简介10 10PIN扁平电缆.任务阐明先将各对线、对线之地线及色线至治具前端裁留4.55.5mm,再各色线及对线去皮2.12.5mm.治工具芯线去皮机/镊子本卷须知1.各色线及对线的去皮尺寸须正确.2.色线及对线去皮时不可去断芯线,且不可夹伤发泡PE及色线.3.各色线及对线去皮后芯线不可散乱.4.留意平安(单人单机操作).2.12.5mm4.55.5mmHMDI 1.4制程简介11芯线去皮.任务阐明将10PIN各色线、对

35、线及地线沾适量的锡.治工具温控锡炉/镊子/挑针本卷须知1.沾锡时色线、对线及地线须与炉面垂直.2.沾锡时不可烫伤套管及绝缘皮.3.沾锡后发泡PE及绝缘皮不可有后缩及变形景象.4.沾锡时间为:0.5-1.0s.5.沾锡前先将温度到达32030,待锡完全溶解后,将操作温作调为28010.HMDI 1.4制程简介12 10PIN沾锡.37任务阐明将10PIN端子置于铆压治具上定位,再将各对线、对线之地线及色线与端子铆合.治工具端子机/镊子本卷须知1.欲打端子之色线置入端子机下刀模滑块承座上,线端务必坚持平齐,且置入深度及打包位置需正确.2.手指不可离刀模太近.3.Ppk1.67或Cpk1.33,当C

36、PK1.33时停线,并知会工务调机.HMDI 1.4制程简介13铆10PIN端子.38任务阐明依DWG-1线位依序将各对线、对线之地线及色线整齐陈列至扁平电缆治具上定位.治工具扁平电缆治具本卷须知1.扁平电缆后外被去皮处至扁平电缆治具前端的尺寸为11mm Max.2.扁平电缆时,不可用指甲掐伤及压伤绝缘皮,且发泡PE不可变形.3.扁平电缆后,线材外被与治具手柄部分须平行.4.扁平电缆时不可有绞线景象.2#18#18#2#HMDI 1.4制程简介14 9PIN扁平电缆.39任务阐明先将各对线、对线之地线及色线至治具前端裁留4.55.5mm,再各色线及对线去皮2.12.5mm.治工具芯线去皮机/镊

37、子本卷须知1.各色线及对线的去皮尺寸须正确.2.色线及对线去皮时不可去断芯线,且不可夹伤发泡PE及色线.3.各色线及对线去皮后芯线不可散乱.4.留意平安(单人单机操作).2.12.5mm4.55.5mmHMDI 1.4制程简介15 9PIN芯线去皮.40任务阐明将9PIN各色线、对线及地线沾适量的锡.治工具温控锡炉/镊子/挑针本卷须知1.各色线及对线的去皮尺寸须正确.2.色线及对线去皮时不可去断芯线,且不可夹伤发泡PE及色线.3.各色线及对线去皮后芯线不可散乱.4.留意平安(单人单机操作).HMDI 1.4制程简介16 9PIN沾锡.41任务阐明将9PIN端子置于铆压治具上定位,再将各对线、对

38、线之地线及色线与端子铆合.治工具端子机/镊子本卷须知1.欲打端子之色线置入端子机下刀模滑块承座上,线端务必坚持平齐,且置入深度及打包位置需正确.2.手指不可离刀模太近.3.Ppk1.67或Cpk1.33,当CPK1.33时停线,并知会工务调机.HMDI 1.4制程简介17铆9PIN端子.42任务阐明先将HOUSING插入母端插座内,再先于10PIN端子两凸点面装一铁片,再一同与9PIN的有凹点面合在一同并捏到位,然后将组合好的端子插入装好母端插座的HOUSING内并拔出母座,然后将两侧铁片压平.治工具HDMI母端插座/挑针本卷须知1.端铁片前须检查PIN针能否在同不断在线.2.不可漏装铁片.3

39、.端子须完全插到位.4.插端子时,不可使端子变形.HMDI 1.4制程简介18插端子.43任务阐明用放大镜检查各端子能否不良治工具放大镜/烙铁本卷须知1.挑出不良品,并标示不良情形,置于红箱内,待修缮.2.将不良情形详细记录于不良记录日报表中.3.不良情形回应于前序工站.4.产线须轻拿轻放.5.烙铁温度为:38030.6.每一个小时改换一次海绵,清理一次锡渣.7.焊35点须擦拭一下烙铁头.8.点检烙铁温度后,将烙铁温度记录于烙铁温度管控表中.9.焊锡人员须有技术合格证才可上岗.HMDI 1.4制程简介19检查端子.44任务阐明沿两端CONN塑料边缘贴W11*L80mm*2PCS的黄色透明无卤胶

40、带,以包覆锡点及色线.本卷须知1.贴胶带前须将各对线及色线理顺后再贴胶带.2.不可漏贴胶带,且胶带须完全包覆锡点及色线,并贴紧.3.挑出不良品,并挂牌标示不良情形,置于红箱内,待修缮.4.产线须轻拿轻放.HMDI 1.4制程简介20贴胶带.45任务阐明组装上下铁壳并使之密合,并置于铆压治具内铆压.治工具铆压机/尖嘴钳本卷须知1.铆压时位置须正确,不可歪斜;不可伤及外被,铁壳不能变形.2.IPQC应严把此关,以防铆压的高宽度尺寸超出公差范围,导致线径零落或头部在受力过大的情况下会出现芯线有断裂景象.3.留意平安(单人单机操作).4.铆压高宽度为:W=7.900.10mm;H=6.900.10mm

41、.HMDI 1.4制程简介21装铆铁壳.46任务阐明测试能否有错位、短路、断路及电阻大等情形,直流电阻:2.0 Max.,绝缘阻抗:10M/300V DC.本卷须知1.测试机参数需设定正确(详见测试参数设定表).2.做电气测试前先由IPQC拿一条NG品和一条OK品检测测试机能否OK.3.挑出不良品,并挂牌标示不良情形,置于红箱内,待修缮.4.将不良情形详细记录于不良记录日报表中.5.不良情形及时回应于前序工站HMDI 1.4制程简介22 T1测试.47任务阐明两端PP带齐铁壳边沿剪净,编织齐铁壳末端剪留34mm,再将编织前翻于铁壳上360度加锡焊接.本卷须知1.PP带须齐铁壳边沿剪净,且两端编织剪留