ANSYS Icepak平台新功能介绍

1、ANSYS Icepak R17.0 平台新功能介绍ANSYS Icepak R17.0 UpdateReduced Order Modeling模型降阶技术Krylov-Projection based ROM克雷洛夫模型降阶技术LTI ROM automation线性非时变系统降阶技术ECAD importIDX Import capability IDX导入能力Solver Enhancements求解器增强Support for Remote Simulation Manager (RSM) 支持使用RSM求解Icepak项目NC Interface creation speedup

2、(50X) 建立NC界面速度加快50倍HPC performance improvements (6X) HPC并行改进6倍Data Exchange数据交换Metadata and results export for EKM可以将元数据和结果输出EKMTrace Conductivity Modeling Enhancements布线导热率计算增强Improved algorithm to capture serial and parallel physics 改进了布线导热率的算法Post Processing Enhancements后处理增强Macros Enhancements宏增

3、强Automated Setup and ROM Construction自动设置及降阶构造Select inputs using UIRun steady-state solutionROM creation in Icepak在Icepak里建立降阶模型Transient setup and ROM Evaluation瞬态设置及ROM评估Input transient loads and evaluation timesIcepak results data enables post-processing in Icepak26X speedup加速26倍ROM: 克雷洛夫模型降阶技术4

4、th order ROM, t = 100 sec4th order ROM, t = 200 sec4th order ROM, t = 400 secCFD, t = 100 secCFD, t = 200 secCFD, t = 400LTI State-space Characterization线性非时变状态空间方法Automated model setup 模型自动设置Run steady-state solution 运行稳态计算Automated transient parametric analysis based on inputs 基于输入参数自动进行瞬态参数分析LTI

5、ROM creation in ANSYS Simplorer可以与Simplorer耦合ROM: 自动线性非时变降阶技术Import all electrical and mechanical components导入所有电子机械器件Support for component placement/selection支持器件位置重置Support for thermal properties支持热属性导入Grouping of components可以对器件规组ECAD: 支持导入IDX格式Solver: 使用RSM管理器 Support all configuration scenarios

6、支持所有配置脚本RSM Client, Manager and Compute Server can be deployed on 1, 2 or 3+ machines RSM客户端、管理端及服务器可以布置在1、2、3个甚至更多的机器上Configuration setup using RSM UI on WB可以在WB之下 配置RSM的设置Component update through RSM通过RSM更新器件Update Icepak design points through RSM更新Icepak设计点Customize Solver Execution Controller 定制

7、求解控制器Serial or Parallel executionNC interface creation improvements result in up to 50X speedup建立NC界面的速度提升50倍Advanced controls for linear solver 先进的线性求解器Shell conduction zones and solid zones parallel optimization同时对壳单元传导区域及固体区域进行优化Fluid/Solid load balancing improvements for scalability 稳定性更好Solver:

8、 HPC并行能力提升服务器模型 HPC 并行能力Icepak Model highlights: MCAD, ECAD, Non-conformal Assemblies, 734 objects734个器件Icepak Mesh highlights: 10.75 M cells using unstructured, non-conformal, multi-level, hex-dominant meshing scheme划分了1075万网格Icepak Solution highlights: Steady state, Turbulent Flow, Conjugate Heat

9、Transfer, Double Precision.System Information系统信息Intel Xeon CPU E5-2690 2.9 GHz processors, 128 GB RAM2 processorsRunning Windows 8.1 Enterprise (2013) Window8.1企业版HPC Test Summary HPC测试总结Trials were run in batch mode.批处理模型运行Each trial was run for 250 iterations.每个实验计算250步Overall run times used for

10、measuring performance.使用总的计算时间测量HPC能力Overall run time includes file i/o, case setup and computations.服务器模型 HPC 能力 Test 1Overall Run Time vs Number of Cores 总时间VS核数服务器模型 HPC 能力 Test 1加速 vs 核数Overall run time for 1 core taken as reference while quantifying speed-up服务器模型 HPC 能力 Test 1Cluster Informatio

11、n集群信息Ivy Bridge Processors, 2687 v2, 128 GB RAM per. Dual 10 core processors per node (20 per node) Running Windows 2012 R2 SP3, Infiniband Interconnect.HPC Test SummaryHPC测试总结Job Scheduler utility in Icepak used to submit the runs to the cluster.将Icepak项目提交到集群。Trials were run in batch mode.批处理模型计算。

12、Each trial was run for 250 iterations.Overall run times used for measuring performance.Overall run time includes file i/o, case setup and computations.服务器模型 HPC 能力 Test 2Overall Run Time vs Number of Cores总时间VS核数服务器模型 HPC 能力 Test 2加速 vs 核数Overall run time for 1 core taken as reference while quantify

13、ing speed-up服务器模型 HPC 能力 Test 2Icepak in EKM: 基于xml的数据Export EKM metadata输出EKM元数据Model information 模型信息Flow and Thermal boundary conditions边界条件Solver configuration求解设置Parametrics & optimization参数及优化Export Solution Reports & Image输出报告及图片Solution Overview Reports整体报告PNG image exportPNG图片Utility to cre

14、ate XML files for legacy projects可以建立XML文件布线导热率计算的增强改进了计算布线导热率的算法 使用一种顺序/并行的热网络方法粗网格细网格2D and 3D (Manhattan) plotting of powermaps2D/3D的热耗分布云图Heatflux, Power and Temperature variables supported支持热流、热耗及温度Results can be viewed pre and post-solution可以在求解前后进行查看Postprocessing: Powermaps后处理热耗分布云图ANSYS Ice

15、pak v17.0 Macros Update宏更新Menu Structure Overhaul菜单修正Macro Documentation Enhancements宏文档增强Die Characterization模拟封装Die的方法Compare Mesh Settings网格设置的比较Minimum Gap Detection最小间隙的检查Power Dependent Power热耗与热耗相关Delete Unused Materials删除无用材料TEC Parallel SolveTEC并行计算Debug Divergence改正离散的求解Copy Mesh Settings拷

16、贝网格设置Export Geometry to ANSYS SpaceClaim将模型输出到ScdmMenu Structure Overhaul菜单修正For ease-of-use, the macro menu has been alphabetized and reorganized:宏菜单被重置，以方便使用Geometry几何Modeling模型Post Processing后处理Productivity高效Macro Documentation Enhancements文档的增强The documentation for macros has seen substantial im

17、provements.改进了宏的文档The following macros now have detailed instructions on usage:Power Dependent Power 热耗与热耗相关Transient Temperature Dependent Power热耗与时间、温度相关Debug Divergence改正离散的求解Updated screenshots and menu paths to reflect the new macro menu structure.All macros have a brief description that cover

18、main functionality. 所有宏的 功能有简单描述。The documentation for TEC macros was updated to reflect recent enhancements.TEC的文档被更新。Die Characterization Die的方法Creates an array of source objects on a die block在一个Die上建立多个SourceDeletes current parameters and generates new parametric trials for the source objects (b

19、y column option) and solves the trials 删除当前的参数，建立新参数工况，并进行参数化计算。Compare Mesh Settings网格设置比较Compares mesh settings in the Global Mesh panel and Local Assembly panels, before and after making changes 对整体网格和局部网格的设置进行比较。Outputs the mesh setting changes in a separate file对 网格设置单独输出Output InformationMacro

20、 PanelPrimitive Misalignment Check检查模型不对齐Misalignments are a significant cause of bad meshes and divergence.模型不对齐是导致Bad网格及求解发散的重要原因。 Macro detects and reports object misalignments to usercustom misalignment tolerance specification allowed“Full Model” or “Selected Assembly” search options availableAf

21、ter running macro, user can either 运行后可以fix misalignments, or修复不对齐select appropriate Mesh “Minimum Gap” values选择合适的最小间隙Power Dependent Power热耗与热耗相关Target Source #1Remote Source #1Remote Source #2Remote Source nRemote Source #2Target Source #2Target Source #20Delete Unused Materials删除无用材料When users m

22、erge many models, old materials that are no longer used can accumulate in the model tree.当用户合并模型时，旧的材料会在模型树下累积。This macro searches for all materials used in the model both in the active and inactive nodes. 宏命令可以寻找模型里所有的材料。Materials are deleted only when they are not used anywhere in the model, and t

23、hey are not library materials. 将会删除模型中不使用的材料。Output is written to the message window:输出窗口显示如下：TEC Parallel Solve TEC并行计算On Windows machines, the Run TEC can now use parallel solving.在Window系统下，TEC可以并行计算求解。Other functionalities remains same.其他功能相同。Debug Divergence改正离散的求解This new feature in Debug Dive

24、rgence allows users to debug the manually terminated diverged solutions.允许用户追踪引起发散的错误网格。The macro takes solution ID as an input. If the solution is not loaded, the macro prompts user to load solution using “Load Solution ID” function.将求解的ID作为输入。如果求解没有加载，宏将使用Load Solution ID加载计算结果。If the user-specified solution ID has residuals more than the specified val