真空镀膜潜在失效模式及影响分析

1、POTENTIAL FAILURE MODE AND EFFECTSANALYSIS(Process FMEA)FMEA 编虢 FMEA Number： 次 Page:填表人 Prepared By： 更新版本日期FMEA Date :屋品名再Item :晶片电阻走品模务且 Model(s)/Program(s) : AC跨功能小务且Core Team :裂程任 Process Responsibility :真空 鼬日期Key Date：裂程/功能ProcessStep / Function要求 Requireme nt潜在 失效模 式 Potential Failure Mode潜在失效影

2、警Potential Effect(s) of FailureDO 厩重度(S)分(C)不良/失效 原因Potential Cause(s) of Failure现行管控 CurrentDesignRPN建B室寸策RecommendedAction人及琪 期完成日期 Responsibility & TargetCompletion Date改善完成日期Actions Taken Completion Date厩 重 度(S)畿 生 度 (O)值 测 度 (D)R PN控制琪防Controls Prevention畿 生 度 (O)控制检测Controls Detection值 测 度 (D)

3、P22真空膜/端 极面漉上一屑 金屠薄膜 Sputtering/The side sputtering a layer of metal film凰殳有 破洞No hole on sputtering film,屑有 破洞 Sputterin g film holes走生露基板不良， 影警焊性Poor solderability8侧辱表面有粉崖 dust on the side surface燧内壁NiCr掉落(遒用秋式真檄) NiCr fall down in inner wall of sputtering chamber1.料品谁烤箱畤，用麻榆 作表面清理Cleaning surface

4、 with air gunbefore sputtering2.1真上板每周更换 一次，防止燧内壁掉落 NiCr屑(逾用秋式真檄) Every week, replace the up protection broad of sputtering to avoid the drop of NiCr(for horizontal sputtering machine)2.2真上倡合金板每周 喷砂清理一次(逾用秋式真 鼬)The upper alloy plateis cleaned once a week (for horizontal sputtering machine)2每lot真 前、彳

5、爰自主检 查Self inspection per lot before and after sputtering每班谁行附 著力测就 perform the adhesion test by shift7112料品谁烤箱畤，用吸 bwb行表面清 理，替代麻榆清理， 避免用麻榆清理 畤，走生彳伯A黑占吹 到B黑占的冏题 When the material enters the oven, clean the surface with a vacuuming mechanism Replace air gun cleaning Avoid blowing from point A to poin

6、t B when cleaning with an air gun田春峰2018/12/302018/12/3081756走品名 Item :晶片电阻POTENTIAL FAILURE MODE AND EFFECTSANALYSIS(Process FMEA)FMEA 编虢 FMEA Number：次 Page:填表人 Prepared By：裂程任 Process Responsibility :真空走品模务且 Model(s)/Program(s) : AC 跨功能小务且Core Team :裂程/功能ProcessStep / Function要求 Requireme nt潜在 失效模

7、 式 Potential Failure Mode潜在失效影警Potential Effect(s) of FailureDO厩重度(S)分(C)不良/失效 原因Potential Cause(s) of Failure现行管控 CurrentDesignR PN建B室寸策 Recommended Action人及予期 完成日期 Responsibility & Target CompletionDate改善完成日期Actions TakenCompletion Date厩 重 度(S)畿 生 度 (O)值 测 度 (D)R PN控制琪防Controls Prevention畿 生 度 (O)

8、控制检测Controls Detection值 测 度 (D)P22真空膜/端 极面漉上一屑 金屠薄膜 Sputtering/The side sputtering a layer of metal film薄膜屑阻 抗在规定 簸圉内 film resistance within control specificati on阻抗超 出规定 上限 Film resistanc e beyond the prescribe d ceiling走生露基板不良，景 掣旱性Poor solderability81.氤麻流量超出关兄 定下限The argon flow exceeds the lower

9、limit 2源射畤真 空度超出规定上 限The vacuity of sputtering exceeds the upper limit 3功 率，雷流值超出 定下限Power, current exceeding theupper limit4.干燥温度超遗规 定下限drying temperature exceeds the lower limit1.每班谁行自主检查 Make machine setting self check every shift.21.每燧谁行自主 检查Make machine setting self check every furnace。2. 用固定量测

10、治 具，每天谁行阻抗 测量(H管 控)Measure the resistance every day with stable jig (mediate drawing control)s112室寸氟麻、真空度、功 率、雷流等参敷，采 用系统，自勤监控， 超出控制范圉畤自 勤停檄幸艮警Argon, vacuum, power, current and other parameters, the system, automatic monitoring, automatic shutdown alarm when out of control range制帽2019/06/30阻抗超 出规定 下

11、限 Film resistanc e beyond the limit走生外翟良延伸不 良，良品率下降Poor yield71.MM流量超出关兄 定上限The argon flow exceeds the upper limit 2源射房真 空度超出规定下 限The vacuity of sputtering exceeds the lower limit 3功 率，雷流值超出 定上限Power, current exceeding theupper limit1.每班谁行自主检查 Make machine setting self check every shift21.每燧谁行自主 检查M

12、ake machine setting self check every furnace。2. 用固定量测治 具，每天谁行阻抗 测量(H管 控)Measure the resistance every day with stable jig (mediate drawing control)98室寸氟麻、真空度、功 率、雷流等参敷，采 用系统，自勤监控， 超出控制范圉畤自 勤停檄幸艮警 Argon, vacuum, power, current and other parameters, the system, automatic monitoring, automatic shutdown

13、alarm when out of control range制帽2019/06/30导建日期Key Date：更新版本日期FMEA Date :POTENTIAL FAILURE MODE AND EFFECTSANALYSIS(Process FMEA)座品名布甫Item :晶片电阻走品模务且 Model(s)/Program(s) : AC跨功能小务且Core Team :裂程任 Process Responsibility :真空膜鼬日期Key Date：FMEA 做 FMEA Number 次 Page:填表人 Prepared By： 更新版本日期FMEA Date :裂程/功能P

14、rocessStep / FunctionP22真空膜/端 极面漉上一屑 金屠薄膜 Sputtering/The side sputtering a layer of metal film要求 Requireme nt潜在 失效模 式Potential Failure Mode潜在失效影警Potential Effect(s) of Failure真屑不真屑可有延伸延伸走生外不良，良noOver品率下降over-sputtesputterinPoor yieldring,g治具内料品不可走治具内生粘速料品有No sticky粘速影警折粒效率material instickyEffect of

15、2ndthe jigmaterialbreaking efficiencystockin the jig stock2厩 重 度(S)(C)不良/失效原因Potential Cause(s) ofFailure1.MM流量超出关兄 定上限The argon flow exceeds the upper limit 2.漉射房真 空度超出规定下 限The vacuity of sputtering exceeds the lower limit 3功 率，雷流值超出 规定上限 Power, current exceeding theupper limit干燥温度超遗规定 上限drying tem

16、perature exceeds the upper limit现行管控 CurrentDesign控制琪防ControlsPrevention每班谁行自主检查 Make machine setting self check every shift.烤箱超温自勤警幸艮Oven over temperature automatic alarm畿 生 度 (O)控制检测ControlsDetection值测度(D)建B室寸策RecommendedAction人及予期完成日期Responsibility &Target CompletionDate改善完成日期Actions TakenComplet

17、ion Date厩 重 度(S)畿生度(O)值测度(D)1每燧谁行自主 检查Make machine setting self check every furnace。 2更换强片替换 强簧功能，每月保 餐。Replace spring function with shrapnel and maintain it monthly.3.测包 CCD 100% 检查Taping AOI 100% inspection干燥温度每班谁 行自主检查 temperature self check every shift3232瞄麻、真空度、功 率、雷流等参敷，果 用系统，自勤监控， 超出控制范圉畤自 勤停檄幸艮警Argon, vacuum, ， power, curre