PCB专业英语培训

1、Copyright by gbm Ltd All rights .tw制作日期：2016.04.10制作部門：Department QAWhat is PCB? Printed Circuit BoardPCB Effect？Conduct ElectricityTransmission SignelSupported Fixation Action前言前言（印刷线路板）印刷线路板）（导电）导电）（传输信号）传输信号）（支撑固定）支撑固定）PCB Sort: A:Single-sidedDouble- sidedMulti-layer Printed Circuit Board (PCB)单面

2、单面/双面双面/多层多层PCB Rigid PCB Flexible PCB Flex-rigid PCB刚性刚性/挠性挠性/刚挠性刚挠性PCB一一.Department Introduction 部門介紹部門介紹Incoming Quality Control IQC (来料检查)Incoming process Quality Control IPQC (生产过程品质控制)Final Quality Control FQC(最终品质管控)Quality Assurance QA (品质保证部 )Marketing MKT(市场部 )Production Material Control P

3、MC(计划部 ) Manufacturing Engineering ME (制作工程部)Production PD (生产部 )Administration & MaintenanceA&M (行政及維修部)Human ResourcesHR (人力資源部)Research & DevelopmentR & D (研究及發展部)Purchasing and ShippingP & S (採購及船務部)AccountACC (財務部)Training DepartmentTR (培訓部)Management Information SystemMIS (

4、資訊系統部)Process EngineerPE (工序工程部) FQC QA MKT PMC ME PD IQC IPQC市场部市场部 计划部计划部来料检查来料检查生产过程品质控制生产过程品质控制制作工程部制作工程部生产部生产部最终品质管控最终品质管控品质保证部品质保证部 Administration &Maintenancen行行政政及及維維修修部部HumanResourcesn人力資源部人力資源部Research &Developmentn研究及發展部研究及發展部Purchasing andShippingn採購及船務部採購及船務部Accountn財務部財務部Traini

5、ng Departmentn培訓部培訓部n資訊系統部資訊系統部ManagementInformationSystem A&M HR R & D P & S ACC TR MIS 行政及维修部行政及维修部研究及发展部研究及发展部财务部财务部 培训部培训部 采购及船务部采购及船务部人力资源部人力资源部 资讯系统部资讯系统部ProcessEngineerIncomingQualityControlIncomingProcessQualityControlFinalQualityControlQualityAssuranceMarketingProductionMaterial

6、ControlManufacturingEngineeringProduction來料檢查來料檢查生產過程品質控制生產過程品質控制品質控制部品質控制部品質保證部品質保證部市場部市場部計畫部計畫部工序工程部工序工程部製作工程部製作工程部生產部生產部IQCQA MKTIPQCFQCConnection(連線連線)lIncoming Quality Control lIncoming process Quality Control lFinal Quality ControllQuality Assurance lMarketing PEPDPMC ME MISlManufacturing Engi

7、neeringlProduction lProduction EngineerlProduction Material ControllManagement Information System二、二、Process Flow 工藝流程工藝流程BoardCut(開料開料)InnerDryFilm(內層幹菲林內層幹菲林)InnerEtching內層蝕刻內層蝕刻MultiBondBrownOxidation棕化棕化Pressing壓板壓板Drilling鑽鑽 孔孔Plated-throughhole沉銅沉銅OuterDryFilm外層幹膜外層幹膜PatternPlating圖形電鍍圖形電鍍Oute

8、rEtching外層蝕板外層蝕板WetFilm綠油綠油ComponentMark白字白字Surface Treatment表面處理表面處理Profiling成型成型E-test開開/短路測試短路測試 )Packing包裝包裝Output出出 貨貨Organic Solderability Preservatives OSPPCB Process CodePCB工序代碼工序代碼BD-CUT IDF IET In-InsPTH DR PS MBBOODF PP OET Out-InsPF SF CM WFE-Test Packing OutputInner Dry FilmInner Etchin

9、g內層幹菲林內層幹菲林Outer Dry Film外層幹菲林外層幹菲林內層蝕板內層蝕板outer Etching外層蝕板外層蝕板Inner Inspection內檢內檢Outer Inspection外外檢檢壓板壓板PSPressingDRBO棕棕/黑氧化黑氧化Brown/Black Oxidation鑽鑽 孔孔DrillingPTHPPWF沉銅沉銅 Plated-through hole圖形電鍍圖形電鍍綠油綠油Pattern PlatingWet Film三、三、Defect Introduction 缺點介紹缺點介紹1.Board Cut (界界 料料) 板面膠漬板面膠漬板面雜物板面雜物板

10、面擦花板面擦花Residue on boardForeign matter on boardScratch on board surface板邊凹痕板邊凹痕板汙板汙凸點凸點凹點凹點針孔針孔擦花擦花Uneven edgeBoard dirtyProtrude spotConcave spotPittingScratchPoor exposurePoor circuitScratch circuitUnder etchingOver etching曝光不良曝光不良線路不良線路不良線路擦花線路擦花蝕板不清蝕板不清蝕板過度蝕板過度Ink residueSpacing under sizeInsuffi

11、cient linewidthNick circuit油墨殘物油墨殘物線間偏小線間偏小線幼線幼線偏小線偏小線路缺口線路缺口2.Inner Layer(內層內層)DelaminationWarpageRegistrationBubble on boardFolding on board爆板爆板分層分層板曲板曲內層移位內層移位板面起泡板面起泡板面起皺板面起皺3.Pressing (压板压板) 4.Drilling（鑽孔）（鑽孔）Excess holeHole shiftHole damageDrill burr 多孔多孔偏孔偏孔孔損孔損披鋒披鋒Hole contaminationBoard dir

12、tyRough holeBlock hole孔灰黑孔灰黑板汙板汙孔粗孔粗塞孔塞孔擦花擦花孔開孔開板損板損掉缸掉缸ScratchHole openBoard damageDrop vat5.Plated-through hole (沉铜沉铜) 6.Outer Layer（外層）（外層）Dry film residueForeign matter under DFFilm peel offPoor exposureInsufficient line widthCCT open幹膜殘物幹膜殘物幹膜下雜物幹膜下雜物甩膜甩膜曝光不良曝光不良線幼線幼線偏線偏小小開路開路Spacing under size

13、Nick CCT(concave)Poor CCTScratch CCTUnder etchingOver etching線間偏小線間偏小缺口缺口線路不良線路不良線路擦花線路擦花蝕板不清蝕板不清蝕板過度蝕板過度7.Wet Film（濕菲林）（濕菲林）SM under cureSM Peel offOxidation under SMForeign matter under WF綠油未幹綠油未幹甩綠油甩綠油綠油下氧化綠油下氧化濕菲林雜物濕菲林雜物SM shiftSM bleedingSM in holeSM skippingSM bubble綠油移位綠油移位滲油滲油綠油進孔綠油進孔不過油不過油綠

14、油起泡綠油起泡SM bridge brokenPoor SMPoor carbon inkExcess SM point rework綠油斷橋綠油斷橋綠油不良綠油不良碳油不良碳油不良補油點多補油點多8. Legend Printing（白字）白字）CM unclearCM shiftCM in holeWrong missing mark 白字不清白字不清白字移位白字移位白字進孔白字進孔錯錯漏標記漏標記Missing CMPoor CMCM on wrong sideCM peel off漏印白字漏印白字白字不良白字不良白字印錯面白字印錯面甩白字甩白字Poor on GFOrganic Sol

15、derabilityPreservativesPit on gold fingerNick on GFScratch on GFSolder on GF 金面不良金面不良有機保護膜有機保護膜金面針孔金面針孔金指穿孔缺口金指穿孔缺口金指擦花金指擦花錫上金指錫上金指9. Surface Treatment(表面處理)Copper expose on root of GFSM peel off on root of GFGF bevel edge deviationInsufficient gold thickness金腳金腳露銅露銅金指斜邊金指斜邊偏差偏差金腳金腳甩油甩油金厚不金厚不足足WF on

16、 GFDent on GFGF out of sizeGold surface oxidationGold bleedingNickle burnt 綠油上金指綠油上金指金指凹痕金指凹痕金手指變形金手指變形金面氧化金面氧化滲金滲金燒鎳燒鎳Connection(連線連線)Pit on gold fingerNick on GFGF bevel edge deviationInsufficient gold thicknessGold bleedingNickle burnt金指穿孔缺口金指穿孔缺口金厚不足金厚不足滲金滲金燒鎳燒鎳金面針孔金面針孔金指斜邊偏差金指斜邊偏差 10. Profiling

17、 （成型）成型）Poor profilingMissing bevel edgeDamage by punchingDamage by routing碑鑼不良碑鑼不良鑼斜邊鑼斜邊碑板壓傷碑板壓傷板鑼傷板鑼傷V-CUT shiftV-CUT under spec.V-CUT over spec. 移位移位v-cut 過淺過淺v-cut 過深過深一、Fill in black(填空)1.線路板的英文縮寫是： ，英文全寫是：。2.PCB按層數分為:_;_；_ 。3.PCB按剛撓性分為:_，_，_Test 1二、Translate English(中譯英)开料 _ 披鋒_壓板 _ 掉缸_鑽孔 _ 曝光

18、不良_成型 _ 文字不清_包裝 _ 防焊掉橋_出貨 _ 金面氧化_濕菲林 _ 蝕刻過度_電子測試 _ 開路_板面擦花_ 孔損_針孔_ 板翹_線路缺口_ 菲林異物_爆板/分層_ 甩綠油_HRQAPE MEIQCA&MFQC PMC PRODIncoming Quality ControlFinal Quality ControlQuality AssuranceProduction Material ControlManufacturing EngineeringProductionAdministration & MaintenanceHuman ResourcesProduction Engineer三、Connection(連線)生產部生產部計畫部計畫部來料檢查來料檢查品質控制部品質控制部製作工程部製作工程部品質保證部品質保證部生產工程部生產工程部人力資源部人力資源部行政及維修部行政及維修部四、Connection(連線)壓板壓板PSPressingDRBO棕棕/黑氧化黑氧化Brown/Black Oxidation鑽鑽 孔孔DrillingPTHPPWF沉銅沉銅Pl