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1、 proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published s

2、pecifications. PACKAGING INFORMATIONOrderable Device Status (1Package Type PackageDrawing Pins Package Qty Eco Plan (2Lead/Ball FinishMSL Peak Temp (3Samples(Requires LoginOPA2300AIDGSR ACTIVE MSOP DGS102500Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Purchase SamplesOPA2300AIDGSRG4ACTIVE MSOP

3、 DGS102500Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Purchase SamplesOPA2300AIDGST ACTIVE MSOP DGS10250Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Request Free SamplesOPA2300AIDGSTG4ACTIVE MSOP DGS10250Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Request Free SamplesOPA2301AID A

4、CTIVE SOIC D875Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Purchase SamplesOPA2301AIDG4ACTIVE SOIC D875Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Purchase SamplesOPA2301AIDGKR ACTIVE MSOP DGK82500Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Purchase SamplesOPA2301AIDGKRG4ACTIVE

5、MSOP DGK82500Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Purchase SamplesOPA2301AIDGKT ACTIVE MSOP DGK8250Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Request Free SamplesOPA2301AIDGKTG4ACTIVE MSOP DGK8250Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Request Free SamplesOPA2301AIDR

6、 ACTIVE SOIC D82500Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Purchase SamplesOPA2301AIDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Purchase SamplesOPA300AID ACTIVE SOIC D875Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Request Free SamplesOPA300AIDBVR ACTIVE

7、 SOT-23DBV63000Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Purchase SamplesOPA300AIDBVRG4ACTIVE SOT-23DBV63000Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Purchase SamplesOPA300AIDBVT ACTIVE SOT-23DBV6250Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Request Free SamplesOPA300AIDBVT

8、G4ACTIVE SOT-23DBV6250Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Request Free SamplesAddendum-Page 1Orderable Device Status (1Package Type PackageDrawing Pins Package Qty Eco Plan (2Lead/Ball FinishMSL Peak Temp (3Samples(Requires LoginOPA300AIDG4ACTIVE SOIC D875Green (RoHS& no Sb/BrCU NIPDA

9、U Level-2-260C-1 YEAR Request Free SamplesOPA301AID ACTIVE SOIC D875Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Request Free SamplesOPA301AIDBVR ACTIVE SOT-23DBV53000Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Purchase SamplesOPA301AIDBVRG4ACTIVE SOT-23DBV53000Green (RoHS& no Sb/BrCU N

10、IPDAU Level-2-260C-1 YEAR Purchase SamplesOPA301AIDBVT ACTIVE SOT-23DBV5250Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Request Free SamplesOPA301AIDBVTG4ACTIVE SOT-23DBV5250Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Request Free SamplesOPA301AIDG4ACTIVE SOIC D875Green (RoHS& no Sb/BrC

11、U NIPDAU Level-2-260C-1 YEAR Request Free SamplesOPA301AIDR ACTIVE SOIC D82500Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Purchase SamplesOPA301AIDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/BrCU NIPDAU Level-2-260C-1 YEAR Purchase Samples(1 The marketing status values are defined as follows:ACTI

12、VE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new desig

13、n.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2 Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS, Pb-Free (RoHS Exempt, or Green (RoHS & no Sb/Br - please check for the l

14、atest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS: TIs terms Lead-Free or Pb-Free mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requi

15、rement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt: This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps

16、used between the die and package, or 2 lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible as defined above.Green (RoHS & no Sb/Br: TI defines Green to mean Pb-Free (RoHS compatible, and free of Bromine (Br and Antimony (Sb based

17、 flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material(3 MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Addendum-Page 2Important Information and Disclaimer:The information provide

18、d on this page represents TIs knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from

19、 third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus

20、 CAS numbers and other limited information may not be available for release.In no event shall TIs liability arising out of such information exceed the total purchase price of the TI part(s at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 3TAPE AND REEL INFORMATION*Al

21、l dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mmReel Width W1(mmA0(mmB0(mmK0(mmP1(mmW (mmPin1Quadrant OPA2300AIDGSR MSOP DGS 102500330.012.4 5.3 3.4 1.48.012.0Q1OPA2300AIDGST MSOP DGS 10250180.012.4 5.3 3.4 1.48.012.0Q1OPA2301AIDGKR MSOP DGK 82500330.012.4 5.3 3.4

22、 1.48.012.0Q1OPA2301AIDGKT MSOP DGK 8250180.012.4 5.3 3.4 1.48.012.0Q1OPA2301AIDR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1OPA300AIDBVR SOT-23DBV 63000180.08.4 3.2 3.1 1.39 4.08.0Q3OPA300AIDBVT SOT-23DBV 6250180.08.4 3.2 3.1 1.39 4.08.0Q3OPA301AIDBVR SOT-23DBV 53000180.08.4 3.2 3.1 1.39 4.08.0Q3OPA

23、301AIDBVT SOT-23DBV 5250180.08.4 3.2 3.1 1.39 4.08.0Q3OPA301AIDRSOICD82500330.012.46.45.22.18.012.0Q1PACKAGE MATERIALS INFORMATION23-Jul-2010Pack Materials-Page 1 *All dimensions are nominal DevicePackage Type Package Drawing Pins SPQ Length (mmWidth (mmHeight (mmOPA2300AIDGSRMSOP DGS 102500346.0346

24、.029.0OPA2300AIDGSTMSOP DGS 10250190.5212.731.8OPA2301AIDGKRMSOP DGK 82500346.0346.029.0OPA2301AIDGKTMSOP DGK 8250190.5212.731.8OPA2301AIDRSOIC D 82500346.0346.029.0OPA300AIDBVRSOT-23DBV 63000190.5212.731.8OPA300AIDBVTSOT-23DBV 6250190.5212.731.8OPA301AIDBVRSOT-23DBV 53000190.5212.731.8OPA301AIDBVTS

25、OT-23DBV 5250190.5212.731.8OPA301AIDR SOIC D 82500346.0346.029.0PACKAGE MATERIALS INFORMATION 23-Jul-2010Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes

26、to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TIs terms and conditions

27、of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this

28、 warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To m

29、inimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intelle

30、ctual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of

31、such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproducti

32、on is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties

33、may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business

34、practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have

35、 executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements conce

36、rning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products

37、in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or enhanced plastic. Only products designated by TI as military-grade meet military s

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