线路板的中英文对照8

1、线路板的中英文对照c-10显 影(Developing )c-11去膜(Stripping )D.压 合Laminationd-1黑 化(Black Oxide Treatment)d-2微 蚀(Microetching)d-3铆钉组合(eyelet )d-4迭板(Lay up)d-5压 合(Lamination)d-6后处理(Post Treatment)d-7黑氧化( Black Oxide Removal )d-8铣靶(spot face)d-9去溢胶(resin flush removal)(Copper Reduction)薄化铜(Copper Reduction) (Horizon

2、tal Electrolytic Plating)水平电镀(Horizontal Electro-Plating) (Panel Plating)锡铅电镀( Tin-Lead Plating ) (Pattern Plating)低于1 mil ( Less than 1 mil Thickness ) f-4高于1mil ( More than 1 mil Thickness)砂带研磨(Belt Sanding)微切片( Microsection) (Plug Hole)印刷( Ink Print )表面刷磨(Scrub)h-9 UV烘烤(UV Cure)h-10文字印刷( Printing

3、 of Legend )h-12印可剥离防焊(Peelable Solder Mask)第 1*Process Module说明: A.下料( CutLamination)a-1裁板( Sheets Cutting)B.钻孔(Drilling)b-1内钻(Inner Layer Drilling )b-3二次孔(2nd Drilling)a-2b-4原物料发料(Panel)(Shear material to Size)b-2一次孔(Outer Layer Drilling )雷射钻孔(Laser Drilling )(Laser Ablation )b-5盲(埋)孔钻孔(Blind &

4、; Buried Hole Drilling) C.干膜制程( Photo Process(D/F)c-1c-3c-5c-7c-9前处理(Pretreatment)曝 光(Exposure)蚀铜(Etching)初检( Touch-up)选 择 性 浸 金 压 膜(Selective Gold Dry FilmLamination)c-2c-4c-6c-8压 膜(Dry Film Lamination)显 影(Developing)去膜(Stripping)化学前处理,化学研磨( Chemical Milling )E.减铜e-1F.电镀f-1 f-2 f-3f-5 f-7G.塞孔g-1 g-

5、3f-6剥锡铅( Tin-Lead Stripping)预烤(Precure)后烘烤(Postcure)g-2g-4H.防焊(绿漆): (Solder Mask)C面印刷(Printing Top Side)静电喷涂(Spray Coating)预烤(Precure)显影(Develop)h-1h-3h-5h-7h-2h-4h-6h-8S面印刷(Printing Bottom Side)前处理(Pretreatment)曝光(Exposure)后烘烤(Postcure)h-11喷砂( Pumice)(Wet Blasting)第2页I .镀金Gold platingi-1金手指镀镍金( Gol

6、d Finger )i-3浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J.喷锡(Hot Air Solder Leveling)j-1水平喷锡(Horizontal Hot Air Solder Leveling) j-2垂直喷锡( Vertical Hot Air Solder Leveling)j-3超级焊锡(Super Solder )K.成型(Profile)(Form)k-1捞型(N/C Routing ) (Milling)k-3板面清洗烘烤(Cleaning & Backing) k-5金手指斜边( Beveling of G/F)N

7、.雷射钻孔(Laser Ablation)N-1雷射钻Tooling孔(Laser ablation Tooling Hole)N-2雷射曝光对位孔(Laser Ablation Registration Hole)N-3雷射Mask制作(Laser Mask)N-4雷射钻孔(Laser Ablation)N-5 AOI检查及VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7除胶渣(Desmear) A/W(artwork)底片abrade粗化

8、absorption吸收N-8微蚀(Microetching )Ablation烧溶(laser),切除abrasion resistance耐磨性ACC ( accept ) acceleratedcorrosion test accelerated testacceleration acceleratoracceptable activator active workin process adhesion允收 加速腐蚀 加速试验 速化反应加速剂 允收 活化液 实际在制品 附着力i-2电镀软金(Soft Ni/Au Plating)j-4.印焊锡突点(Solder Bump)k-2模具冲(P

9、unch)k-4 V型槽( V-Cut)(V-Scoring)(Electrical Testing) (Continuity & Insulation Testing)L.短断路测试l-1 AOI光学检查( AOI Inspection)l-3泛用型治具测试(Universal Tester)l-5飞针测试(Flying Probe)M.终检( Final Visual Inspection) m-1压板翘( Warpage Remove) m-3包装 及出货(Packing& shipping) m-5清洗 及烘烤( Final Clean &Baking) m-7

10、离子残余量测试m-8冷热冲击试验l-2 VRS目检(Verified & Repaired)l-4专用治具测试(Dedicated Tester)m-2 X-OUT印刷(X-Out Marking)m-4目检( Visual Inspection) m-6护铜剂(ENTEK Cu-106A)(OSP)(IonicContaminationTest)(CleanlinessTest)(Thermal cycling Testing)m-9焊锡性试验( Solderability Testing )第3页adhesive method airinclusion air knifeamorp

11、hous change amountamylnitrite analyzer backlighting back-up bankedwork in process basematerial baselineperformance batch betabackscattering bevelingbiaxial deformationblack-oxide blank controllerblank panel blanking blipblister blistering blow holeboard-thickness errorbonding plies bow ; bowingbreak

12、 out bridging BTO(Build To Order) burning黏着法气泡风刀不定形的改变总量硝基戊烷分析仪回火环状垫圈;孔环阳极泥 阳极处理 自动光学检测 引用之文件 允收水平抽样 液态光阻 纵横比（厚宽比）到货时 背光 垫板 预留在制品 基材 基准绩效 批贝他射线照射法 切斜边;斜边 二方向之变形 黑化 空白对照组 空板 挖空 弹开 气泡;起泡 气泡 吹孔 板厚错误 黏结层 板弯 从平环内破出 搭桥;桥接 接单生产 烧焦anneal annular ring anode slime(sludge) anodizingAOI ( automatic optical insp

13、ection )applicable documentsAQL sampling aqueous photoresistaspect ratioAs received第4页毛边（毛头）一体型摄录放机碳化物 定位梢 载运剂 催化 阴极溅射法隔板;钢板 校验系统之各种要求 中心光束法 集中式投射线 认证倒角（金手指）切斜边;倒角 特性阻抗 电量传递过电压 网框 棋盘 蟹和剂 化学键 化学蒸着镀 圆周性之孔破 包夹金属 无尘室 间隙镀外表 防焊覆盖错误 热澎胀系数 冷焊点 金属粉末冷焊 颜色颜色错误 补偿 竞争力绩效 错化物 错化物 零件孔 零件面 同心 密贴性 消费性产品burr camcorde

14、r carbide carlson pincarriercatalyzingcatholicsputteringcaulplatecalibrationsystem requirements center beammethodcentralprojectioncertificationchamferchamferingcharacteristicimpedancechargetransferoverpotentialchasecheckboardchelatorchemicalbond chemical vapor depositioncircumferentialvoidcladmetalc

15、lean room clearance coat coatingerror coefficient of thermal coldsolder joint cold-weld color colorerrorcompensationcompetitiveperformancecomplexsaltcomplexorcomponentholecomponentsideconcentricconformance consumer productsexpansion (CTE)第5页contact resistance接触电阻continuous performance连续发挥效能contract

16、service协力厂controlled split均裂式conventional flow乱流方式conventional tensile test传统张力测试法conversion coating转化层convex突出coordinate list数据清单copper claded laminates (CCL)铜箔基板copper exposure线路露铜copper mirror镜铜copper pad铜箔圆配copper residue (copper splash)铜渣corrosion rate numbering腐蚀速率计数系统corrosion resistance抗蚀性co

17、ulombs law库伦定律countersink喇叭孔coupon试样coupon location试样点covering power遮盖力CPU中央处理器crack破裂;裂痕crazing裂痕;白斑cross linking交联聚合cross talk呼应作用crosslinking交联crystal collection结晶收集curing聚合体current efficiency电流效率cut-outs挖空cutting裁板cyanide氰化物cycles of learning学习循环cycle-time reduction交期缩短date code周期deburring去毛头ded

18、icated专用型degradation退变delamination分层第6页dent / pin hole凹陷/针孔第7页department of defense国防部designation字码简示法de-smear除胶渣developing显影dewetting缩锡dewetting time缩锡时间dimension error外形尺寸错误dielectric constant介质常数difficulty困难度difunctional双功能dimension尺寸dimension stability尺寸安定性dimensional stability尺度安定性dimension and

19、 tolerance尺寸与公差dirty hole孔内异物discolor hole孔黑;孔灰;氧化discoloration变色disposable eyelet method消耗性铆钉法distortion factor尺寸变形函数double side双面板downtime停机时间drill钻孔drill bit钻头drill facet钻尖切萷面drill pointer钻尖重（研）磨机drilled blank board已钻孔之裸板drilling钻孔dry film干膜ductility延展性economy of scale经济规模edge spacing板边空地edge-boa

20、rd contact ( gold finger )金手指efficiency能量效率electric test电测electrical testing电测;测试electrochemical machine ECM电化学加工法electrochemical reactor电化学反应器electroforming电铸electroless plate化学铜electroless-deposition无电镀electropolishing电解抛光第8页电解精炼电解萃取 椭圆形 脆性 可达成绩效 电镀夹杂物 环氧树酯 电位线 异常情形 蚀铜速率 蚀刻液 回蚀 评估用程序 曝光 外部插梢法 铆钉孔 铆眼 网布 故障 快速响应 瑕庛;缺陷 纤维显露纤维突出 光学点,基准记号 填充料 底片 过滤 成品 固着 电测夹具（治具）粹离 燃性等级喇叭形孔 并排电缆 回馈循环先进先出 弹性制造系统 助焊剂foil distortion铜层变形fold空泡foreign include异物electrorefiningelectrowinning elliptical setembrittlement entitlementperformance entrapmentepoxy equipotential errordata file etch rate etchants