助焊剂使用指南

1、一、助焊剂涂敷I. Application of soldering flux喷雾作业使用指南A guide to the operation of spray operation1、喷雾使用时须注意喷嘴的调整，务必使助焊剂均匀分布在PCB板面上。2、应根据实际情况调整助焊剂的喷涂量：通常须增加助焊剂喷涂量的情况有：(1) 基板严重氧化时（此现象无法用肉眼去客观辨认，须经实验室检测）。(2) 零件脚端严重氧化时（同上）。(3) 基板零件密度高时。(4) 基板零件方向与焊锡方向不一致时。(5) 多层板。(6) 焊锡温度较低时。3、当要求板面较干净时，在保证焊锡效果的情况下，可减少助焊剂喷量，但应

2、保证PCB板面上每个角落都均匀的喷上了助焊剂。4、使用含松香的助焊剂喷雾作业时，最好两个喷嘴轮流作业，以保证不堵塞喷嘴。1. Note the adjustment of nozzles when spraying operation. Make sure to enable the soldering flux to be well distributed on the PCB plate.2. Adjust the volume of spray of soldering flux as the case may be:Generally, the case where necessary

3、 increase in soldering flux includes:(1) When substrates are severely oxidized (Such phenomenon cannot be distinguished by naked eyes, so it must be subject to the test ).(2) When the part pins are severely oxidized (ditto).(3) When the density of substrates is high.(4) When the substrate part direc

4、tion is not identical to that of the solder.(5) Multi-layer plates.(6) When the solder temperature is too low.3. When it is required that the board surface should be clean, under the circumstances that solder effect is guaranteed, it is allowed to reduce the volume of soldering flux, but it is neces

5、sary to ensure that every corner of the PCB boards will be sprayed with soldering flux.4. When soldering flux containing rosin is used for spray operation, it is advisable to perform shift operation using two nozzles to ensure that the nozzles will not be jammed or blocked.发泡作业使用指南A Guide to Foaming

6、 Operation1、助焊剂发泡作业时，作业比重应随基板或零件脚氧化程度决定，助焊剂比重控制在规格值 0.01范围内，助焊剂比重随温度变化而变化，一般以20时比重为标准，从经验知在(15-30)范围内，温度每升高一度，助焊剂比重下降0.001。如某助焊剂20时比重为0.820，而在30时比重则为0.810。初试用时可先从较高比重开始逐步调低比重直到理想焊点达到为止。2、通常须设定较高比重作业情况有：与喷雾作业时须增加助焊剂喷涂量的情况相同3、日常作业中应每工作二小时，检测其比重。有超过设定标准时马上添加稀释剂恢复原设定之比重标准。反之，在低于设定标准时应马上添加助焊剂原液恢复原设定之比重标准

7、。4、采用发泡方式时请定期检修空压机之气压，最好能备置二道以上之滤水机以防止水气进入助焊剂内影响助焊剂之结构及性能。 5、发泡时泡沫颗粒应愈密愈好，应随时注意发泡颗粒是否大小均匀，反之，必有发泡管阻塞、漏气或故障。发泡高度原则以不超过基板零件面为最合适高度。但低固态含量之助焊剂发泡性能会差一些，低固态含量之助焊剂建议喷雾作业。6、发泡槽内之助焊剂不使用时，应随即加盖以防挥发与水气污染或存放至一干净容器内，未过基板焊锡时勿让助焊剂发泡，以减低各类污染。7、对于高品质要求之产品，助焊剂应于使用48小时后全部放出更换新液，以防污染、老化衰退影响作业效果与品质。8、助焊剂可用于长脚二次作业，第一次焊锡

8、时应尽量采取低比重作业，以免因二次高温而伤害基板与零件并造成焊点氧化。1. In the time of soldering flux foaming operation, the operation weight should be subject to the substrates or the oxidization of part pins. The weight of soldering flux should be controlled within 0.01 of the specification value. The weight of soldering flux chan

9、ges as the temperature does. Generally it is based on the weight at 20. From the experience, within the range of the temperature (15-30), when the temperature rises by one degree centigrade, the weight of soldering flux will drop by 0.001. If the weight of a certain soldering flux is 0.820 at 20, an

10、d the weight at 30 will be 0.810. When it is the first time for use, it can start form the higher weight and adjust to the lower weight until it reaches the ideal pad.2. Case where higher weights are set during operation include:It is the same as the case where the increase in the volume of solderin

11、g flux is necessary for spray operation3.In daily operation, it is necessary to check the weight every two working hours. In the case of exceeding the set standard, justimmed iately add thinner to restore the originally set weight standards. Otherwise, when it is lower than the set standard, it is n

12、ecessary to immediately add original soldering flux liquids to recover originally set weight standards.4.When the foaming manners are used, please make regular overhaul and check of the pressure of the air compressors. It is advisable to be able to prepare for two courses of filters to prevent water

13、 vapors from entering the soldering flux, which will adversely affect the structure and performance of soldering flux5.When it is in the foaming process, for the particles of foams, the tenser the better. It is necessary to note at any time whether the foam particles are well proportioned in size. O

14、therwise, there must be jams, leak of air or failures of the foaming tubes. The height of foaming should not exceed the substrate surface. But the foaming performance of soldering flux containing low solids will be somewhat poorer. We recommend spray operation for soldering flux with low solid conte

15、nt.6.When the soldering flux in a foaming groove is out of use, please cover it immediately so as to prevent volatility or contamination with water vapors, or keep it in a clean container. If not passing the substrate solder, please do not let the soldering flux foam so as to reduce pollution of var

16、ious kinds.7.For the products demanding higher quality, the soldering flux must be all discharged after use for 24 hours so as to replace the same with new liquids, thus preventing pollution, ageing, which may affect the operation effect and quality.8.The soldering flux may be used for long pin seco

17、ndary operation. During soldering for the first time, try to perform low weight operation so as not to injure substrates and parts due to high temperature for the second time or to cause atomization of pads.二、参数设定II. Setting Parameters预热温度： 90-140（无铅）；80-130（有铅）夹送角度：40-80（通常60）传送速度：0.8-1.5m/min锡炉温度：

18、260±10（无铅）250±10（Sn63/Pb37）Preheat temperature: 90-140 (lead free); 80-130 ( lead-containing)Jig angle: 40-80 (generally 60)Conveyance rate: 0.8-1.5m/minSolder pot temperature: 260±10(lead free)250±10(Sn63/Pb37）三、温度曲线III. Curve of Temperature无铅波峰焊温度曲线 Curve of temperature for lea

19、d-free wave soldering峰值温度250-270：Peak value temperature 250-270预热时间：Preheating time温度：Temperature时间：TimeCurve of temperature for lead-free wave solderingPeak value temperature 250-270Preheating timeTemperatureTime四、助焊剂作业安全事项 IV. Safety Cautions in Soldering Flux Operation1 助焊剂为易燃之化学材料，需在通风良好的环境作业，并远

20、离火种。2 助焊剂应储存于阴凉通风处，远离火种，避免阳光直射。3 开封后的助焊剂应先密封后储存，已使用之助焊剂请勿再倒入原包装以确保原液的清洁。4 报废之助焊剂需请专人处理，不可随意倾倒，污染环境。5 不慎沾染手脚时，立即用肥皂、清水冲洗。沾染五官时，立即用肥皂、清水冲洗，勿用手揉搓，并即时送医治疗。1. Soldering flux is a combustible chemical material. It requires operation under well ventilated operation conditions and keeps it away from fire.2. The soldering flux should be kept at