IGBT导热硅脂的涂抹及表面粗糙度要求内容

1、Thermal grease for Infine on modulesWhat should be the behavior and how a grease has to look likeBagi nskiI FAG AIM PMD ID AE2007-06-01Con siderati onsInfineon modules with baseplate: Roughness of baseplateRzmax. = 16 pm;Rztyp. = 4 - 6 pmInfineon modules without baseplate: Roughness of ceramicRzmax.

2、 = 9 pm; Rztyp. = 3 - 4 pmHeatsink: Specification of roughness regarding Application NoteModules with and without baseplate: Rzmax. = 10 pmThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as an

3、y description of warranty of a certain functionality, conditions or quality of the Inline on Technologies components. The statements contained in this communication. inclu ding any reoommendatio n or suggestion or methodology, are to be verified by the user before implementation, as operating condit

4、ions and environmenlal factors may differ. The recipient of this presentation must verify any funclion described herein in the real application. Inhwon Technologies hereby disclaims any and all warranties and liabilities of any kind (including v/ithout limitation warrardies of non-infringement of in

5、tellectual properly rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Tech no logies 2006 All rights reserved PageCon siderati onsExample of roughness of baseplate and heatsinkRzmax.=10 pmThe information given in this pre

6、sentation is given as a hint for the impleme ntahon of the Infi neon Tech no logies compone nls only and shall no! be regarded as any description of v/arranty of a certain functionality, conditions or quality of the Inline on Technologies components. The statements contained in this communication, i

7、ncluding any recommendatio n or suggestion or methodolog y. are to be verified by the user before implementation, as operating conditions and environmenial factors may differ. The recipient of this presentation must verify any function descnbed herein in the real apphcation. Inhwon Technologies here

8、by disclaims any and all warranties and liabilities of any kind (including without limilation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Tech no logies 2006 A

9、ll rights reserved Page 3Con siderati onsThermal conductivity:Copper:入 u 390 W / mKAluminium: A u 237 W / mKThermal compound:入 u 1 W / mKThe information given in this presentation is given as a hinI for the implementalion of the Infineon Technologies components only and shall not be regarded as any

10、description of v/arranty ol a certain fundionality. conditions or quality of the Inline on Technologies components. The stateme nls contained in this comm un ication. inclu ding any recommendalio n or suggestio n or methodology are to be verified by the user before implementation, as operating condi

11、tions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real apphcation. Inhwon Technologies hereby disclaims any and all warranties and liabilities of any kind (including v/ithout limitation warranlies of non-infringement of in

12、tellectual property rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Tech no logies 2006 All rights reserved Page 4Con siderati onsDiagram with thermal greaseDiagram with thermal greaseRth JCRth JCRth CHRth CHRth CHtherm

13、algreasemetallthermal greaseRth HARth HARRII Rth greasemetall th grease Rth ch air 42 mK/WRth ch metall Rth ch thermal grease0.004 mK/W Metal to Metal con tact essential= Thermal grease that fills only the gapes is preferedThe info rmation given in this presentatio n is given as a hint tor the imple

14、mentation of the In hneon Technologies comp on ents only and shall not be regarded as any description of warranty of a certain functionality, conditi ons or quality of the Inline on Technologies components. The statements contained in this communication, including any recomme ndatio n or suggestion

15、or methodolog y. are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real apphcation. Inhwon Technologies hereby disclaims any and all warranties and li

16、abilities of any kind (including v/ithout limitation warranlies of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Tech no logies 2006 All rights reserved Page 5Con siderati ons

17、Thermal grease consists of different componentsOily partsOnly needed to adjust the viscosity of the grease Thermal conducting partsNecessary to con duct baseplate and heatsi nk togetherRzmax. = 10 pmThe information given in this presentation is given as a hint for the implementahon of the Infineon T

18、echnologies componenls only and shall no! be regarded as any description of warranty of a certain functionality, conditions or quality of the Inline on Technologies components. The statements contained in this communication. includ ng any recomme ndatio n or suggestion or methodology. are to be veri

19、fied by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real apphcation. I朮insn Technologies hereby disclaims any and all v/arranties and liabilities of any kind (includi

20、ng without limilation warranties ol non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Tech no logies 2006 All rights reserved Page 6Con siderati onsTher mal in terface material: E

21、xample for better understand! ngGrain size: Up to 70 pmThe information given in this presentation is given as a hinI for the implementalion o/ the Infineon Technologies components only and shall not be regarded as any description of warranty of a certain functionality, conditions or quality of the I

22、nline on Technologies components. The stateme nls contained in this comm un ication. including any recommendalio n or suggestion or methodology are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must

23、verify any function described herein in the real apphcation. Inhwon Technologies hereby disclaims any and all warranties and liabilities of any kind (including v/ithout limitation warranlies of non-infringement of intellectual property rights of any third party) with respect to any and all informati

24、on given in this presentation.6-Mar-08BaginskiCopyright Infineon Tech no logies 2006 All rights reserved Page 7Con siderati onsExample: Thermal grease with 40 pm size in applicationTemperaturedrop390 W/mK Small temp, drop1 W/mK Big temp, drop237 W/mK Small temp, dropNo chanee to moveThe information

25、given in this presentation is given as a hint for the impleme ntation of the In fineon Tech no logies components only and shall not be regarded as any description of warranty of a certain fundionality. conditions or quality of the Inline on Technologies components. The statements contained in this c

26、ommu nicalion. i nelu ding any recommendalio n or suggestion or methodolog y. are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any funciion described herein in the real appheation. Inhwo

27、n Technologies hereby disclaims any and all warranties and liabilities of any kind (including v/ithout limitation warranlies of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon T

28、ech no logies 2006 All rights reserved Page 8Con siderati onsExample of grains of 40 pm sizeGrease works= RthcH = badThe information given in this presentation is given as a hint for the impleme ntahon of the Infineon Tech no logies components only and shall not be regarded as any description of war

29、ranty of a certain functionality, conditi ons or quality of the Inline on Technologies components. The statements contained in this communication, including any recomme ndatio n or suggestion or methodolog y. are to be verified by the user before implementation, as operating conditions and environme

30、ntal factors may differ. The recipient of this presentation must verify any function descnbed herein in the real apphcation. Inhwon Technologies hereby disclaims any and all warranties and liabilities of any kind (including v/ithout limitation warranties of non-infringement of intellectual property

31、rights of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Tech no logies 2006 All rights reserved Page 9Con siderati onsExample: Thermal grease with 5 pm size in applicationTemperaturedropThe information given in this presentatio

32、n is given as a hint for the implementation of the In fineon Tech no logies comp onenls only and shall not be regarded as any description of warranty of a certai n fundionality. conditions or quality of the Inline on Technologies components. The statements contai ned in this communication. includng

33、any recomme ndatio n or suggestion or methodology. are to be verified by the user before implementation, as operating conditions and en vironmenlallactors may differ. The recipient of this presentati on must verify any function described herein in the real application. Infineon Technologies hereby d

34、isclaims any and all warranties and liabilities of any kind (including v/ithout limitation warranties ol non-infringement of intellectual property rights of any third party) with respect to any and all informalion given in this presenlation.6-Mar-08BaginskiCopyright Infineon Tech no logies 2006 All

35、rights reserved Page 10Con siderati onsExample of grains of 5 pm sizeHole to fix module with the heatsink= RthcH = goodThe information given in this presentation is given as a hint for the implemerdalion of the Infineon Technologies components on and shall not be regarded as any description of warra

36、nty of a certain functionality, conditions or quality of the Inline on Technologies compone nls. The statements contained in this communication. including any recommendation or suggestion or methodology. are to be verified by the user before implementation, as operating conditio ns and environmental

37、 factors may differ. The recipient of this presentation must verify any function described herein in the real apphcation. Infinsn Technologies hereby disclaims any and all warranties and liabilities of any kind (including v/ithout limitation warranlies of non-infringement of intellectual property ri

38、ghts of any third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Tech no logies 2006 All rights reserved Page 11Con siderati onsDots of greaseViscosity of thermal grease: High viscosity (hard) | 1BaseplateHeatsi nkPerma nentgap _Baseplate

39、HeatsinkI ne mforrrat or g ver .r tn 3 presentaUon s given as a hint for the tmplemer func： ona ty. conc.tions or quality o! the Infineon Technologies componenls. ver ! es oy:ne user bcicrc rnplementation. as operaling conditions and envi application. Infineon TechnJbgies hereby disclaims any and al

40、l v/arranties a third party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006 All rights reserved.Page 12Dots of greaseCon siderati onsViscosity of thermal grease: Low viscosity (fluid) | 1BaseplateHeatsinkoutThe informalion give

41、n in this functionality, conditions or q，匚【！ ec cy 7ie user betcrc mplefnentalion. as operating condtbons and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real appiicati on. Infineonthird party) with respect to any and all info

42、rmation given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006 All rights reserved.Page 13Con siderati onsRoughness of heatsinkRzmax.=1 pmRztyp.HeatsinkPermanent distaneeThe information given in this presentation is given as a hint for the impleme ntalion of the In fineon Te

43、ch no logies components only and shall not be regarded as any description of v/arra nly of a certai n fundionality. conditions or quality of the Inline on Technologies compone nls. The stateme nls contained in this comm un icatio n. inclu ding any recommendatio n or suggestio n or methodology are to

44、 be verified by the user before implementation, as operating conditions and en vironmenlallactors may differ. The recipient of this presentati on must verify any function described herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any ki

45、nd (including v/ilhout limitation warrardies of non-infringement of intellectual property rights of any third party) with respect to any and all informalion given in this presentation.6-Mar-08BaginskiCopyright Infineon Tech no logies 2006 All rights reserved Page 14Con siderati onsRoughness of heats

46、inkRzmax. = 10 |JmCrossover possibleThe information given in this presentation is given as a hint for the impleme ntabon of the Infineon Tech no logies compone nls only and shall not be regarded as any description of warranly of a certain fundionality. conditions or quality of the Inline on Technolo

47、gies components. The statements contai ned in this communication, induing any recommendatio n or suggestion or methodolog y. are to be verified by the user before implementation, as operating conditions and en vironmenlal factors may differ. The recipie nl ofthis presentation must verify any fun cti

48、on described herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind including without limilation warranties of non-infringement of intellectual property rights of any third party) with respect to any and all informalion given in this

49、 presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006 All rights reservedPage 15Considerations of thermal foilFoil workslike distaneekeeper- bad Rth6-Mar-08BaginskiCopyright Infineon Technologies 2006 All rights reserved.Page 16The informalion given in this presentation is given as a hi

50、nt for the implementation of the Infineon Technologies components only and shall not be regarded as any desenption of warranly of a certain fundionality. conditions or quality of the Inline on Technologies components. The stateme nls contained in this comm un ication. i nelu ding any recommendalio n

51、 or suggestion or methodology are to be verified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the real application. Infineon Technologies hereby disclaims any and all w

52、arranties and liabilities of any kind (including v/ilhout limitation warrardies of non-infringement of intellectual property rights of any third party) with respect to any and all information given in this presentation.Considerations of phase change materialBefore first heat up(no phase change)F=3Nm

53、F=3NmFoil workslike distaneekeeperThe information given in this presentation is given as a hint for the implementation of the Infineon Tech no logies components only and shall not be regarded as any description of warra nly of a certai n fundionality. conditions or quality of the Inline on Technolog

54、ies components. The statements contai ned in this communication, induing any recomme ndatio n or suggestion or methodolog y. are to be verified by the user before implementation, as operating conditions and en vironmenlallactors may differ. The recipient of this presentati on must verify any functio

55、n described herein in the real appheation. Inhnsn Technologies hereby disclaims any and all warranties and liabilities of any kind (including v/ithout limitation warranties ol non-infringement of intellectual property rights of any third party) with respect to any and all informalion given in this p

56、resenlation.6-Mar-08BaginskiCopyright Infineon Tech no logies 2006 All rights reserved Page 17Considerations of phase change materialAfter heating up(phase change)F=?Nm Loose of pressure F=?Nm!Baseplate:HeatsinkFoil workslike distaneespacersThe information given in this presentation is give n as a h

57、int for the implementation of the Infineon Tech no logies components only and shall not be regarded as any description of warranly of a certai n fundionality. conditions or quality of the Infineon Technologies components. The statements contained in this communication. including any recommendation or suggestion or methodology. are to be verified by the user before implementation, as operating conditions and environmenlal factors may differ. The recipient of this presenlalion must verify any function desenbed herein in the real application. Infineon Technologi