Allegro_建库和封装命名规则

1、Allegro_建库和封装命名规则 前言器件封装是逻辑和物理的连接体。所有的设计都是通过PCB来进行连接的。封装的正确是正确PCB的第一步。现在的实物封装有很多种，例如我们常见的BGA、QFP、PLCC等。不同的封装有不同的作用和有缺点。不同的EDA工具有不同的封装建立保存方法和封装类型。在CADENCE的设计软件ALLEGRO种主要存在以下五种封装类型文件，每种类型有不同的用处。1、Package Symbol 、一般元器件封装，例如电阻电容、芯片IC BGA等。他要求和逻辑设计中的项目标号一一对应。是逻辑设计在物理设计中的反映。包含：焊盘文件.pad ,图形文件.dra 、符号文件.psm

2、和Device .txt文件。2、Mechanical Symbol、主要是结构方面的封装类型。由板外框及螺丝孔等结构定位器件所组成的结构符号。包含：图形文件.dra ，和符号文件.bsm有时有必要添加device .txt file。有时我们设计PCB 的外框及螺丝孔位置都是一样的, 比如显卡, 电脑主板、服务器和同一插筐的不同单板。每次设计PCB时要画一次板外框及确定螺丝孔位置, 显得较麻烦。这时我们可以将PCB的外框及螺丝孔建成一个Mechanical Symbol, 在设计PCB 时, 将此Mechanical Symbol 调出即可,这样就节约了时间。3、Format Symbol、

3、辅助类型的封装(用来处理图形)。例如：静电标识、常用的标注表格、LOGO等。主要由图形文件.dra ，和符号文件.osm组成。是我们设计中不可缺少的一种封装。4、Shape Symbol、建立特殊焊盘所用的符号。例如不规则焊盘、金手指焊盘的建立都要将不规则的形状建成个Shape Symbol, 然后在建立焊盘中调用此Shape Symbol。避免了在焊盘编辑中无法编辑不规则焊盘的局限。这样，通过ALLEGRO，我们可以设计任何你想要的焊盘形状。5、Flash Symbol焊盘连接铜皮导通符号, 后缀名为*.fsm。在PCB 设计中, 焊盘与其周围的铜皮相连, 可以全包含, 也可以采用梅花辨的形

4、式连接, 我们可以将此梅花辨建成一个Flash Symbol, 在建立焊盘时调用此Flash Symbol。我们也可以在焊盘的设置中进行选择，从而不要去建这样的Symbol。在以上的几种封装，我们常用的就是Package Symbol和Format Symbol。关于封装的具体建立方法请见下文。Allegro create package symbol一，建立PAD 步骤：1. IC 器件原则：solder mask and past mask= Regular pad .一般我们使用椭圆形焊盘。Ex : O70X20表示椭圆形焊盘长70mil 宽20mil.定义：2.PTH 器件原则具体如下

5、：Thermal Pad 请参考下图：Pad and flash naming ruleDip name rule Dip padPad 形状pad size +D+ drill size Pad 形状表示方法如下：Circle pad :cSquare pad :s Oblong pad: o Rectanglepad :rEx:C120d96 pad 形状为circle ,pad size为120 mil ,drill size 为96 SMD PADNp+drill sizeEx:np 120SMD PADPAD 形状pad(长)X pad（宽）Ex: o70x20 oblong 形状长

6、为70mil 宽为20mil Pad 形状表示方法如下：Circle pad :c Square pad :s Oblong pad: o Rectangle pad :rFlash naming rule Circle flashTh + Outer Diameter size Ex: th68= Outer Diameter size is 68 milsOblong flashTh+ flash长Xflash宽Ex; th427X187Make flash ruleOuter Diameter size=drill size+30 Inner Diameter size= Outer D

7、iameter size-30=drill hole Spoke width: 20 30mils ; Num.of Spoke :4 ; Spoke angle : 45oPTH pad 命名：C*D* 其中C代表PTH焊盘大小，D代表dill 的大小。EX: C56D40 .但是常用器件第一PIN 用方形焊盘，命名规则S*D* EX: S56D40NPTH pad 命名NPTH* OR NP*见表格描述：Notice: 过孔的 thermal 比较特殊，请见下表格： 2.3.add line /BODY_CENTER 从pitch ,body center , width, height

8、位置）。5.Add shapes/ solid fill Via18d8bga NPTH400 NP40 NP140 NP1009.Add 4 test a, DEVICE TYPE /SILKSCREEN _TOP 命名为封装名。b, REFDEFS / SILKSCREEN _TOP 命名器件代号ex : U*. c, COMPONMENT VALUE /ASSEMBLY_TOP 命名代号为V* d, REFDEFS / ASSEMBLY_TOP 命名代号为U*10. File / create symbol ,save file .psm 11.File / create device

9、file.txt. 12,.File /save.SMD器件（I C , CONNCTOR ）PAD 建库原则1. smd pad solder mask =regular pad size .2.两pad 安全间距在8mil以上。3.pitch 4.Pitch 0.5 mm 新建Pad 比实体pad外凸1520 mils. Pad 长70mils.Pin 1 *markSMD 器件（非IC ）PAD 建库原则：1.PAD 以实体pad每边长1520mils2. PAD 以实体pad每边宽1520mils3. resistance and MOSFEET PAD可以在加长。4.参考Intel

10、器件的做法0603-1812 只加长不加宽。NPTH PAD建库原则：1.PAD = drill hole 2.regular pad=drill hole ;thermal reliefpad and anti pad =drill hole+30 mils 3.solder mask =04.加route keep out /alllayer 比drill hole 30 mils. Footprint 命名规则了解pitch 代号命名规则type :Con pin 排列对照表。HORIZONTAL Document Revision: Data : Design Engineer : R

11、eference: SOP SSOP QFP SOT Via NPTH400 NP40 NP140 NP100 via Via20d10 via20d10bga via18d10 via19d10 Via20d12 Via22d12 Via22d12bga SOTViaPitch 以公制表示D: 直径Body Dia公制单位mm 表示直立PS :Normal 状态能为平躺。电阻(resistance)SMD SMD=R+Size Ex : 0603R1206R10=pitch 1.0mm排阻，排容：Ex: 8P4R0402, 4P2R0402.电容(capacitance)（无极性）SMDSM

12、D =C+SIZEDIPDIP =C+PITCH EX :C08=PITCH 0.8 mm EX :C10=PITCH 1.0 mm Pitch电解电容SMDSMD=CES+SIZEEx:CESA.CESB.CESC.CESDDIPDIP=CE+PITCH +BODYEX :CE20D50=Pitch 2mm直径5mm Pitch :公制为位mm Body dia :公制为位mm钽电容：（有极性）ex: A type =CTA ex: B type=CTB type二极管(有极性需要加二极管标注符号并注NPTH400viaVia20d10Via20d10via18d10via19d10SMDS

13、MD =D+Size EX: D 0603, D1206 SizeDIPDIP =D+Pitch Ex: D08= pitch0.8mm Ex: D10=pitch 1.0mm Pitch 以公制表示 LED(有极性需要加二极管标注符号 SMD D+size Ex d 0603.d 1206 sizeDIP2.5mm,直径DIP=LED + Pitch +body EX: LED25D56=Pitch 5.6mm EX:LED25D32=Pitch 2.5mm,直径 3.2mmPitch :公制为位 mm Body dia :公制为位 mm FUSE& POLY SWITCH FUSESMDS

14、MD=F+SIZE EX: F2411=SMD FUSESizeDIP DIP=F+size Ex: f100=dip fuse ,pitch 10mm Pitch :公制为位 mm 电感（inductance ）& BEAD SMD SAD=Size Ex: 0603;0402; Size DIP DIP=L + pitch Ex: L08=pitch 0.8mm L10=pitch 1.0mm Pitch :公制为位 mm CHOCK SMD SMD=CKS+PIN +PITCH 代号+type EX: CKS8JU =smd chock ,8 pin ,pitch 1.27 ,U typ

15、e . pin pitch 代号 type DIP DIP=CK +pitch +body Ex: CK90D220=CHOCK ,Pitch 9mm 直径并注明正负极在 footprint 外面) SMDVia20d1022mm NP40NP140 Via20d12 Via Via20d10DIP=X+Pitch+L ;Pitch :公制为位,L: 平躺。EX: X25L=XTAL,Pitch2.54mm ,Lay down. QSCILLATORDIP ArrayDIP =OSC +4(PIN)(+H=Half)SMDSMD=OSC+S+4(PIN 数)BGABGABGA=BGA+PIN+

16、PITCH代号SMD IC=PACKAGE+PIN 数pitch2.54 mm. 宽度20pin 以下为600mil ex:DIP14W宽度20pin 有I/O CONNECTOR AGPAGP=AGP+PINAMRAMR=AMR+PIN (数)AUDIO JACKAUDIO JACK=AUDIO JACK+PIN数（CNRCNR=CNR+PIN数。PIN 数DC JACKDCJ +宽X长PIN数。Ex: DCJ90X130P3=9X13mm, 3pinDDR DDR=DDR+PIN数（R90度）( R=右边)数15=2排，公套 25pin.SMDSMD=DSUB S +排数公母套 PIN数

17、排数F :f e m a l /M :m a n p i n 数 Ex: DSUBS1M15=1排，公套 25pin.VGAVGA=VGA+排数公母套 PIN 数排数 F:femal/M:man pin 数 EX:VGA3F15=3排，母套 25pin.FDD (FLOPPY DISK CONNECTOR) FDDFDD=FDD+PIN 数pitch 代号type(+OPIN =抽 PIN) PIN PITCH TYPE PIN 号 EX:FDD34MZ=34PIN PITCH2.54mm ZTYPE GOLDEN FINGERGFPIN 数正背面 GF=GF+PIN （Aor B ） HDD

18、 HDDHDD=IDE+PIN 数PITCH 代号TypeEx:IDE40MZ=40PIN ,pitch2.54mm,Z TypeHEADER CONNECTOR H+固定功能 pin 数pitch 代号。 EX: HAUXIN4M=Header AUXIN ,4PIN ,PITCH2.54mm Ex: HCDIN4M= Header CDIN ,4PIN ,PITCH2.54mm固定功能 PIN 数 PITCH 代号PCI PCIPCI=PCI+PIN 数 PIN 数POEWRCONNECTOR PWRPWR=PWR+pin 数pitch 代号+TYPE 。PIN 数 PITCH 代号 TY

19、PER J25&RJ11 DIP DIP=RJ+代号（ led ）(+_IN=IN BOARD)EX:RJ11,RJ45_LED,RJ45_IN 代号 pin 数 IN/LED 在板内、包括 LED SMDSMD=RJS+代号（led ）(+_IN=IN BOARD)代号 pin 数 IN/LED 在板内、包括 LED USB USB USB=USB+PIN 数（X 组数） p i n 数组数 Ex:USB4x2=4PIN USB,2组数 了解 pitch 代号命名规则 type:connector pin 排列对照表。PIN 数 Pitch 代号TYPE EX:PWR20NWP1=20PIN

20、,Pitch4.2mm +( WP1)TYPE ZT Y P EYT Y P EAllegro -Create packagesymbol and naming rulecharact erABC15.7480 19.6850 23.6220D :直径R: 90度角S: STAND 直立的H: HORIZONTAL 2Planet 12/23/2005 Page 17 All rights reserved Author: 以下为参考文件原稿CESD TYPE (2) DIP = CE + Pitch + Body+Height ex ：CE20D50H110 = Pitch2mm, Diam

21、eter5mm Height 11mm ex ：CE20D50H110, CE25D63H110, CE35D80H200,CE50D100H300 ex ：CE50D130H400, CE75D160H400, CE75D180H400VGAF 包PC BFootprint Nami ng Ru le 1.Battery(1) DIP = BAT + Pitch + D + body (+ S ) ex : BAT269D200= Pitch26.9mm, diameter 20mm PIN QTY D ：Diameter Stand Pitch X10, Unit:mm Body Dia.

22、 X10, Unit: mm(2) SMD = BAT + S + Pitch + D + body ( + S ) ex : BATS310D200 = Pitch31mm, diameter20mmD ：Diameter Stand PS : Normal Type is lying PitchX10, Unit: mm Body Dia.X10, Unit: mm2.Resistor ：(1) SMD = R + Size, Unit: inchex ：R0603, R1206Size(2) DIP = R+Pitch ex ：R6 = Pitch 0.6mmex ：R100 = Pit

23、ch 10mm Pitch Unit: mm X103.Chip Resistor Network,Chip Capacitor Network ：8P4R0603, 10P8R0603, 8P4C0603 . ex ：8P4R0603, 10P8R0603 ex ：8P4R0402, 4P2R04022 4 6 8 13 5 74.Capacitor ( No Polarity)：(1).SMD = C + Size ex ：C0603, C1206Size(2)DIP = C+Pitch ex ：C8 = Pitch 0.8mm Dia.X10, Unit:mm Unit:mm Layou

24、t(2) SMD = D + Size ex ：D0603, D1206 Si ze (3) DIP = D+Pitch ex ：D8 = Pitch 0.8mm ex ：D100 = Pitch ：CE20D50H110 = Pitch2mm, Diameter VGAF 包 Body x10, Width X Length, Unit: mm PIN Qty 90 Degree 9.FUSE & POLY SWITCH FUSE：(1) SMD = F + Sizeex：F2411 = SMD FUSE, Length X Width: 240X110mil Size(2) DIP = F

25、 + Pitchex : F100 = DIP FUSE, Pitch 10 mmUnit:mm10.Inductance & BEAD：(1) SMD = Sizeex：0603, 1206 Size(2) DIP = L + Pitch ex：L8 = Pitch 0.8mm ex：L100 = Pitch 10mmPitch X10, Unit:mm11.CHOCK：(1) SMD = CKS + PIN Qty + Pitch Code + Typeex : CKS8IU=SMD CHOCK,8PIN,Pitch1.27mm,U TYPE PIN Qty Pitch Code Pin

26、order type(2) DIP = CK + Pitch + Body ( + H = Horizontal ) ex : CK90D160 = CHOCK, Pitch9mm, 直徑16mmPitch X10, Unit:mm Body Dia.X10, Unit:mm Horizontal12.Transformer：(1) SMD = TFS + PIN Qty + Pitch Code + Typeex : TRS16IU = SMD Transformer, 16PIN,itch1.27mm, U Type PIN Qty Pitch Code Pinorder type(2)

27、DIP = TF + PIN Qty + Pitch Code + TypePINQtyPitch TYPE Pin order follows the pin name of each typePackagePIN Number ex : SOT23_EBC = Package: SOT23，PIN Number:EBC ex : SOT23_GSD =Package: SOT23，PIN Number:GSD14.SWITCH：(1) SMD = SWS +PIN Qty + SIZE ( +R= 90degree ) ex : SWS4D45 = 4PIN, Size 4.5X4.5 m

28、m13.Transistor.FETPackage + PIN NumberPIN Qty Body Dia.X10, Unit: mm 90 Degree(2) SOIC Type = SWS + PIN Qty + Pitch Code + Pin order type ex : SWS8JV(3) DIP IC SW = Use DIP IC PIN Qty Pitch Code TYPE ex : DIP14, DIP16(4) DIP = SW + PIN Qty + Pitch ( + R= 90 Degree) ex : SW3P47R = 3PIN, Pitch 4.7 mm,

29、 90degreePIN Qty Pitch X10, Unit:mm 90 Degree 15. XTAL：(1) SMD = X + PIN Qty + S + Length X Width ex :X4S104X41 = SMD XTAL, 4PIN, BODY 10.4 X 4.1 mmex : X2S127X48 = SMD XTAL, 2PIN, BODY 12.7 X 4.8mmBody Length X Width,Unit: mm(2) DIP = X + Pitch + L ex : X25L = XTAL, Pitch2.54mm, Lay downex : X50L =

30、 XTAL, Pitch5.08mm, Lay down Pitch X10, Unit:mm Lie16. OSCILLATOR ：(1) DIP = OSC + 4 (Qty) (+ H = Half )ex :OSC4 , OSC4HP I N Qty Half Size (2) SMD = OSC + S + 4 (PIN Qty)PIN Qty Lie 17. BGA ：(1) BGA + PIN Qty + Pitch Code ex ：BGA352J = BGA, 352PIN, Pitch 1.27 m 18.IC ：(1) SMD IC = Package + PIN Qty

31、 + Pitch Code+ Width Code ex ：SSOP28FA = SSOP, 28PIN ，Pitch 0.65 mm, Width250 milPackage PIN Qty Pitch Code Width Code(2) DIP IC = DIP + PIN Qty ( + W ),Pitch=2.54mm Width=300 mil (Below 20 Pins) ex :DIP14 Width=600 mil (Above 20 Pins) ex : DIP24WWidth=300 mil or 600 mil (20 Pins) ex :DIP20,DIP20W 1

32、9.Display (熒光管)(1) DIP = DISP + PIN Qty + Pitch( + R= 90 Degree) ex : DISP10P18R=10PIN, Pitch 1.8 mm, 90 DegreePIN Qty Pitch X10, Unit: mm 90 Degree 20.Band-pass Filters(1). SMT=BF+Size ex : BF2520 Size 21.Broad Band Ceramic Antenna(1)SMD = CAS + Body(Length X Width) + P + Pin Qty +R(90 Degree) ex :

33、 CAS52X20P2 = 2PIN, Size 5.2X2.0 mm ex : CAS76X35P6V = 6PIN, Size 7.6X3.5 mm22.Test Coupon(Test component for MB ）Body: Length X Width, Unit: mm PIN Qty 90 Degree m ex ：BGA487H = BGA , 352PIN, Pitch 1.0mm Vender+PN (2) Fixed Function BGA (a) CPU = P3，P4 (b) NorthBridge = GMCH ，SPRINGDALE (c) SouthBr

34、idge= ICH4，ICH5 第 5 頁，共19 頁(1). SMT=TESTS+Pin Qty +Pitch Code（2）DIP=TEST+Pin Qty+Pitch Code PIN Qty Pitch Code(3) DIP Multi_Rows = J + Row X Pin Qty(Single Row) + Pitch Code + TypeRow Pin Qty/Each Pitch Code TYPE O:Omitted PIN Number23.TEST POINT =SeeTestpoint-viaNamerule.xls(1) SMT = Single side TP

35、 (2)DIP_ NONECAP = Open soldermask in both sides(3)DIP_CAP = One side covered and one side open 24.IR Receiver Modules for Remote ControlCircuit SystemTSOP48 Series Body Length X Width,Unit: mm PIN Qty 90 DegreePitch CodeSOIC Width Code TYPE=Connecter Pin Order Form*If a component with polarity, The

36、 first pin must be anode and should assign a + ,We must assign a circle with 10 mils width beside th ICs Pin 1 Pitch=ICs width(The largest size in the spec)+30mil-length(pads length)PIN QtyPitch Code Connector Footprint Naming rule 一 . I/O CONNECTOR ：According to the function1.AGP ：: AGP+Pin QtyPin

37、Qty2.AMR ： AMR + Pin QtyPin Qty 3. AUDIO JACK ：AUDIO + Pin Qty ( X Group ) (S=Stand)ex ：AUDIO5X3S ex ：AUDIO3, AUDIO5 Pin Qty GroupStand/doc/9f2009b9a1c7aa00b52acbd3.htmlR ： CNR + Pin Qty Pin Qty 5. DC JACK ：DCJ + Width X Length + Pin Qty ex :DCJ90X130P3 = 9 X 13 mm, 3 PINBody

38、Width X Length, Unit: mm Pin Qty6.DDR ：DDR + Pin Qty ( + R = 90 Degree )( R = Right) ex : DDR184RR = 184PIN, 90 Degree, Right angleex : DDR184R = 184PIN, 90 Degree, Left anglePin Qty 90 Degree Right7. D_SUB CONNECTOR ：(1) DIP = DSUB + Row + M/F ex ：DSUB2F25 = ROW 2, Femalee, 25PINex ：DSUB2F15 = Row:

39、 2, Female, 15PIN Row M : Male Pin Qty(2) SMD = DSUBS + Row + 公Female + Pin Qty ex ：DSUBS1F25 = Row: 1, Female, 25PINRow M : Male Pin Qty(3) VGA conncetor Begin with VGAex ：VGA3F15 = Row: 3, Female15PIN F : Female ex ：VGA2F15 = Row: 2, Female15PIN Row M : Male Pin Qty8. FDD ( FLOPPY DISK CONNECTOR )

40、：FDD + Pin Qty + Pitch Code + TYPE ( + O PIN= 抽 PIN ) ex ：FDD34MZ = 34PIN,Pitch 2.54 mm, Z TYPE ex ：FDD34MZO3 = 34PIN,Pitch 2.54 mm, Z TYPE, 3rdOmittedPin Qty Pitch Code TYPE O:Omitted PIN Number9. FPC CONNECTOR ：FPC + Pin Qty + Pitch Code ex ：FPC8H=8PIN,Pitch 1.0 mmex ：FPC28C=28PIN,Pitch 0.5 mmPin

41、Qty Pitch Code 10.Golden Finger1. GF + Pin Qty ( + A or B )_Function ex :GF164_PCIEX16,GF36_PCIEX1 11. HDD ( HARD DISK CONNECTOR )：IDE + Pin Qty + Pitch Code + Type ex ：IDE40MZ = 40PIN,Pitch 2.54 mm,Z Type Pin Qty Pitch Code TYPE 12. Header Connector ：(1) H + Fixed Function + Pin Qty + Pitch Code(a)

42、 HAUXIN4M = Header AUX IN, 4 PIN, PITCH 2.54 mm(b) HCDIN4M = Header CD IN, 4 PIN, PITCH 2.54 mm(c) HMDMIN4M = Header Modem IN, 4 PIN, PITCH 2.54 mm(d) HFAN3M = Header FAN, 3 PIN, PITCH 2.54 mm(e) HWOL3M = Header Wake on LAN, 3 PIN, PITCH 2.54 mm Fixed Function Pin Qty Pitch Code (2) DIP Single Row =

43、H + Pin Qty + Pitch Code + Type (+ O PIN =Omitted PIN) ( + R = 90 Degree )DIP Single Row =H + Pin Qty + Pitch Code + Type (+ P PIN =Peg PIN) ( + R = 90 Degree ) ex ：H4MP1 = 4 Pin, Pitch 2.54 mm, PEG1 ex ：H5MO2 = 5 Pin, Pitch 2.54 mm, 2th Omitted Foxconn HBnn Series ：Pin Qty Pitch Code O:Omitted Pin

44、number 90 Degree (3) DIP Double Row = H + Row X Pin Qty(Each Row) + Pitch Code + Type ( + R = 90Degree ) ex ：H2X10MZO12 = Double Rows, Total 20 Pins, Pitch 2.54 mm, Z TYPE, 12thOmitted ex ：H2X5MZO8 = Double Rows, Total 10 Pins, Pitch 2.54 mm, Z TYPE, 8th OmittedFoxconn HCnn Series ： Pin Qty BBottom

45、side ex : PCIEX16 RowPin Qty/Each Pitch Code TYPE O:Omitted PIN Number 90 Degree(4) DIP Double Rows = HH + Row X Pin Qty(Each Row) + Pitch Code + Type ( + R = 90 Degree ) Foxconn HLnn Series ： Housing Row Pin Qty/ Pitch Code TYPE O:Omitted PIN Number 90 Degree Each row13. IEEE1394：1394( + S) ex ：139

46、4,1394S S=Stand14.ISA ：ISA + Pin QtyP i n Q t y15. MINI DIM VODEO JACK :MIND + Pin Qty ex ：MIND4 Pin Qty16.PCI ：1. PCI+Pin Qty2. PCIE+Pin Qty_WAY= PCI EXPRESS Pin Qty ex : PCIE164_X16,PCIE98_X8, PCIE64_X4, PCIE36_X1 3. MINIPCI+Pin QtyPitch Code + Type ( + P =17. POWER CONNECTOR ： Pin Qty 90 Degree P

47、WR + Pin Qty +PEG ) ex ：PWR20NWP1 = 20 Pin, Pitch 4.2 mm, W Type, PEG 1 PIN ex : pwr24nwp2_hm25=24Pin, Pitch 4.2mm, W type, PEG 2 PIN, With a NON-PTH Hole between Pin 1 and Pin 3 Special PN ex : HM25 Pin Qty Pitch Code TYPE PEG Pin QtyPower Connector with several rowsJFPWR5X6KL= Vendor: FCI,5X6Pins,

48、Left Angle JFPWR5X6KR= Vendor: FCI,5X6Pins,Right Angle Row Pin Qty/ Pitch Code Direction Each RowL: LeftAngleR: Right Angle18. PS2：(1) DIP = PS2 ( X Group ) ex ：PS2X2 = 2 IN 1 PS2 Group (2) SMD = PS2S ( X Group ) ex ：PS2S Group 19. RJ11 & RJ45 :(1) DIP = RJ + Code name ( + LED )( +_ IN=In Board ) ex

49、 ：RJ11, RJ45-LED, RJ45-INCodenamePIN Qty IN= In Board type ：CE20D50H110 = Pitch2mm, DiameterVGAF 包20. USB ：(1) DIP = USB + Pin Qty ( X Group )-Only A type ex ：USB4X2 = 4PIN USB, 2 IN 1 Pin QtyGr o up(2) SMD = USBS + Pin Qty ( X Group ) ex ：USBS4(3)DIP=USB+TYPE+Pin Qty ( X Group ) ex ：USBB421. 2 IN 1

50、 & 3 IN 1：Add _ Between them .ex : USB4_RJ45_LED ex : AUDIO5_GAME15 ex: DSUB2F25_2M9X222.CPU ， CHIPSET HEATSINK(1) Fixed Function (a) CPU = P3，P4(b) NorthBridge = GMCH ，SPRINGDALE (c) SouthBridge= ICH4，ICH5 23.Mini-B Receptace ConnectorMINIB524.RETAINER FOR 3GIO CONNPCI_RM25.RCA SIGNLE JACK (SPDIF)R

51、CA3=1Group ，3pin26. CF HEADER CONNECTOR(1) V e n d o r : F ox con n = F uNC F 50E _A Pin QtyGrou p Pin QtyGrou p ：CE20D50H110 = Pitch2mm, DiamVGA F D A 6 1 6 0 2 -A 3C F 5 0 E _ C R = P N : 1D A 6 1 6 0 0 -W Y -C RC F 5 0 E _ M T = P N : 1D A 6 1 6 0 2 -T C -M T( 2 ) O t h e rV e n d o r sJ P C F H

52、5 0 E = 5 0 P I N S , V e n d o r : Proconn27. Memory Stick Connector(1) Foxconn MSC10P_SI=PN: WJ20A13-S1-TR Pin Qty MSC10P_SIT=PN:WJ20A13-S1T-TR R: REVERSE TYPE(2)Other VendorsJPMSC10R=Vendor: Proconnm,Pin Qty:10，R: Reverse type Pin Qty The first letter of theVendor name R: REVERSE TYPE28. SM + XD(

53、1) FoxconnPNP:Push-push typePN(2)Other Vendors JPTIN044_X0= Vendor: Proconn, PN: TIN044_X0Other VendorsPN29. DVI RECEPTICAL CONNDVI30P i n Q t y30. SD Card ConnectorSDC9=WK22903-S3 Pin Qty31. SSFDC CONNSSFDC22 32. PCMCIA PC MEMORY CARD CONN(1) Foxconn Pin Qty Pitch Code(2)Other Vendors JAPCMCIA68E=V

54、endor: AVX ，Pitch: 0.635mm, 68Pins Pin Qty Other Vendors Pitch Code33.SD REVERSE TYPE(1)Foxconn PN(2)Other Vendorsex : JPSDR009=Proconn, PN: SDR009Other VendorsPN 34.Serial ATA DIP (1) Foxconn: SATA+Pin Qty SATA7 SATA22=SATA22(2)Other Vendors JMSATA+Pin Qty SMD(1) Foxconn: SATAS+Pin Qty+Pitch Code(2)Other Vendors: J+Other Vendors+SATAS+Pin Qty+Pitch Code JMSATAS22J= Vendor: Molex,22PinsPitch CodeSOIC Width Code TYPE=Connecter Pin Order Form Pin Qty ：CE20D50HVGAF ：CE20D50H110 =VGAF 二. Other Vendors: