电路板制作流程

PCBProcessIntroduction(TentingProcess)PCBPRESENTATIONPCBPRESENTATIONPCBPRESENTATIONPCBManufacturingProcessFlowPCBManufacturingProcessFlowPCBManufacturingProcessFlowApril,20,1999JOHNNYHSU0徐振連JOHNNYHSU流程圖PCBMfg.FLOWCHARTUPDATED:1999,04,16顧客(CUSTOMER)工程製前(FRONT-ENDDEP.)裁板(LAMINATESHEAR)內層乾膜(INNERLAYERIMAGE)預疊板及疊板(LAY-UP)通孔電鍍(P.T.H.)液態防焊(LIQUIDS/M)外觀檢查(VISUALINSPECTION)成型(FINALSHAPING)業務(SALESDEPARTMENT)生產管理(P&MCONTROL)蝕銅(I/LETCHING)鑽孔(PTHDRILLING)壓合(LAMINATION)外層乾膜(OUTERLAYERIMAGE)二次銅及錫鉛電鍍(PATTERNPLATING)蝕銅(O/LETCHING)檢查(INSPECTION)

噴錫(HOTAIRLEVELING)電測(ELECTRICALTEST)出貨前檢查(OQC)包裝出貨(PACKING&SHIPPING)曝光(EXPOSURE)壓膜(LAMINATION)前處理(PRELIMINARYTREATMENT)顯影(DEVELOPIG)

蝕銅(ETCHING)去膜(STRIPPING)黑化處理(BLACKOXIDE)

烘烤(BAKING)預疊板及疊板(LAY-UP)壓合(LAMINATION)後處理(POSTTREATMENT)

曝光(EXPOSURE)壓膜(LAMINATION)二次銅電鍍(PATTERNPLATING)錫鉛電鍍(T/LPLATING)去膜(STRIPPING)蝕銅(ETCHING)剝錫鉛(T/LSTRIPPING)

塗佈印刷(S/MCOATING)預乾燥(PRE-CURE)

曝光(EXPOSURE)顯影(DEVELOPING)後烘烤(POSTCURE)多層板內層流程(INNERLAYERPRODUCT)MLB全板電鍍(PANELPLATING)銅面防氧化處理(OSP(EntekCu106A)外層製作(OUTER-LAYER)TENTINGPROCESS鍍金手指(G/FPLATING)鍍化學鎳金(E-lessNi/Au)ForO.S.P.選擇性鍍鎳鍍金(SELECTIVEGOLD)印文字(SCREENLEGEND)

網版製作(STENCIL)圖面(DRAWING)工作底片(WORKINGA/W)製作規範(RUNCARD)程式帶(PROGRAM)鑽孔,成型機(D.N.C.)

底片(MASTERA/W)磁片,磁帶(DISK,M/T)藍圖(DRAWING)資料傳送(MODEM,FTP)

AOI檢查(AOIINSPECTION)除膠渣(DESMER)

通孔電鍍(E-LESSCU)DOUBLESIDE前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)全面鍍鎳金(S/GPLATING)雷射鑽孔(LASERABLATION)BlindedVia顯影(DEVELOPIG)

1顧客CUSTOMER裁板LAMINATESHEAR業務SALESDEP.生產管理P&MCONTROLMASTERA/W底片

DISK,M/T磁片磁帶藍圖DRAWING資料傳送MODEM,FTP網版製作STENCIL

DRAWING圖面RUNCARD製作規範PROGRAM程式帶鑽孔,成型機D.N.C.工程製前FRONT-ENDDEP.工作底片WORKINGA/W(1)Front-endProcess(Tooling)2(2)多層板內層製作流程曝光EXPOSURE壓膜LAMINATION前處理PRELIMINARYTREATMENT去膜STRIPPING蝕銅ETCHING顯影DEVELOPING黑化處理BLACKOXIDE烘烤BAKINGLAY-UP預疊板及疊板後處理

POSTTREATMENT壓合LAMINATION內層乾膜INNERLAYERIMAGE預疊板及疊板LAY-UP蝕銅I/LETCHING鑽孔DRILLING壓合LAMINATION多層板內層流程

INNERLAYERPRODUCTMLBAOI檢查AOIINSPECTION裁板LAMINATESHEARDOUBLESIDE雷射鑽孔LASERABLATIONBlindedVia裁板初裁破靶捞边3通孔電鍍P.T.H.鑽孔DRILLING外層乾膜OUTERLAYERIMAGE二次銅及錫鉛電鍍PATTERNPLATING檢查

INSPECTION前處理PRELIMINARYTREATMENT二次銅電鍍PATTERNPLATING蝕銅

ETCHING全板電鍍PANELPLATING外層製作OUTER-LAYERO/LETCHING蝕銅TENTINGPROCESSDESMER除膠渣E-LESSCU通孔電鍍

前處理PRELIMINARYTREATMENT剝錫鉛T/LSTRIPPING去膜STRIPPING壓膜LAMINATION錫鉛電鍍T/LPLATING曝光EXPOSURE(3)OuterLayerProcessFlow顯影DEVELOPING4液態防焊LIQUIDS/M外觀檢查VISUALINSPECTION成型FINALSHAPING檢查

INSPECTION電測ELECTRICALTEST出貨前檢查OQC包裝出貨PACKING&SHIPPING塗佈印刷S/MCOATING前處理PRELIMINARY

TREATMENT曝光EXPOSUREDEVELOPING顯影POSTCURE後烘烤預乾燥PRE-CURE噴錫HOTAIRLEVELING銅面防氧化處理OSP(EntekCu106A)HOTAIRLEVELING

G/FPLATING鍍金手指鍍化學鎳金E-lessNi/AuForO.S.P.印文字SCREENLEGEND選擇性鍍鎳鍍金SELECTIVEGOLD(4)SurfaceFinished&FinalInspection全面鍍鎳金GOLDPLATING5TypicalPCBManufacturingProcess

1.（基板）THINCORE2.（压膜）DryFilmResistCoatEtchPhotoresist(D/F)LaminateCopperFoil6TypicalPCBManufacturingProcess4.（显影）Develop3.（曝光）ExposeA/W(PhotoTools)7大家有疑问的，可以询问和交流可以互相讨论下，但要小声点8TypicalPCBManufacturingProcess

5.（蚀刻）Etch6.（剥膜）StripResist9TypicalPCBManufacturingProcess7.（叠合）Lay-up8.（压合）LaminationLAYER2LAYER3LAYER4LAYER5LAYER1LAYER610TypicalPCBManufacturingProcess9.（钻孔）Drilling(Primary)10.（PTH&镀铜）PTH&CopperDeposition11TypicalPCBManufacturingProcess11.（外层压膜）DryFilmLamination(Outerlayer)12.（曝光）Expose12TypicalPCBManufacturingProcess13.（显影）Develop14.（镀二铜）PatternPlating13TypicalPCBManufacturingProcess15.（镀锡铅）TinPlating16.（剥膜）FilmStripping14TypicalPCBManufacturingProcess15.（蚀刻）Etch16.（剥锡铅）TinStripping15TypicalPCBManufacturingProcess18.（表面处理）SurfaceFinished(ElectrolessNi/Au,HAL……)17.（防焊）SolderMask(SprayCoating)16Lay-upStructure...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZCaulPlateCaulPlate10-12BookingHotPressHotPressCOPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZCaulPlateCaulPlate171.下料裁板LaminateShear(PanelSize)

COPPERFOILEpoxyGlassPhotoResist2.內層板壓乾膜DryFilmResistCoat(InnerLayers)

183.曝光Expose

4.曝光後AfterExpose

ArtworkArtworkPhotoResistUVLight195.內層板顯影Develop

PhotoResist6.酸性蝕刻Power/Ground/Signal(Etch)

PhotoResist208.黑化OxideTreatment

7.去乾膜StripResist