标准解读
《GB/T 44334-2024 埋层硅外延片》这一国家标准规定了埋层硅外延片的分类、技术要求、试验方法、检验规则、标志、包装、运输和贮存要求。它是针对半导体行业中使用的埋层硅外延片制定的质量控制和技术规范。
标准内容概览:
-
范围:明确了该标准适用的埋层硅外延片类型及其在集成电路制造中的应用领域。
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规范性引用文件:列出了实施该标准时需要参考的其他相关国家标准或国际标准文献。
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术语和定义:对埋层硅外延片相关的专业术语进行了明确界定,确保行业内交流的一致性和准确性。
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分类:根据外延层的材料特性、厚度、掺杂类型及浓度等将埋层硅外延片进行分类。
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技术要求:
- 材料与结构:规定了基片材质、外延层的晶体质量、厚度均匀性及表面平整度等要求。
- 电学性能:包括电阻率、载流子浓度及分布等指标的限定值。
- 微观结构:对外延层的位错密度、晶粒尺寸等有具体要求。
- 杂质控制:限制了特定杂质元素的含量,以保证半导体器件的性能稳定。
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试验方法:详细说明了如何通过各种物理、化学及电学测试来验证外延片是否满足上述技术要求,如X射线衍射分析(XRD)、扫描电子显微镜(SEM)、四探针法测量电阻率等。
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检验规则:规定了产品检验的程序、抽样方法、合格判定准则以及不合格品的处理流程。
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标志、包装、运输和贮存:为确保产品在流通和储存过程中的品质不受影响,制定了相应的标识要求、包装材料与方式、运输条件及贮存环境标准。
该标准旨在统一和提升埋层硅外延片的生产与应用水平,为制造商、用户及检测机构提供共同遵循的技术依据,保障集成电路产品的可靠性和一致性。
如需获取更多详尽信息,请直接参考下方经官方授权发布的权威标准文档。
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- 2024-08-23 颁布
- 2025-03-01 实施
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文档简介
ICS
29.045
CCS
H82
中华人民共和国国家标准
GB/T44334—2024
埋层硅外延片
Siliconepitaxialwaferswithburiedlayers
2024-08-23发布2025-03-01实施
国家市场监督管理总局发布
国家标准化管理委员会
GB/T44334—2024
目次
前言
·····································································································
Ⅲ
1
范围
··································································································
1
2
规范性引用文件
······················································································
1
3
术语和定义
···························································································
1
4
产品分类
······························································································
2
5
技术要求
······························································································
2
5.1
衬底材料
·························································································
2
5.2
外延层
···························································································
2
5.3
几何参数
·························································································
4
5.4
表面金属
·························································································
4
5.5
表面质量
·························································································
4
5.6
边缘
······························································································
5
5.7
其他
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5
6
试验方法
······························································································
5
7
检验规则
······························································································
6
7.1
检查与验收
······················································································
6
7.2
组批
······························································································
6
7.3
检验项目
·························································································
6
7.4
取样
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6
7.5
检验结果的判定
·················································································
6
8
标志、包装、运输、贮存和随行文件
································································
7
8.1
标志和包装
······················································································
7
8.2
运输和贮存
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8
8.3
随行文件
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8
9
订货单内容
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8
Ⅰ
GB/T44334—2024
前言
本文件按照GB/T1.1—2020《标准化工作导则第1部分:标准化文件的结构和起草规则》的规
定起草。
请注意本文件的某些内容可能涉及专利。本文件的发布机构不承担识别专利的责任。
本文件由全国半导体设备和材料标准化技术委员会(SAC/TC203)与全国半导体设备和材料标准
化技术委员会材料分技术委员会(SAC/TC203/SC2)共同提出并归口。
本文件起草单位:南京国盛电子有限公司、西安龙威半导体有限公司、上海晶盟硅材料有限公司、
浙江金瑞泓科技股份有限公司、中环领先半导体材料有限公司、浙江丽水中欣晶圆半导体科技有限公
司、南京盛鑫半导体材料有限公司、有色金属技术经济研究院有限责任公司、河北普兴电子科技股份有
限公司、盖泽华矽半导体科技(上海)有限公司、赛晶亚太半导体科技(浙江)有限公司。
本文件主要起草人:仇光寅、王银海、谢进、骆红、贺东江、马林宝、顾广安、李慎重、李春阳、
徐西昌、徐新华、袁夫通、刘小青、米姣、周益初、张强。
Ⅲ
GB/T44334—2024
埋层硅外延片
1范围
本文件规定了埋层硅外延片的产品分类、技术要求、试验方法、检验规则及标志、包装、运输、贮
存、随行文件和订货单内容。
本文件适用于具有埋层结构的硅外延片的生产制造、测试分析和质量评价,产品主要用于制作集成
电路芯片和半导体分立器件。
2规范性引用文件
下列文件中的内容通过文中的规范性引用而构成本文件必不可少的条款。其中,注日期的引用文
件,仅该日期对应的版本适用于本文件;不注日期的引用文件,其最新版本(包括所有的修改单)适用
于本文件。
GB/T1550非本征半导体材料导电类型测试方法
GB/T2828.1—2012计数抽样检验程序第1部分:按接收质量限(AQL)检索的逐批检验抽样
计划
GB/T6617硅片电阻率测定扩展电阻探针法
GB/T6624硅抛光片表面质量目测检验方法
GB/T12964硅单晶抛光片
GB/T13389掺硼掺磷掺砷硅单晶电阻率与掺杂剂浓度换算规程
GB/T14139硅外延片
GB/T14141硅外延层、扩散层和离子注入层薄层电阻的测定直排四探针法
GB/T14142硅外延层晶体完整性检验方法腐蚀法
GB/T14146硅外延层载流子浓度的测试电容﹘电压法
GB/T14264半导体材料术语
GB/T14847重掺杂衬底上轻掺杂硅外延层厚度的红外反射测量方法
GB/T19921硅抛光片表面颗粒测试方法
GB/T24578硅片表面金属沾污的全反射X光荧光光谱测试方法
GB/T29507硅片平整度、厚度及总厚度变化测试自动非接触扫描法
GB/T32280硅片翘曲度和弯曲度的测试自动非接触扫描法
GB/T35310200mm硅外延片
GB/T39145硅片表面金属元素含量的测定电感耦合等离子体质谱法
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