单晶炉系统规范说明-学术单位课件

臺灣本土半導體設備發展過程與未來蕭恩信董事長東昇應材經濟與產業之關係與趨勢科技新創途徑-育成中心資金來源與取得科技創業之建議產業發展，經濟成長經濟成長與創業活動之關係新創事業既有產業產業升級轉型新興技術導向、高附加價值之中小企業不斷出現生存困難結束營業外移補充另起爐灶經濟發展正循環我國產業發展趨勢產業升級發展年代資源驅動投資驅動(資本)創新驅動(知識)台灣現階段科技創業產業升級趨動力歷程

產業升級刻不容緩，藉由發展服務業，

再創「台灣奇蹟」－微笑曲線的再闡釋附加價值因應知識經濟的發展在產業價值鏈中自我定位產業微笑曲線圖附加價值高替代性低創新研發中心

全球運籌管理中心發展知識密集服務業製造組裝物流、品牌、商流、行銷創新、市調、研發、設計產業價值鏈協助傳統產業轉型高附加價值產品製造中心政府核定政策年份93年90年88年新創企業尋求技術協助傳統企業轉型大學/研究機構創新育成中心學研機構Spin-off企業創新與再造-市場模式政府單位策略聯盟育成資源育成中心內外部資源整合校內專家實驗室研究室育成中心設備育成人才育成中心之選定概念活絡新創事業育成資源政府資金融通新創事業之資金取得問題新創事業前景不明，難以取得創投青睞供給面缺乏資源整合，無法將創新成果轉化為高品質投資案需求面缺乏組織與整合創業天使，提高新事業的投資效率創投媒合機制欠缺區域性佈區考量，無法協助解決風險資金，有區域分佈不均的問題創業投資資金來源特質型態出資者投資對象個人創業投資家富有之個人風險性事業大公司屬創業投資部門大型企業相關事業或高科技事業小型企業投資公司自有資本/政府貸款新興中小企業高科技共同基金保險基金/退休基金新興科技企業投資銀行銀行/金融機構新興中小型科技公司知識型科技創業社會之建議鼓勵學術界投入本土創業管理之研究，鼓勵知識推廣跨領域人才之培訓建構成功創業資料庫，交流分享創業觀點檢視經營規模發現核心價值利用知識力與創造力成為競爭優勢強化產業供應鏈角色台灣的實例說明

SemiconductorEquipmentandPartsLocalizationinTaiwan

TedHsiaoTaiwanSemiconductorIndustryInfrastructureTaiwanITIndustryStrategyTaiwan’sSemiconductorIndustryClusterTaiwanFoundryServiceTaiwanSemiconductorEquipmentIndustryEquipmentIndustryClusters&LaborSupportMajorSectorsofTaiwanEquipmentIndustry

-DevelopmentHistory-Equipment-KeyComponentsHeadingintothe21stCentury–TaiwanITIndustryStrategy–Two-trillion&Two-starIndustriesTwo-trillion+Two-starIndustriesinTaiwanThenewphilosophyofTaiwan’sindustrialdevelopmentofthenewmillenniumwillbebasedupontechnologydevelopmentandresearch.Two-trillionIndustries-

StartingfromourexistingstrengthandrootsintheICanddisplays,wewilldevelopglobalmanufacturingandR&Dcentersaroundtheseareas.Two-starIndustries–

Ontheotherhand,Taiwanhasdevelopedgreatenvironmentfortechnologyinnovation&societalapplicationenvironment.Thisiskeytodevelopthedigitalcontent&bio-technologyindustries.TaiwanITIndustryStrategyUniqueDisintegratedInfrastructureinTaiwanSource:ITISProject,IEK,ITRI,March2002Crystal

GrowingWaferSlicingDesign

LeadframeTestingPackagingManufactureMaskWaferChemicalsEDASIPMaterialsEquipment/InstrumentsCapital/HumanResourcesService&SupportShippingCustomsScience-basedIndustrialParks

180

4

154536

8

4

19

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15Taiwan’sSemiconductorIndustryClusterTaiwanFoundryService

LowCostHighYieldShortCycleTimeLargeCapacityFlexibleCustomerServiceTaiwanFoundryServiceGlobalCustomerBaseContinuestoExpandLongtermrelationshipwithfablesscompaniesMoreDRAMfoundryordersfromJapanIDMsexpandoutsourcingMoreWaferCapabilityForecastedMore12”waferfabstobebuiltCurrentEquipmentIndustryClusters&LaborSupportMajorSectorsofTaiwanEquipmentIndustryDevelopmentHistoryEquipmentKeyComponentsTaiwanSemiconductorEquipmentIndustryLocalProductionofSemiconductorEquipment(NTD$Bil.)

2.8%3%4.6%6%LocalizationFrontendwaferprocess19%Parts&components43%Backend23%Year2000Opto-electronicequipment15%R+D&ProductionofEquipmentinTaiwanEquipmentDemand(Unit:NTD$billion)＊R+DbyICfoundriesarenotincluded.TaiwanUSAEquipmentMarket1,5003,000EquipmentProductionFrontend20TL:906,000Backend20Parts&Components50R+DFundingGovernment10TL:30600Industry20Production/Market6%200%R+DFunding/Production-10%R+DFunding/Market2%-IndustryClusters&IndustrialParks晶研科技﹑和立聯合﹑慶康﹑台科半導體﹑台灣應材﹑科林﹑科磊﹑漢民﹑亞泰﹑崇越元利盛﹑中科院台灣飛利浦﹑公準精密﹑長興化工﹑鈦昇﹑錄海台灣應用材料﹑和立聯合華東半導體﹑鈦昇﹑盟立﹑弘塑﹑拓技﹑嵩展﹑崇越﹑誠遠﹑恩德﹑聚昌﹑力智FrontendBackend/Others群錄﹑鉅基﹑楊鐵﹑優力特﹑上銀﹑科強﹑台灣暹勁﹑漢翔﹑台翔﹑台灣精銳均豪﹑榮眾科技LocalLaborMarket

HighlyeducatedworkforceinTaiwan-Plentyofhighlytrainedtechnicalpersonnelavailableformanufacturingpurposes.-Designengineersareabound,butneedtobetrainedtohandledifferentmanufacturingprocessesinmakingsemiconductorprocessequipment.-Manycollegeortradeschoolgraduateworkforceavailable.-AvailabilityofR+Dpersonnel,engineers,andtechniciansOn-the-jobtraining

-Specialpost-schoolvocationaltrainingprograms

-Cost-sharingSupports

-Specifictraining/educationalprojectsbetweengovernmentandprivateinstitutions

-Technicaleducationprovidedbyuniversity-industryallianceMulti-chamberclusterSPUTTER、ECREtcher、CMPTFT-LCDvacuumequipmentdry&wetcleaneq.WaferreclaimprocessLPCVD、ETCH、asher、UVpassivationAuto.waferclean&Particleremovaleq.、Eq.SEMIS2certificateGlasssubstratepolishingeq.High-kmaterialCVDNewwafermaterials&ingots、RTP,highprecisioningotwiresaw、ionimplantercomponents、newprocesseq.Wirebonder，ICdieattach、automold、leadcutter、laserengraving、loader/unloader。ICdieattachSMTSMTChipMounterAutomoldLaserengravingeq.Dicingeq.Wafer&BGAsubstratecuttermicroBGAFlipchip、CSP、WLPeq.、SOCpackagingNewdevicepackageeq.:3Dpackage、MEMS/NanodevicepackageSemiconductoreq.Componentsupplychainqualification：quartz、MFC、coating&treatment、mirrorpolisheq.Moduleassy、partscleaning&modification、valve&fittingMfgqual-precisionmetalmachining、quartz、ceramic、anodizing、EPSemiconductorgradeEPgas-linesVacuumchambercomponentDrypump&turbopump、Filter、MFC、temp、pressuremeasurementgageLinearmotor、atm&vacuumrobotEq.foundryElectronicpanelgaspanelRFGenerator/MatchNewcomponentdevelopment-TFT-LCDproductioneq.interfaceLargewafersizeeq.mfg-SPUTTER、PECVDⅢ-Ⅴcompoundsemiconductorprocesseq.SMTchipmounter、probecard&testeq.、prober、opticalsubstratetesteq.、testprobe&sorter、visioninspection、testloader/unloader、BGAsubstratetestSMIFpod、SMIFPodCleaner、AMHS、factoryproductionmonitoringsystem、APCsoftware、wafertransport、PDMPackagingEquipmentSub-assemblyKeyComponentTFT-LCD&Opto-electr.ICEquipmentTestEquipmentAutomationEquipmentFrontendEquipment2000200220061996DevelopmentHistory–Semicon.EquipmentWaferdicingWaferreclaimcleanThinfilmcoaterPhotolithoetchDiffusionashingMeasurement&test晶圓切斷設備線切斷機

內周刃切斷機晶圓表面研磨設備雙面研磨機單面研磨機清洗設備清洗設備乾燥裝置薄膜設備

CVD.PVD氧化設備磊晶設備光阻塗佈設備光阻塗佈機烘烤爐微影設備步進機

EB描畫機顯影機蝕刻設備乾式蝕刻機濕式蝕刻機離子摻雜設備離子植入機回火設備擴散爐光阻剝離設備光阻去除機晶圓測試設備晶圓測試機repeat拓技科技(wetbench)弘塑(wetbench)等二十家晶研科技(CVD)和立聯合(PVD)倍強(e-gunevap)聚昌(e-gun)亞泰金屬(CMP)台科(UVpassivation)東台精機、中科院(CMP)台科半導體(PRromover)上宜雷射(Excimerlaserasher)鑫測科技(logictester)群立積體電路(mix-signaltester)聯測(ICTester)等數家廠商晶研科技

(plasmaetch)慶康(etch)中科院(plasmaeq.)clustertool+ECRFactoryAutomation鐠德、外商三家、機械所(SMIF)群錄(wafertransport)健昇自動化(eq.electroniccontrol)上尚科技(materialtrackingsystem)盟立(cleanroomtransport)KeyComponents科強精密(MFC)科程科技、東元電機(Chiller,dry&turbopump)慶康科技(E-Chuck)公準、昂承等(metalmachining:WaferLift)崇越石英、圓益石英等數家(quartz)大甲永和、榮科科技(ultracleangas-line)榮眾科技、華航、公準(anodize、EP、coating)機械所(MFC、drypump)資料來源：工研院機械所ITIS計畫Frontend

SemiconductorProcessEquipment金敏科技昇陽半導體(waferreclaim&grianding)和立聯合

DNSKaijoTELAMTNovellusTELTELCanonNikonTELAMTLAMTELAMTEatonVarianPSCMattsonKEMKLAAdvantestTeradyneEquipmentGlobalSupplierTaiwanSupplierProcess均豪基丞高工鉅基鈦昇錄海資料來源：工研院機械所ITIS計畫Dic-ingDieBondBakeWireBondMold-ingPlat-ingEngravingTrimFormTest切割機半自動切割全自動切割黏晶機黏晶機LOC黏晶機LED黏晶機烘烤機傳統烤箱SnapCureOven銲線機金線銲線機鋁線銲線機封膠機傳統封膠設備自動封膠機(AutoMolding)電鍍設備掛架式AutoPlating蓋印機油墨蓋印雷射蓋印剪切/成型剪切機成型機測試設備O/S測試外觀檢測DiscoK&S東京精密SEIKO精機ESECNEC機械ASMAlphasemK&SToshiba日立東京電子ESECASMPacificFICOLAMDAK&S新川ESECKaijoASMTOWAAPICYAMADAFICOASA第一精工ESECASMPacificLite-OnFUJITSUPASCONKOTAKI富士機工MARKEMLUMONICS東芝NECNEC機械FICOLAMDABIDServiceFujitsuASMASM-FICOHan-MiPASCONTOWAInterconKRASSANTECFICOMICROVISIONVISIONENGINEERINGNAVITAR優力特力智斯利康華東(機械所)冠西華東科技(機械所)新美化(手動)京華超音波(半自動)基丞均豪鉅基均豪基丞盛技鈦昇格瑞乘遠東捷(機械所)鑫測柏格彥亞志聖友大BackendSemiconductorProcessEquipmentEquipmentGlobalSupplierTaiwanSupplierProcessCompoundSemiconductorProcessEquipmentDicingSawProcessGrindingCleanThinFilmPRCoatingLithoEtchDiffu-sionAshingInspec-tionTaiwanSupplier韋僑科技同上同上晶研科技(CVD)和立聯合(PVD)慶康(PVD)倍強(e-gunevap)亞泰金屬(CMP)台科(UVpassivation)台中精機(光學鍍膜)晶研科技/Novellus

(電漿蝕刻機)慶康(蝕刻機)台科半導體/PSC(光阻清洗設備)致茂科技(邏輯測試機)等數家廠商和立聯合

(擴散爐)志聖(LCD光阻塗佈)GlobalSupplierOxfordInstrumentAixtronetc.MarketisFilledMostlybyUsedEquipmentOxfordInstrumentAixtronetc.Automation鐠德、外商三家、機械所 SMIF群錄 WaferTransportSystems,AMHS,AGV健昇自動化 Equipmentcontrolmodules上尚科技 Materialsupplyandtrackingsystems&Equipmentcontrol盟立 AGV,transportationsystemsMaincomponents上銀科技 X-ytables,ballscrews,linearguide&linearmotors科強精密 MFC科程科技、東元電機 Chiller、drypump、turbopump、equipmentpowermodule慶康科技 E-Chuck公準、昂承等 specialtymetalmachining&vacuumcomponents崇越石英、圓益石英等數家 quartz&ceramic大甲永和、榮科科技 gasline&gaspanel榮眾科技、華航、公準 anodizing、electropolish、specialtycoatingAutomation&Componentsvisionsystems,alignmentsystems,opticallenses,pinprobes,displays&monitors,industrialcomputer,wireandharness,electricswitchboards,PCBtowers,pneumaticcomponents,structures,watermanifold,piping,MFC,etc.

Takeintoconsideration:GoodKnowledge,BetterCost,GoodLocation,andHighQualityLaborManufacturability(SAP/ERP)andReliabilityMachiningofmetalliccomponentsofallsizesisnoproblem,someoftheworld'sbestCNCmachinecentresareMIT.BasedintheTaichungarea,butmanycompaniesspreadouttheislandMachininglargesizeisnoproblem:machinecentreaslargeas5~50m.Posttreatmentisalsoavailable(suchascoating).Anodizationisavailable(smallerthan3meters).Servicesavailable:EP&largeceramiccomponents.Travelwithin3~5hoursdrivingdistanceInfrastructure:SuppliersofComponentsISOqualified-ISO9000,9001,9002,or14001qualified.PeopleareveryfamiliarwiththeISOqualifiedconcept.ManysmallermanufacturersinHsin-Chu&Taipeihaveexcellentknowledgeaboutultra-cleanlinessrequirement.Thesizesofcompaniesrangesquiteabit,anywherefroma5personoperationtoseveralhundredpersonnelcompaniesManyhaveexperienceworkingwithinternationalcustomersInfrastructure:SuppliersofComponentsSummary

WorldwidesystemsuppliersarepresentinTaiwaneitherastradeagentsorbranchoffices.MajorcomponentsuppliersarepresentinTaiwaneitherasdistributors,tradeagents,branchoffices,andsomelocalmanufacturing.TaiwanlocalcomponentsuppliersaregraduallyshifttoOEMsourcingpartnersandbecomingqualifiedsuppliers.WiththedrivingforceofTwo-TrillionandTwo-Stars,thelocalizationofequipmentcomponentsspeedup.

Two-trillion+Two-starIndustriesThenewphilosophyofTaiwan’sindustrialdevelopmentofthenewmillenniumwillbebasedupontechnologydevelopmentandresearch.Two-trillionIndustries-

StartingfromourexistingstrengthandrootsintheICanddisplays,wewilldevel