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Processors:Automotiveelectronicsystemsalesareforecasttorisebyacompoundannualgrowthrate(CAGR)of5.4%from2016through2021,whichisthehighestamongsixmajorend-usesystemcategories,accordingtoICInsights.Theautomotivesegmentisexpectedtoaccountforanestimated9.1%oftheUSD1.49Ttotalworldwideelectronicsystemsmarketin2017,aslightincreasefrom8.9%in2015,and9.0%in2016.据ICInsights,从 率(CAGR)上升为5.4%,是六大主要终端用户系统类别中最高的。预计2017 电子系统销售额的9.8%。(ICInsights,press,Laoyaoba)

Processor:mhasannouncedthatitsBoardofDirectorsunanimouslyrejectedtheunsolicitedproposalannouncedbyon6Nov2017.(thelargestmanufacturerofWi-Fichipsfor devices)hasproposedmwithadealtobuythe foratotalofUSD100B.高通宣布,公司董事会已了博通公司11月6日主动博通提议以每股70的现金加方式收购高通,总价值为1300。(AndroidAuthority,m,AndroidCentral,CNFoundry:IQEhassuccessfullyraisedGBP95Mbywayofa cing.ThecingwillallowIQEtoexpanditscapitalexpenditureprograminitsfoundry,withthepurchaseofupto40-60newMOCVDmachinesoverthenext3~5years.Thisshouldenablethefirmtoaddressmultiplemass-marketopportunities,includingitsleadingpositionintheproductionofVCSELwafersforusein3Dsensingconsumerelectronicapplications.IQE筹集了9500万英镑,这笔将会用于支持发展世界上第一个化合物半导体集群。该公司的技术被认为可以为版的中的新型3D传感器提供动力。的3D传感器需要用到所谓的VSCEL晶圆,而IQE拥有这种晶圆80%的市场份额。(,XCNNewsLaoyaobaProactiveInvestors,MotleyProcessor:mhasannouncedthatviaitsmVenturesinvestingincompanies,including:AIstartupSenseTime,bikeMobike,wirelessconnectivity terminaldevelopmentofAIsolution rautonomoussupermarketoperator“LingHaoElement”,combingVR/ARtechnologycontent r“QiHuanTechnology”,“full anits)S科技、结合AI和VR/AR技术的内容提供商奇幻科技、“全沉浸式”英语Beta,Caijing,JRJ,Reuters)

Processor:TheAndroidcampcouldfollowthestepsofAppletotemporarilysuspendroyaltypaymentstomaimingtotheUS-basedchipvendorsbacktothenegotiatingtabletoworkout“fairer”royaltyschemes,accordingtoDigitimes.With’ssmartphoneshipmentsreachingabout150MunitsayearandwithanASPofUSD300,Hauwei’sroyaltypaymentscouldaccountfor5%~10%ofm’sannualroyaltye. 5%~10%。(Laoyaoba,SeekingAlpha,

Processor:Tohelpdevicemanufacturersmeetagrowingdemandforlong-lastinglow-powerNarrowBand(NB)IoTmodules,Gemaltoand viaitssemiconductorarm,HiSilicon–areworkingtogethertodevelopthenextgenerationofmodulesthatcombineanextralevelofsecurityandconsumeverylowpower.与,通过其半导体分公经久耐用的低功耗窄带(NB物联网模块日益增长的需求。该款NBIoTProcessor:Therevenuerankingfor3Q17remainedgenerallythesameasthepreviousquarter,with,mandNVIDIArespectivelytakingfirst,secondandthird ceaccordingtoTrend .AlthoughMediaTek’s3Q17revenueandgrossmarginsareclosetotheupperboundoffinancialforecast,theyear-on-yearrevenuedroppedby18.8%,makingittheonlyoneinthelistthathadmorethan18%revenuedeclinefortwoconsecutive ,press,Trend

Processor:In introducestheIn XMM8000series,itsfamilyof5GNewRadio(5GNR)multimodecommercialmodemsandsaidithassuccessfullycompletedafullend-to-end5Gcallbasedonitsearly5Gsilicon,theIn Modem.Itoperatesinbothsub-6GHzandmillimeterwaveglobalspectrum英特尔推出了英特尔XMM8000系列,其5G新型无线(5GNR)多模调制解调器系列,并表示已经成功完成了基于其早期5G(英特尔5G调制)(VentureBeat,FierceWireless,BusinessWire, XMM7660isnewflagshipfor4G,whichisthefirstCat.19, XMM7660isnewflagshipfor4G,whichisthefirstCat.19,1.6GbpsLTEmodem,andgoingtobelaunchedin英特尔XMM7660是4G基带中的新MIMO、CA载波聚合以及非常广Beta,PCMag, ,Hotworkona5Gmodemfora .Ifthereportisaccurate,may yunseatm’sdominanceinsupplyingApplesince有消息称在5G的项目上,苹果的工程师已经和英特尔团队展开了初期的开发合作,不过5G版本的开发到了何种进度,目前尚不得而知。 ,163,TechNode,Tencent)

Processor:m, andZTEcombinedtheir5Gexpertiseanddemonstratedwhat’sbeingdescribedastheworld’sfirstend-to-end5GNewRadio(NR)InteroperabilityDataTesting(IoDT)systemwithadataconnectionbasedon3GPPRelease高通子公司高通技术((5GNR)系统互通(IoDT)。互通演 ,(VentureBeat,Android,aggressivelypersuadingsmartphonevendorstoadoptitsHelioPprocessorstoreducerisksofheavyrelianceonm,whoseoperationsmightbeaffectedby’stakeoverbid,accordingtoDigitimes.BrandvendorsdedicatedtosmartphonesmodelspricedunderUSD600couldseedwindlingtechnicalsupportfrommfor chipsolutions.波攻势,积极大陆智能品 在争取大 press,KKNews,

nningandsalesdirectorLiYanjiindicatesthatin2018the willslowdownHelioXseriesflagshipSoCmarketdevelopment,andacceleratethepushofHelioPmid-to-highSoC.Atthesametime willalsopushmid-to-entrySoC,mainlyfocusingonMT6739SoC.X系列旗舰级市场节奏,加速推出曦力P系列中高阶, 级,主推MT6739平台。(Laoyaoba,

andformerCEOof yfoundrySemiconductorManufacturingInternational(SMIC),hasorchestratedtheestablishmentofanewfoundryhousein thatwillrunasacommuneIDM(CIDM).NamedSienICManufacturing(SIMC),thefirstY6.8B(USD1B)willbepouredintotheestablishmentinthefirstphase. 制造(CIDM)工厂,投

Processor:Appleisexpectedintroduceitsnext theA11X,whichwillarrivewithits2018seriesofiPadProat1Q/2Q18,accordingtoDigitimes.TheSoCchipwillbethefirstproductbuiltusingTSMC’s7nmprocesstechnologyalongwiththefoundry’sbackendintegratedfan-out(InFO)WLPtechnology.1Q/2Q18,开始在台积电以7纳米扇型晶圆级封装(InFOWLP),预期 程规划,7纳米制程已经于4Q17正Modem:KGI ystchiKuobelievesthatApple’swilladoptIn XMM7560andmSnapdragonX20modems,whichsupport4×4MIMOtechnologywithfasterLTEtransferspeed.Hesuggeststhat70%~80% swithimprovedbasebandchipswillcomefromIn andwillpowerthe2018 .Healsoanticipatesthenew willsupportdual-SIMdual-standby凯 将会采用英特尔

Foundry:Priceofsiliconwafer,whichisoneofrawmaterialsforsemiconductor,shotupby20%comparedtoitspricefrom2016andthisiscausingamountof stonotbeabletokeepupwithincreased光刻机的知名厂商荷兰艾司摩爾(ASML)预计2017年收入将增长25%,主要 SUMCO和韩国SKSiltron都计划 Sina,CNBeta,XCNNews,ET硅晶圆厂商计划2018年涨价20%,2019年继Priceofsiliconwafershotupby公 供应紧张,预计在2017年会有正面的业绩,例如年销量将达到8.93。公司也从150毫米晶圆退出,扩展器300毫米晶圆的7560和高通骁龙X20(mem)支44I现更快的T传输速度。他为英特尔将会为苹果供应所需频 总量78甚至 。年 将会支持双卡双待(ual-SIMualsany,DSS),只使用一套就可同时使用两张SIM卡。(CNJoltJournal,

Itisfacinglackof s,itisexpectingpositiveperformancein2017suchasmakingUSD893M(KRW1T)inannualsalesagainin2017.Ithasalsowithdrawnfrom150mmwaferbusinessandiscurrentlyextendingitsfacilitiesfor300mm4Q17m4Q1%。全球目前生产5万片,0年的需求量为每月年,将1万片。Ithasrecentlyannouncedforecastofitsperformancefor4Q17andthatpriceof300mmwaferwillbeatleast20%higherthanthatfrom4Q16.Thenumberofglobaldemandsforsiliconwafersforproducing300mmsemiconductorsiscurrently5.6Munitspermonth,andthedemandsin2020willbe6.6Munitspermonth.Itis nningtoincreasemonthlyoutputof300mmsiliconwafersby110,000unitsin2019. ystofKGISecuritiesMing-ChiKuorevealsthatApplehasa tolaunchin2H18.Thishandsetwouldpresumablyserveas XPlus”.AppleisalsoworkingonanewLCDmodelwitha6.1” ytargetthelow-endandmid-rangesmartphonemarkets.

FullDis y:Samsungisallegedlyworkingonasub-5”fulldis smartphone,yetitisnotsureifthe willlaunchsuchproduct.

布此 。

Panel:AsAR/VRhead-mounteddis y(HMD)requiresaveryneardistancetotheeyesights,theidealdis yresolutionshouldbearound2,000ppi,whichthecurrentLCD,OLEDdis potentiallyabletoachievesuchtarget.Thus,MicroLEDhasabiglikelinesstoetheoptimalsolutionforAR/VRHMDdis 但MicroLED却有机会达成这个目标。因此,MicroLED将很有机会成为AR/VR头戴式装置所选用的显示技术。(MEMLaoyaoba) y:Anumberofsmartphonevendors, OPPO,andSamsungare yingcatch-uponthedevelopmentoffoldablesmartphonesafterZTEdebuteditsfirstfoldablemodelrecently,accordingtoDigitimes.据Digitimes,包括中国、韩国在内的大批厂商,目前正在开发折叠手机,其中包括了、OPPO以及韩国的三星电子、LG电子等。(Digitimes,pressLaoyaoba)越来越多智 厂商开发可折 foldable发布了一款折叠双 AxonM。这 拥有两个5.2英寸的 屏幕

goingtolaunch2new AMOLEDdis y,whichisbelievedgoingtodrivethetouchpanelrGeneralInterfaceSolution(GIS)shipment.Withtheboundinggettingmorecomplicated,theshipmentunitpriceisgoingtorevenuesofGISin2018.

y(LGD)hasdownitsGumiP4 ntthatproducesliquid-crystaldis (LCDs).ThiscameafterLGDis ViceChairmanHanSang-beomannouncedinJul2017tocloseitsP2,P3andP4linesinGumibytheendofthisyear.LGDis betsonorganiclight-emittingdiode(OLED)dis ys,isacceleratingthephase-outofLCD.中苹

另外折叠之后可以提供一个6.75英寸的大屏幕Announcedinmid-Oct2017itsfoldabledual-screenAxonM,featuringFHD ythatcanbeunfoldedintoawide6.75”diagonalviewing Currently adual-screensmartphoneandisexpectedtounveilmodelbeforeyear-endOO司前经请一专,折屏折叠 有关系。ReportedlyhasappliedforrelatedpatentsforthemanufactureofscreenstobeusedintheupperpartofLG显示器公司目前也在开发折叠屏幕,可能 苹果进行了合作,该司可能计划在2020年之前推出可 的成熟产品ProbablyincollaborationwithLG y(LGD) foldable productaimingtomaterializeandcommercializethefoldabledis productsbefore2020.

(AMOLED)屏幕,不仅会带动业成(GeneralInterfaceSolution,GIS)等年获利。(UDN,Laoyaoba)

LG显示(LGDisyLGD)最近关闭了位于龟尾市(Gumi的5代线P4工 (BusinessKorea,MyDrivers)FlexibleDis y:Withflexibleactive-matrixorganiclight-emittingdiode(AMOLED)panelfabsbuildingataquickerpacethanglobaldemand,supplycapacityofflexibleAMOLEDpanelsisforecasttobe44%higherthanglobaldemandin2018,accordingtoIHSMarkit.ThenetareacapacityofflexibleAMOLEDpanelsisexpectedtoreach4.4Mm2in2018,up100%from2017.However,demandforflexibleAMOLEDpanelsisincreasingslowerrs’expectation,at69.9%to2.4Mm2inIHSMarkit 2018年可挠式AMOLED面板的产能将比全球面积需求高出44%。IHSMarkit 的预期 Times,Laoyaoba,

Touch:PMOLEDpanelmakerWiseChipSemiconductorwillshowcaseits1.36”and1.8”flexiblein-cellPMOLEDtouchpanels.TheflexiblePMOLEDpanelscomewithathicknessof0.3mmandacurvatureradiusofbelow30mmandareidealforproductionof 式有机发光显示器(PMOLED) 上。(Digitimes,press,51Touch)

Panel:TCLGroupannouncesthatitintendstoinvestinChenjiangStreet,ZhongkaiDistrict,HuizhouCitytoconstructamoduleproductionlinethatintegrate nextgenerationmoduleproject, 17.55亿元。(CNBeta,Sina,JRJ) forNTD31.4B(USD1.041B),amovewhichwillrampupitsglobalLTPSpanelmarketshareto8%fromthecurrent2%.WhileInnoluxis uptheproductionof18:9all-screendis ysandthesupplyofa-Sipanelsisingtightduringthepeakseason,the thendecidedtoexpanditscapacitythroughtheacquisitionofthe6GLTPS RobertHsiao. 南部芦竹的6代LTPSLCD工厂,总金额达314亿新台币(约合10.41亿 RobertHsiao表示,群创正在提高 进而决定通过收购6代LTPS工厂来扩张产能。(Digitimes,press,PJTime)

sizedapplications.TocommercializeMicroLED,inadditiontothedifficultieswithmid-to-smallsizedapplications,itscostsisnotcompetitivewithcurrentproducts.Perunitinchsize,itscostisrelativelyhigherthanOLED.MicroLEDhasmorepotentialonthelarge-sizedapplications.苹果在MicroLED的策略布局动见观瞻,传出缩编团队的消息也 论,从苹果的动作也不难看出MicroLED 中小尺寸的难度相当高。MicroLED的 OLED的单价比目前MicroLED的单价相对低廉。MicroLED在大尺寸领域的 。(LEDInside,Laoyaoba)G3.5productioncapacityof50,000~60,000substratesa

G6LTPSlinehasacapacityof25,000substrates.

Y/

y:Visionox

’sITRI(or

Camera:Appleisworkingonanewstyleoflenseswhichwillbe

specificallyitsElectronic

takingextrawideangleshots. hasfiledapatent

as

wantstostart

infraredimaginglenses.Thepatentnotesthat“near-infrared(NIR)curvedpanels,thenmovetofoldableandfinallytostretchable 卷曲的显示屏。(OLED-Info,JRJ,CE

LaboratoriesorEOSRL)aimtoestablishapilotlineforMicro-LED ysthatwillstartproductionin 3Q18.EOSRLrevealsthatthepilotlineisalreadyabletohandle2500(50×50)chipspertransfer,andbythetimeitisreadyitwillbeabletohandle100,000chips(100×100).研拟建立一条MicroLED试产线,最 50×50(2,500颗),提升至100×100Info,LEDInside,LED

devicescapturelightinthewavelength800nm~1300nmrange.NIRimagingdeviceshavealsoattractedincreasinginterestforapplicationinvarious ,suchaspattern-baseddepthmap 苹果最近在申请的一项拍摄角度更大的广角镜头相机的技术专利。这项专利描述,近红外成像(nearinfraredNIR设备能够捕捉到波长在800纳技术的,例如基于图案的深度映射。(PatentlyAppleIBTimesCNImageSensor:Sonyannouncesthreenewmediumformatsensors.Thesearetheworld’sfirstBackIlluminatedsensorsandthefirsttoalsoshoot4Kand8K .TheIMX461sensorwillbeusedonthefutureHasslebladXandFujiGFX1亿像素、支持30fps4K 录制;IMX411:1.5亿像素、支持30fps4K 制、18fps8K 录制;IMX461:1亿像素、支持30fps4K 录制、18fps 录制。消息称索尼的这三款传感器将于2018年正式进入市场。(My

CameraModule:TosolvetheproblemofApple XcameramoduleandFaceIDmodulebindingproblem,themanufacturehasmovedfromJapanSharptoShenzhenfactoryofGeneralInterfaceSolution(GIS).Thankstotheextraorderforits2cameramoduleproductionlines,GIS’1Q18revenuescouldbequitesatisfying.业成(GeneralInterfaceSolution,GIS)解决苹果 X的相机模组与FaceID

CAMERA/

andMicron

ImageSensor:hasfiledalawsuitagainstSmar sforpatentinfringementon10Nov2017.ThisisthesecondtimeOmniVisionhasfiledlawsuitin since17Oct2017.ImageSensor:hasfiledalawsuitagainstSmar sforpatentinfringementon10Nov2017.ThisisthesecondtimeOmniVisionhasfiledlawsuitin since17Oct2017.The hasrequired stostopinfringementitschipsetrelatedpatentsaswellastopayforthecompensation.知 日 )对于江苏 发明专利 行赔偿。(Laoyaoba,EEWorld,EET)经理NavinShenoy宣布,基于3D 在2H18推出。3DXPoint SSD产品,包括OptaneSSDDCP4800X、OptaneSSD900P以及用盘。(CNBeta,AnandTech,Seeking

Building60(B60)attheIMFlashfacilitiesinLehi,Utah.Theexpandedfabwillproduce3DXPointmemorymedia,abuildingblockofIn Optanememoryfor recentlyannouncedIn SSD900PSeriesandnewcapacitiesandformfactorsoftheIn SSDDCP4800XSeries.英特尔和美光科技宣布,IMFlash于2006年的IMFlash合资企业 NAND。IMFlash自2015年起开始生产3DXPoint。(Laoyaoba,BitTech, ,Guru

modulesthatdoublethecapacityofferedbyexistingNVDIMMs,combiningDDR4DRAMwithNANDflashmemorytosupportpersistentmemoryusagemodels.新一代则翻番为32GB。(CNBeta,DRAM:RevenueoftheentireglobalDRAMindustryclimbedtoanewhistorichighfor3Q17,reportsTrend .ContractpricesofvariousDRAMproductsjumpedbyabout5%onaveragein3Q17from2Q17onthebackoftheyear-endbusyseasonandlimitedbitsupplygrowth.Asthemarketstillexperiencedtightsupply,totalDRAMrevenuefor3Q17roseby16.2%from 上季再成长16.2%,整体产业仍处于供货吃紧的状态。(Trend ,press,

NAND:ICInsights’latestforecastnowshowssemiconductorindustrycapitalspendingclimbing35%thisyeartoUSD90.8B.AfterspendingUSD11.3Binsemiconductorcapexin2016,Samsungannouncedthatits2017outlaysforthesemiconductorgroupareexpectedtomorethandoubletoUSD26B:USD14Bfor3DNANDflash,USD7BforDRAM,andUSD5BforfoundryandICInsights预估, 年资本支出将倍增至 型闪存(NANDFlash), ,ICInsights 取内存(DRAM)制程技术,并弥补因制程转换造成的产能损失。(ICNOR:Ea onthSMICprovidesGigaDevicewithaproductioncapacityof25,000chips,increasingthescopeofFlash.Theresultwillbea

全球编码 器NorFlash短缺,引来供应链关GlobalNORFlashisinshortage,causingattentionfromsupply (SMIC)支持,将提供兆易创新每月2.5万片,占全球NorFlash约30%increaseinproductioncapacityfromthecurrentestimatedmonthlyproductioncapacityof88,000chips.陆NorFlash生产大厂兆易创新(Gigadevice)抢进Nor (SMIC)支持, Times,

兆易创新

EachmonthSMICprovidesGigaDevicewithproductioncapacityof25,000chips,increasingthescopeof ’sNORFlash.Theresultwillbea30%increaseinproductioncapacityfromthecurrentestimatedmonthlyproductioncapacityof88,000chips.预定年底,月产能提升千片至482万到ORlsh。Expectsbyendof2017,themonthlyproductionincreasefrom4000pcsto48,000pcs,andin2018thenumberwillincreasefrom52,000pcsto53,000pcs.ThisistoincreasetheproductionforNOR自2H17开始,借由12寸厂新制程来生产高容量产品以提升产能Since2H17,byusingthenewproductionfrofab,theproductioncapacityhas以每月1万片产能全力配合自家NorFlash产品。Tousemonthly10,000productionforownNORFlashproduct.MEMORYDRAM:PartofnewproductionofDRAMwillbeavailablein2019.It

3DSensor:Appleisreportedly

arear-facing3Dsensorforain2H18thecostuptrendwillcease,andmighthavecostdownpressure.AccordingtoGartner,Samsung,SKHynix,JHICC,HefeiRuiliincreasingtheirproductioncapacitycausingsomeuncertaintiesinthefuture.In2018DRAMproductiongrowthis11.8%,butitislowerthan67.8%in2018.By2019,newproductionincreases,andwillfallintocostbattle,andannualproductionvaluewilldown25.9%,andwillbehaving2yearsofbattle. FlashMarket)

thatwouldjointhefront-facingTrueDepthsystemthat withthe X.Companiesmanufacturingtime-of-flight(ToF)sensors ,Sony,STMicroelectronicsandPanasonic.Thetestingofthetechnologyisstillinearlystagesanditcouldendupnotbeingusedinthefinalversionofthephone.苹果正在为在2019年研发一款后置3D传感器系统,这是将变成 导体公司和松下公司。(AppleInsider,Bloomberg,Le 传感Breath:TheTechnion-IsraelInstituteofTechnologyistheteambehindtheNa-Nose,whichisdesignedtodetectupto17diseases.Each ismadeupofanumberof pounds,uniquetous.Theymaybedependentupongender,age,raceandahostofotherbiologicalfactors.TheNa-Nose’sdeveloper thatitcansmelldiseasesincludingsomeformsofcancer,multiplesclerosis,andParkinson’s.Sofar,ithasproventobe86percentaccurateatdetectingdiseases. 86%。(CNBeta,CNN,DailyMail)

3DSensor:AfterEpistarenteringVCSELmarket,Lextarwillprovidefacialrecognitionpackagingmodule,whichwillbeginship 2H18.Lextarexpectstherevenuewillexceedmini-LED.Lextarindicatesthat3Dsensinghas2approaches,InfraredLEDandVCSEL,andVCSELismoreaccurate.LextarhasbegunworkingwithCMOSmodulevendors.LEDsolutionisalreadyavailable,VCSELwillbefocusin2018.年的发展重点。(UDNLEDInside)

3DSensor:ORBBECisfoundedinShenzhenin2013.In2015,thelaunchedits3DCurrentlyORBBECistheglobal4ththatcanmassproducecommercialized3Dsensor,after andIn ORBBEC’s3Dstructuredlightcameracanrecognize10functionsincludinghumanfaceandhumanbonestructure. 头Astra、Astramini等产品量 别 3DSensor:Accordingto

3DSensor:MizuhoAndroidsmartphonevendors ,OPPOandXiaomiareexpectedtoequip3Dsensingfunctionalitytotheirnewmodelsslatedforlaunchin2018,which

越来越多的 厂商已经着手为新 装备3D传感器元Androidsmartphonevendorsareexpectedtoequip3Dsensingfunctionalitytotheirmodelsslatedforlaunchin

ystAbheyLambasaidtheXrampremainsXproductionestimatesmovelowerbyaround8Munitsfor2017onthebackofslower- LarganPrecision,SunnyOptical,ORBBECandHimax asthemajorbeneficiaries.

大立

得订单Itcurrentlyhasadvantagesintermsoftechnology,patent,capacityanddesign,andhassolutionsfor3Dsensingreceiversandtransmitterlensmodules,isexpectedtoobtainsteadyordersfromexisting 一起合作的3D传感方案已经被OPPO、小米验证,将在2018年为公司

particular,the3D-sensingmoduleremainsthebottleneckfortheX,withyieldimprovingonOLEDpanels,Lambacommented.援引

高通、奇美、来营收 信利

Himax,

The3Dsensingtotalsolutionsjointlydevelopedbym,Himax

他驻 装备传感元件大舜宇光电、 中和技等公也了应BetaDigitimespress 舜

TrulyOpto-electronicshavebeenverifiedbyOPPOandXiaomi,andwillbegincontributingrevenuesandprofitsforrelatedfirmsin其3D结构光传感方案相信将在3Q18进入量产

供应链进行田野后发现,2017年苹果X产量大概会比之前

Sunny

Itsstructure-light3Dsensingsolutionreportedlywillbegin

productionin重点发展3D传感器,算法,控制 和结构光 机,并对年中国智 品牌的下单表示乐观Itisfocusingondevelo 3Dsensors,algorithms,controllerchipsandstructure-light3Dcameras,andisoptimisticaboutlandingordersfrom’ssmartphonebrandsin

生物辨识

of

Sweat:ResearchconductedbyscientistsfromtheUniversityofWenxiongbelievesthat

seessmart

suggeststhatbymonitoringuser’sownsweatyskinsecretions,aaminoacidprofilecanbebuiltthat yand

anewformofsecuritythat recognitionwillco-existin2018.Currentlytoachieve3Dfacialrecognition,itisstillchallengingforAndroidvendors.Theywillcontinue

onto“incorporatefeaturessuchasafacialandimagerecognition”.InventeccurrentlyisApple’sAirPodsandHomePod.

ychangetheauthenticationprocessforelectronicdevices.Usingsweatasanidentifiercannotbeeasilymimickedorhackedbypotentialintruders.Itiscloseto“full-proof”.touse2Dandanti-spoofing

Pu, ystatYuanta

handlefacialrecognition.Heissurethatopticalunder-dis fingerprinttechnologyisreadytoentermassproductionin2Q/3Q18. 要达到会相当 ,将会采用技进识辅以初阶的伪防止 针对这种合术目前

Consulting,saidApplecouldrolloutHomePodswith3D-sensingcamerasin2019. DavidHo表示,公司在是AirPods和HomePod两款产品 JeffPu预测苹果可能会在2019年推 品。(CNBeta,TheVerge,Apple

。他们正在开发全新的安全认证体系,成熟将彻底改变电子设备的认证过程。使用汗水作为认证不容易被潜在的者模仿或者被入侵。(CNBetaMashableTNW,Wiley)生物辨SENSORYFace:Buoyed

nstobuild

人脸识别市场规模将达数10

3DSensor:ams,aandsomeforeigninvestorsarepouringmoneyintostart-uptechnologyfirmsthatspecializeinfacialrecognitionsoftware.AccordingtoestimatesfromIHSMarkit, theequipmentand software-wasaUSD6.4Bmarketinin2016,with176Msurveillancecamerasalreadyinstalledbythe privatecompanies. 民间市场规模可能高达数10亿。根据IHSMarkit的估计,2016年包含设备及管理软件在内的中国影像监视系统市场规模达64亿,或民间

商汤科Megvii深依

Facialrecognitionmarketsizewillgrowtomorethan (AI)研究的公司。有40个地方 技术。目前大陆几乎所有的主要智能 SenseTime,whichlistsvarious departmentsacross s,hasjoined swithitsbacker ’sCDHInvestmentstoraiseaboutUSD450Mtoinvestinotherfirmsworkingonartificialinligence月稍早宣布近日正式完成.6亿C轮融资,由中国国有资本风险投资基金领投。阿里巴巴(BABA-US)支付宝的“刷脸支付功能就是以旷视科技的技术为基础。IthasraisedUSD460Minitslatestcapitalraising,includinginmoney ’snationalventurecapital 资本(SequoiaCapital)投资。Sequoia-backed thathasdevelopedaninsurveillancecamerathatcancapturefacesasfarawayas获得了硅谷 司之 资本(SequoiaCapital)投资。依2017年5月从包 中国等多位投资人筹得了3.8 Listsmorethanadozenprovincialor

rofhigh-performancesensorsolutions,andNingboSunnyOpotech,asubsidiaryofSunnyOptical,aleadingmanufacturerofintegratedopticaldevicesandopticalimagingsystemsolutionprovider,announcedacollaborationtojointlydevelopandmarket3Dsensingcamerasolutions deviceandautomotiveapplicationstoOEMsin therestoftheworld.斯半导体(ams)宣布与宁波舜宇光 与元件,共同为3D传感应用研发

departmentsacross asmajor investorsinMay,includingSequoia

BusinessMaterials:EnoughProjectha amined20oftheworld’slargestcompaniesintermsofmarketcapitalization.Mineralsupplychainsexaminedincludetin,tungsten,tantalum,andgold.Appleemergedasthe“clearleader”scoring114outofapossible120points.Followingthetop5, ,In ,and ,theremainingelectroniccompaniestakeaprecipitousdropinrankings,withPanasonicscoring42.5—andtheanchorofthechartsbeingToshibaat Rankings)”中获得这一称号,其坐在了第一的位置。排 公司还有Alphabet/谷歌、惠普、微软、英特尔。(AppleInsider,EnoughProject,report,CNBeta)

HeatPipes:DespitetherecentmarketrumorsindicatingthatSamsungmaystopusingheatpipesforitsnewsmartphonesin2018,sourcesfromupstreamsupplychain yers,citedbyDigitimes,havepointedoutthatSamsungwillcontinuethethermaldesignandits rshavealreadybegunsmallvolumeproductionof GalaxyS9之外,Note9也将使用这种散热 。(Digitimes,press,My Zaker,My热管和真空腔均热板散热Heatpipesandvapor三星在2018年仍将为旗下高端智能机延续热管散热的方式,并投放订热Heat

Samsungwillcontinuethethermaldesignandits rshavealreadybegunsmallvolumeproductionofrelatedcomponents. Smartphonebrandvendorsarealsotryingoutvaporchambersforheatdissipation,buthavesofarnotyet cedanyorders.Thereisahighchanceforsmartphonebrandstoadoptvaporchambersin2019. basedChaun-ChoungTechnology(CCI)andAuras,andJapan-basedFurukawa,havealreadydeliveredsamplesto sfortesting.CONNECTIVITYVALUE5G:SoftBankandHondaareteamingupforajointresearchprogramthatwilllookathow5Gcanbeusedtoimproveconnectedcartechnology.SoftBanksaidthatitwillinstall“experimental”5GbasestationsatHondaR&D’sTakasuProvingGround,aprivatetest-drivingcourseinnorthernJapan,withtheduokickingoffthe5G-poweredjointresearchventureinApr2018.车连接技术。软银表示,将在须试验场安装“试验性”5G 究项目。(VentureBeat,Softbank)

5G:EEhasdemonstrateditsfirstfully-functioningend-to-end5Gnetworktest.Duringthetest,EEmanagedtoachievedownloadspeedsof2.8Gbps.EEhaspartneredupwith foritstest.BT/EE携手在伦敦测试5G上下站同覆盖部署。(EEKitGuru,

ODM:AppleWatchSeries3thankstoitslongbatterylifeandonlinecapabilityhaswonitspopularitywith50%YoYgrowthintermsofsales.ThishelpsQuantaComputer,theODM,achieveitsfinancialgrowth.TheJan~Oct2017consolidatedrevenueshavereachedNTD839.93B,a20.6%YoY苹果新款AppleWatchSeries3因续航力增强以及可独立联网,广获市场青 年前月合并营收达新台币,399.30亿元,年增20.6%;其收新高。(Laoyaoba,UDN)palhassuccessfullyobtainedmoreordersfromApple—onlyincreasingitsiPadpalhassuccessfullyobtainedmoreordersfromApple—onlyincreasingitsiPadmanufactureshareforApple,andalsoenteringAppleWatch’ssupply palalsohasreceivedmoreordersforFossilsmartwtch,withitsshipmentin2017willincreaseto1.2Munits.ODM:CompalElectronicshasreporteditsthird-revenuesreachedNTD231.61B(USD7.63B),up8%sequentiallyand10%year,whilenetprofitscametoNTD2.32B,up815%sequentiallyand7% RayChenpointedoutthatthenotebookmarketwillseeflatshipmentperformancein2018,butthe willcontinue 仁宝大吃苹单加为苹果iPad主力代工厂,过往负责代工iPadMini,但2017年初已跨入主流机9.7吋iPad。2017年平板出货量却有望年增三成,主要成长因素来自“大客户”的

enjoyingrising 视呆帐影响,降至36.52亿元,年减34%。仁宝预期,4Q17PC出货量将较 20%。(Digitimes,press,UDN,UDN)

MainlyApple’siPadmanufacturer,andusedtomanufactureiPadmini.Butin2017alsomanufacture9.7”iPad.Itstabletshipmentisexpectedtoincrease30%in2017,thankstoits“bigcustomer”orders.17sl、UrchlspletchletchSince2017,CompalhasdemonstrateditsmanufacturedFossil,GUCCI,LV,Prada,MichaelKorstoApple,andwinoverApple’sconfidencetoletitethe2ndODM.NowitsKunshanfactoryhasanAppleWatchassemblyline,andwillentermassproductionsoon.设设XiaomiCEOLeiJunXiaomiCEOLeiJunindicatesthatthedoesnotwanttoealuxuriousbrand,andheeventhinkstraditionalthinks“expensivemeansgood”causingconsumersmisunderstandexpensivemeansgood,whichisano-returnpath.Innovationisavitaltooltosurviveinthecompetitiveelectronicsmarket.Athattreatsinnovationandefficiencyasitscore,thecansurvive小米CEO称小米不想干成奢侈(CNBeta,Times,XiaomiViceManuKumarJainhasrevealedthatXiaomishipped9.2Msmartphonesover3Q17.小米副ManuKumarJain宣布公司在3Q17在发货了920万台智能。(AndroidHeadlines,TheU.S.InternationalTradeCommissionhasdeclaredthatithaslaunchedaninvestigationofmanyofApple’sproductsthatuseScreenApplehasreportedlyagreetogivelimitedhelptothenernmenttodevelopananti-spamapplicationforitsiOStform,afterrefusingtodosobasedonprivacyconcerns. 政府 spam)应用,之前苹果曾因隐私问(TRAI)试图让其防骚扰(DoNotDisturb,DND)应用上架苹果应用商店。(AppleInsider,Reuters,CN intsfroma andits licensingsubsidiarythat cross-tformremote solutions.Thereportedlylaunchedinresponse StrategicTechnologyPartners—bothofOrange,Calif.StrategicTechnologyPartnersiswholly-ownedbyAquaConnect.(ITC)宣布 )智

Baidunumberofused

tabletsrunninganobsoleteversion

andanumberofnew’soperatingsystemcouldevenincreasegoingforward,DanLuusuggested yzingandcomparingsomedatasets,’smonthlyAndroiddistributionnumbers,aswellasthe previousrevelationsregardingthescopeofits OSliketherecent announcementthattherearemorethan2BAndroiddevicesinthewild. 数据,DanLuu创建了一系列的图表,以展示各版本Android日益增长的分化状况。根据的数据分析推断,目前约有10亿+设备2年没更新过了。(AndroidHeadlines,BGR,Danluu,OSNews,CN

notenteringtheUSwithsmartphonesatthistime.TheyareenteringanumberofotherAmericanmarkets,whereFCCcertificationisalsorequired. (AndroidAuthority,Gizmo,

productsincludingravenH.hasshowcasedanumberoftformApollo,BaiduBrain,DuerOS2.0, 工智能硬件“ravenH”等多款软硬件 大脑、DuerOS2

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