印制电路板制程介绍

印制电路板制程介绍肖家君FlowChartofPCBProcess123487651211109IQCTRIMDRILLBLACKHOLEDRYFILMLAMINATING1819201415101723222127262524EXPOSURE13DEVELOPMENTPATTERNPLATINGETCHINGINSPECTINGS/MSURFACECLEAN1’STLIQULDSCREENPRINTPRE-CURE2’STLIQULDSCREENPRINTPRE-CURES/MEXPOSURES/MDEVELOPMENTPOST-CURELEGENDPRINTCUREHAL/ENIGG/FPUNCH/NC-RV-CUTFINALCLEANCUREO/STEST/OSPHOLECOUNT2829303132FQCOQCPACKINGWARHHOUSHOUTGOINGSYMBOL□:QUANTITYINSPECTION

:QULITYINSPECTION▽:STORAGE○:WORKING▲:100%INSPECTION(1)前制程治工具制作流程顾客CUSTOMER裁板LAMINATESHEAR业务SALESDEP.生产管理P&MCONTROLMASTERA/W底片DISK,M/T磁片磁带蓝图DRAWING数据传送MODEM,FTP网版制作STENCILDRAWING图面RUNCARD制作规范PROGRAM程式带钻孔,成型机D.N.C.工程制前FRONT-ENDDEP.工作底片WORKINGA/W(2)多层板内层制作流程曝光EXPOSURE压膜LAMINATION前处理PRELIMINARYTREATMENT去膜STRIPPING蚀铜ETCHING显影DEVELOPING黑化处理BLACKOXIDE烘烤BAKINGLAY-UP及预迭板迭板后处理POSTTREATMENT压合LAMINATION内层干膜INNERLAYERIMAGE预迭板及迭板LAY-UP蚀铜I/LETCHING钻孔DRILLING压合LAMINATION多层板内层流程INNERLAYERPRODUCTMLBAOI检查AOIINSPECTION裁板LAMINATESHEARDOUBLE

SIDE雷射钻孔LASERABLATIONBlindedVia(3)外层制作流程通孔电镀P.T.H.钻孔DRILLING外层干膜OUTERLAYERIMAGE二次铜及锡铅电镀PATTERNPLATING检查INSPECTION前处理PRELIMINARYTREATMENT二次铜电镀PATTERNPLATING蚀铜ETCHING全板电镀PANELPLATING外层制作OUTER-LAYERO/LETCHING蚀铜TENTINGPROCESSDESMER除胶渣E-LESSCU通孔电镀前处理PRELIMINARYTREATMENT剥锡铅T/LSTRIPPING去膜STRIPPING压膜LAMINATION锡铅电镀T/LPLATING曝光EXPOSURE液态防焊LIQUIDS/M外观检查VISUALINSPECTION成型FINALSHAPING检查INSPECTION电测ELECTRICALTEST出货前检查OQC包装出货PACKING&SHIPPING涂布印刷S/MCOATING前处理PRELIMINARYTREATMENT曝光EXPOSUREDEVELOPING显影POSTCURE后烘烤预干燥PRE-CURE喷锡HOTAIRLEVELING铜面防氧化处理OSP(EntekCu106A)HOTAIRLEVELINGG/FPLATING镀金手指镀化学镍金E-lessNi/Au印文字SCREENLEGEND选择性镀镍镀金SELECTIVEGOLD全面镀镍金GOLDPLATING(4)外观及成型制作流程典型多层板制作流程1.内层THINCORE2.内层线路制作(压膜)典型多层板制作流程4.内层线路制作(显影)3.内层线路制作(曝光)典型多层板制作流程5.内层线路制作(蚀刻)6.内层线路制作(去膜)典型多层板制作流程7.迭板8.压合LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6典型多层板制作流程9.钻孔10.黑孔典型多层板制作流程11.外层线路压膜12.外层线路曝光典型多层板制作流程13.外层线路制作(显影)14.镀二次铜及锡铅典型多层板制作流程15.去干膜16.蚀铜(碱性蚀刻液)典型多层板制作流程17.剥锡铅18.防焊(绿漆)制作典型多层板制作流程15.浸金(喷锡……)制作干膜制作流程基板壓膜壓膜後曝光顯影蝕銅去膜典型之多层板迭板及压合结构...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ迭合用之钢板迭合用之钢板10-12层迭合压合机之热板压合机之热板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ迭合用之钢板迭合用之钢板1.下料裁板(PanelSize) COPPERFOILEpoxyGlassPhotoResist2.内层板压干膜(光阻剂) 3.曝光 4.曝光后 Artwork(底片)Artwork(底片)PhotoResist光源5.内层板显此影PhotoResist6.酸性蚀业刻(Po就wer亲/Gr帐oun痰d或Sig歼nal终)PhotoResist8.黑化(Ox龙ide拾Co勇ati卸ng)7.去干膜(St衫rip违Resi清st)9.迭板Laye豆r1Lay蚀er赴2Laye驼r3Lay束er舟4Cop赖per蛋Fo乡丰ilCop紧per饼Fo让ilInne屯rLa捷yerPrep岸reg(胶片)Prep寄reg(胶片)10.压合(La篮min弯ati皮on)11.钻孔(P.T榴.H.或盲孔Via)读(Dr膜ill访&De佩burr远)墊木板鋁板12.镀通孔掉附着碳时粉13.外层压膜(干膜Tent准ing)PhotoResist14.外层曝够光(pat巨tern俭pla语ting滩)15.曝光后(pa艰tte垦rn裁pla阻tin卵g)16.外层显影17.线路镀铜映及锡铅18.去篮膜19.蚀铜(碱性蚀刻)20.剥锡铅21.喷涂(液状绿漆)22.23.绿漆显扇影光源S/M再A/W24.印预文字25.喷锡(浸金……)R105WWEI94V-0R105WWEI94V-0光分解反婶应(正性工茂作)→底片,STE瞧NCIL坦(网版)光聚合原反应(负性工作)→底片,ST兼ENC拳IL(网版)BURI剂EDV隙IAL携AY-U腾PA=朋TH姨ROU留GH配VIA抬HO介LE讯(导通孔)B=块BURI盘EDV和IAH参OLE尤(埋孔)C=余BL牙IND损VI亲AH规OLE状(盲孔)D=量BLIN耀DHO妻LEM股LBV狂IA(愤多层盲孔赌)BLIN下DVI道ALA计Y-UPBLIN事DVI值ASE鞋QUEN哑TIAL获LAY滋-UPABBACCARESI洋NB-S屋TAG勤EBLIN绳DAN着DBU番RIED衬VIA济OPT粗ION等(盲埋唤孔的选择碗)D6–Spin由dle秋Dri回llin魂gMac串hin回e数控（镭海射）钻孔政机Blac鼻kHo锅leLine黑孔线Des茧mea玻r除胶渣DryFilmLaminator自动贴膜机AutomaticExposureMachine自动曝光机Patt孙ern睁Plat让ingLin蠢e电镀磨菊刷机Etch脂ingLin俗e蚀刻褪膜服线AutomaticS/MPrintingLine自动丝印绿油印刷线AutomaticExposureMachine线路曝光机PostCureLine二次硬化线AutomaticLegendPrintingLine自动丝印印刷线Sol洽der言Le樱vel界ingMach桌ine喷锡机O/STest纽奉er检测谢谢！锡膏简钟介1.何谓锡膏RosinOrganicAcidSolvent含铅锡根膏无铅锡膏锡粉助焊剂松香or树脂活性剂溶剂200范0倍370萄0倍混合搅拌谢谢！谢谢观看/欢迎下载BY庭FAI理TH每IM皆EA