铝基板技术参数

铝基板技术参数产品简介産品簡介産品類型

PRODUCTSINTRODUCTION型号 特性簡要描述Class Type Features鋁基、銅箔、FR4玻纖布，Tg130-170CAL-M-01 Aluminumsubstrdteandcopperfoil,FR4fiberglassTg130-170C鋁基、銅箔、無玻纖3.0w/n..k.。AL-H-02 Aluminumsubstrateandcopperfoil,

(Laird),鋁基覆銅闆GM-AL系列AluminumSubstrateCopperCladLaminateGM-ALSeriies

no-fiberglass,thermalconductivity(Laird)3.0w/m..k鋁基、銅箔、無玻纖 (NRK),熱傳導率2.0w/n..k.。AL-H-03 Aluminumsubstrateandcopperfoil,no-fiberglass,thermalconductivity(NRK)2.0w/m..k鋁基、銅箔、無玻纖

，350C10min、4.2AL-H-04Aluminumsubstrateandcopperfoil,no-fiberglass,enduring10minat350C,dielectricconstant4.2鋁基、銅箔、無玻纖 (Bergquist)熱傳導率2.0w/n..k.。AL-H-05Aluminum,coperfoil,no-fiberglass(Bergquist)thermalconductivity2.0w/m..kGM-CU系CU-M-01覆厚銅箔 〔4oz 10oz〕闆，列大電流。SpecialSeriesCopperCladLaminateGM-CU

大功率電路。Thickcoppercladlaminate(40z 100z),super-current.Super-powercircuit.用途：特點： LED照明電路良好得散熱性優良的尺寸穩定性良好的機械加工性電磁波的屏蔽性

厚膜混合集成電路電源電路固态繼電器優良的性價比 Features: Applications:Excellentthermalconductivity.ExcellentdimensionalstabilityExcllentmachinability.Excellentelectromagneticshielding.Highcostperformanee性能指标PERFORMANCE性能指标PERFORMANCE典型值項目實驗條件單位AL-H-AH-H-AL-H-AL-H-ItenTestconditionUnitsAL-M-01熱傳導率ThermalConductivityA1.51.00.91.31.5剝離強度熱應力後PeelStrengthAfterthermalN/mmstress288C熱應力不分層、不起泡ThermalNo-delimitation,StressNo-blistering外表電阻SurfaceC-96/35/90M?Resistance E-24/125體積電阻率VolumeC-96/35/90M?Resistance E-24/125

LEDlighting.Thickfilmhybridintegratedcircuits.Solidrelay02345AW/m.k<1.0322.521.51.00.91.31.5S150S150S120S10min150SStrength燃燒性AKV/mm3030303030UL94—v-0v-0v-0v-0v-0FlameabilityTgA°C130-170105130130130吸水率MoisturD-24/23$0.10.030.030.030.03AbsorptionCT1IEC6012V200250600600600電氣強度Electrical根本构造電氣強度ElectricalI1Stbstratfe)導電層--由銅箔組成絕緣層--分爲有玻纖和無玻纖兩種金屬基層--鋁闆、銅闆等CircuitLayer--Copperfoil1STRUCTURE層材料1STRUCTURE層材料SizeLayerMaterialHoz18um18〃x16〃x1導電層2ozoz3570umumCircuit3oz100umLayer4oz137um6oz206um10oz343um絕緣層絕緣層DielscLayer50um、75um、100um、125um、150um、0.8mm1.0mm金屬基層MetalSubstrate1.5mm2.0mm3.0mm6.0mm探如有特别要求，可定制。Specialdemandmaybeordered.化学成分鋁合金的化學成分鋁合金的化學成分ALUMINUMALLOYCHEMICALCOMPOSITION其他兀素AlOther合金SiFeCuMnMgCrZnTi總計Alloy 單個TotaUnitlSi+Fe0.050.0.0.00.1餘量11000.950.2051055Leavings2.0.餘量0.2150.0.400.10102.0.35100.050.15Leavings50520.250.150.80.80.04餘量0.40.0.0.00.1Leavings6061 0.70.80.4151.25155520.35热学性能1100-H24643/65723.69042225052-H32605/65023.8900138鋁合金的熱學性能ALUMINUM鋁合金的熱學性能ALUMINUMALLOYCALORIFICSPERFORMANCE熔點範圍線膨脹系數熱導率MeltingCTE比熱容Thermal合金PointSpecifickAlloyConductivityRangeHeatCapacity(20/100CCJ/kg-k(0/100C)W/m-k)(20C)6061-T651582/65223.6896167鋁合金電學性能ALUMINUMALLOYELECTRICITYePERFORMANCE電導率電阻率合金ConductaneeResistaneAlloy%IACS(20C)uQ-m(20C)1100-H245729.25052-H3235506061-T6514340力学性能鋁合金的力學性能

ALUMINUMALLOYMECHANICSPERFORFORMANCE彈性模彈性模伸長率硬度切削力疲勞強抗拉強合金量ElongationRigidityCutting度度AlloyModuluFatiguPeels(1.6mm)HBStrengeStreng10.093211718/1710.01068211837/3110.01295301445/40OfOfElasticityKsix%thksiStrengthKsithKsi1100-H245052-H326061-T651回流焊溫度熱沖擊回流焊溫度熱沖擊(130-180-230-2名稱結構288C85C)備注/10sec)V:0.5mm/min鋁闆磨刷處-------1OZ3次起泡分2次起泡分層ITEQ1080p片理1080x1p片層〔A方法〕-----------AL陽極氧化處2次起泡分2次起泡分層理層〔B方法〕平拉紋處理5次起泡分3次起泡分層〔C方法〕層鋁闆納米及17次起泡分11次起泡分電鍍處理技層層術〔D方法〕A方法-------1OZ4次起泡分3次起泡分層NRKNRK3mil層B方法-----------AL2次起泡分2次起泡分層C方法層6次起泡分3次起泡分層D方法層16次起泡分12次起泡分層層A方法--------1OZ5次起泡分第3次起泡分層 LairdT-Preg1KA6mil層B方法-----------AL3次起泡分2次起泡分層層C方法6次起泡分4次起泡分層層D方法19次起泡分13次起泡分層層經綠标納米級處理技術處理後的鋁闆外表呈現微觀粗化，比外表比原來增加數倍。在百倍顯微鏡下觀察到鋁闆外表呈微型蜂窩狀疊合〔詳見圖片〕；熱壓合時絕緣材料中的樹脂流入微型蜂窩中，經高溫固化後緊密結合爲一體，從而增強了鋁闆與絕緣材料的結合力，避开了業界改類闆普遍存在的起泡分層問題。解決了客戶的後顧之憂，爲客戶供给了信念與報障。平面圖〔100倍〕 切 片 圖 〔 5 0 0 倍 〕制作流程：過酸性除油〔或酒精清理〕 ->水洗->水洗->風幹->考闆〔150C/20min〕->排闆/壓闆注：經納米處理後的闆材不允許擦花和再做任何的機械清刷。覆厚銅箔闆CU-M-01ThickcoppercladlaminateCU-M-01特點： 用途：良好的散熱性優良的尺寸穩定性良好的機械加工性電磁波的屏蔽性

電力電子大電流、大功率電路汽車電子大電流、大功率電路Features: Applications:ExcellentthermalconductivityExcellentdimensionalstabilityExcllentmachinabilityExcellentelectromagneticshielding

High-current,high-powercircuitsinpowerelectronics.High-current,high-powercircuitsinautomotiveelectronics.CU-H-02CopperbasecoppercladlaminateCU-H-02特點：良好得散熱性優良的尺寸穩定性良好的機械加工性電磁波的屏蔽性優良的性價比Features:Excellentelectromagneticshielding.HighcostperformaneeExcellentthermalconductivityExcellentdimeExcellentelectromagneticshielding.Highcostperformanee

用途：厚膜混合集成電路電源電路固态繼電器Applications:LEDlighting.Thickfilmhybridintegratedcircuits.PowersuppiySolidrelay性能指标性能指标性能指标F)ERFORMANC實驗條件項目單位ThermalItemUnitsCU-M-01CU-H-02Conductivity熱傳導率ThermalAW/m.k<1.03.0ConductivityA1.51.0剝離強度AfterthermalN/mmPeelStrength1.51.0stress288288C熱應力不分層、不起泡ThermalNo-delimitation,S60S150SStre