电路板PCB工程师英文EQ整理

1、1 基本信息（1） 问题：the board thickness(2.36+/-0.05mm) is too hard to control for us 对我们来说，板厚2.36+/-0.05mm太难管控 建议：Can we control the finished board thickness as 2.4+/-10%mm？Please comfirm! 请确认我们可否控制完成板厚为2.4+/-10%mm？（2） 问题：As show in figure, manufacturing requirements specification, using 17 um (1/2 oz) bas

2、ed copper, finished surface copper: 46 um (0.00181 "); it is different from what shows 1oz for stackup.如下图所示，制作说明要求使用17um基铜，完成铜厚46um.这跟叠构中的1OZ铜厚不符.建议：Use 1 oz based copper, finished surface copper: 46 um (0.00181 ") 使用1oz基铜，完成铜厚46um.（3） 问题：As show in the below figure, outer copper is 1 oz.

3、We cant make sure whether the finished surface copper is 1 oz. 如下图所示，外层铜厚为1OZ，我们不能确定完成铜厚是否为1OZ. 建议：Using Hoz base copper, finished surface 1 oz copper; 使用H oz基铜，成品铜厚为1oz.（4） 问题：The stack-up your company provided did not conform the requirements of impedance, and the inner layers need to use 3 Pre-pr

4、eg.贵司提供的叠构不符合阻抗要求，且内层需要用3张pp建议：Adjust the thickness of the Pre-preg and the core。See below. 调整芯板和PP的厚度，见下图（5） 问题：The make-up like as the attachment （12PCS/PNL），in order to save the costing ,please confirm if can accept 3 X-OUT per panel? 如附件所示拼版（12pcs/PNL），为了节约成本，请确认可否接受每个拼版内有3个打叉板？ 建议：Accepted 3 X-

5、OUT per panel,but not exceed 5% of order quantity.And pack them separately when shipping. 接受每拼版出3个打叉板，但不超过总订单数的5%，且出货时把打叉板分开包装.（6） 问题：As show in figure, Your company requirements according to level 3 standard controls, this requirement is too hard to control for us 如下图所示，贵司要求按3级标准管控，我们较难管控. 建议：Contr

6、olled by level 2 standard production. 按2级标准管控生产.（7） Please confirm the attached panel drawing.请确认附件拼版图（8） Above is our suggested stackup，please confirm. 上图为我司建议叠构，请确认.（9）问题：Your company have not provided the tolerance of board thickness，please confirm whether we could control it as 1.6mm+/-10%？贵司没有提

7、供板厚公差，请确认我司可否按1.6mm+/-10%来管控？（10）问题：We can't find the finish copper thickness and solder mask color in spec ,please provide. 我们在说明书中找不到完成铜厚和防焊颜色，请提供.建议：Finish copper thickness:1oz, SM color: matte green 完成铜厚1OZ 防焊颜色：哑光绿色（11）问题：Please see Fig1,the number in gerber is different from "HIT-20-0

8、01200-001" in spec. 请看图一，gerber中的料号跟说明书中的"HIT-20-001200-001"不相符. 建议：We will ignore this difference and follow the gerber file to produce this board. 我们将忽略这个不同点，然后按照gerber来制作. （12）问题：The customer requires use FR - 402 material, but we have not this kind of sheet material . 客户要求使用FR-402

9、板材，但我们没有这种板材. 建议：We will use our common material production，Please confirm！Like KB6160 or equivalent instead of FR-402. 我们将使用常用的板材生产，请确认.像KB6160或同等级的板材来代替FR-402. （13）问题：In order to avoid the panel board scraped in process, we would like to change the sharp corner to round angle as R1.0mm. 为了避免板子在生产过

10、程中刮花，我们将尖的角倒角为R1.0mm 的角. （14）问题：See below figure，50 Ohm impedance is controlled in the gerber, butthe e-mail indicated that had no controlled impedance;Actually, the calculation also cannot reach 50 Ohm impedance values . 见下图，gerber中要求做50ohm阻抗控制，但邮件中说明不用做阻抗控制。事实上也达不到50ohm阻抗值. 建议：Ignore the impedance

11、 control. 忽略阻抗控制. （15）问题：There is no 60mil core on our store，we will adjust the stackup as below fig. B show. 我们仓库没有60mil的芯板，我们将调整叠构，如图B所示. （16）问题：It is too hard to keep conductor widths and spacing within 15% of data for us. 要将线宽距控制在+/-15%，对我们来说太难了 建议：We suggest to relax it as +/-20% to process . 我

12、们建议放宽到+/-20% （17）问题：You do not specify the incept standard. We will follow IPC-A-600G Class2 and IPC-6012B Class2 to build this board. 贵司没有指明验收标准，我们将根据IPC2级标准来生产板子. （18）问题：It doesnt specify thickness of Ni and Au. 没有说明镍和金的厚度. 建议：We will control as : Ni: 3-6um min and Au0.05um 我们将管控为：镍最少3-6um，金0.05um

13、 （19）问题：We cant input the four files（see below fig.） by our software 用我们的软件打不开下图的4个文件. 建议：We will ignore the four files. 我们将忽略这4个文件. （20）问题：We are not sure the surface finish of this board，because the requirement of two files are different.（See below pictures.） 我们不能确定这个板的表面处理，因为2个文件的要求不同.（见下图） 建议：We

14、 will follow immersion gold to produce.( Au:0.05um(min),Ni:3-6um) 我们将按沉金制作.（金厚最少0.05um，镍厚3-6um） （21）问题：Please see below picture, the dimension between the gerber and the drawing is different. 请看下图，图纸和gerber的尺寸不一样. 建议：We will follow gerber file to produce. 我们将依gerber制作. （22）问题：We dont know the usage

15、of these file ,and we think them have nothing to do for PCB manufacture. 我们不知道这些文件的用处，我们认为他们对PCB生产没有影响. 建议：We will ignore it. 我们将忽略他们. （23）问题：We don't have the standard of the " BS EN0249-2-12:1994" in hand. 我们没有" BS EN0249-2-12:1994"的标准控制. 建议：We will ignore this standard and

16、 follow IPC-4101B standard to produce. 我们将忽略这个标准，然后按IPC-4101B标准来生产. （24）问题：In the future, for the same series, if we meet the same questions like as above, we will use the answer directly 后续问题中，如有类似以上问题，我们将直接使用这次的回复来生产.2 文字（1） 问题：Some fonts are close to pads, into holes or outside of the board outli

17、ne.一些文字太靠近pad，进孔或到了板外.建议：We will move them if possible, otherwise we'll clip them, please confirm. 如果可能，我们将文字移动，否则我们会修剪文字，请确认.（2） 问题：We will add the UL,including our logo and date code(WWYY) at free area on the top silkscreen layer. 我们将在顶层文字的空旷位置添加UL，包括我们的标记和周期.（3）问题：In order to identify the boa

18、rd easily, we would like to add our internal part number on the breakaway rails.（or near our company UL） 为了更好地区分板子，我们想要在工艺边上添加我司料号.（或在我司UL附近）（4）问题：We turn the logo to "BLDT D-B" on the bottom silkscreen or not?Please confirm. 请确认我们可否将底层文字的UL改为"BLDT D-B"？ （5）问题：You request to add

19、UL and date code（WWYY）on the appointed position , but the drawing without appointed position 。We will add our company UL and date code（WWYY） on bottom silkscreen layer as below fig. 贵司要求在指定位置添加UL和周期（WWYY），但图纸上没有标出指定的位置.我们将在底层文字添加我司UL和周期(WWYY)，见下图. （6）问题：Some White oil block are printed on the pads,

20、it will affect the solderability of the pads. 一些白油块在pad上，这会影响pad的焊接性能. 建议：We will modify the legend to avoid them exposing on the pads. 我们将修剪文字来避免他们上pad.(7) 问题：Some fonts are too close to the outline,it may cause the fonts to be incomplete after manufacturing. 一些文字太靠近外形线，这可能会导致加工后文字出现残缺. 建议： Reduce

21、the font size to accommodate the tight space if possible，otherwise accept the incomplete fonts. 如果可能的话，缩小文字到一个小空间内，否则就接受文字残缺.（8） 问题：Tthere is no enough space for adding the UL and date code on the top silkscreen layer 顶层文字不够空间添加UL.和周期建议：A：We will add them on the bottom silkscreen layer. B：We will ad

22、d them on the top soldermask layer. A：在底层文字添加 B：在顶层防焊添加（9） 问题：Some legend are not mirrored on the bottom sides. 在底层中，有一些文字没有镜像. 建议：A：we will follow geber to produce and accept the legend are inverse.B:we will mirror it.A：我们将依gerber生产，要接受反字.B：我们将镜像制作.（10） 问题：The legend is very close to dummy copper p

23、ads in the working gerber. 在工作稿中的文字太靠近焊盘. 建议：A:We will shave the dummy copper pads to avoid the illegible legend.B: Follow working gerber to build,and the illegible legend is acceptable A：我们将削铜粒来避免文字模糊. B：依工作稿制作，接受文字模糊. （11）问题：In order to avoid the silkscreen is missing, we will add the check patter

24、ns on the breakaway rail. 为了防止漏印文字，我们将在工艺边添加测试图案.3 防焊（1） 问题：Spacing between IC pads are 6.7mil and 7.5mil. We need 7.8mil to keep the solde rmask dam.Becausethe solder mask ink are blue color which is out of our capability to build the blue solder mask dam. IC之间的距离是6.7和7.5mil，我们需要7.8mil的距离来做防焊桥.因为防焊

25、颜色为蓝色，这样距离的蓝油桥超出我们的制程. 建议：We suggest canceling the solder mask dam where the IC spacing is less than 7.8mil and make gang relief. Please confirm is that acceptable. 我们建议在小于7.8mil的地方取消做防焊桥，然后按开通窗制作.请确认是否接受.（2） 问题：Spacing between the BGA PAD and via hole is only 9.8mil, and there's solder mask dam

26、. The spacing is too small to keep dam. BGA到过孔的距离只有9.8mil，而且要做防焊桥.这个距离太小，不能做桥. 建议：We will remove the via's (not the BGA pads) openings 我们将移除过孔的开窗（不是BGA的开窗）.（3） 问题：The 29mil component holes without solder mask openings on bottom sides,the solder mask ink will flow into holes 29mil的元件孔在底面没有开窗，油墨会进

27、孔. 建议：A) We add solder mask openings for hole, Make sure the oil is not on the PAD and not flow into the hole.B) We follow the GERBER to do ,Please confirm the solder mask ink will flow into holes are accepted. A：我们将为这些孔添加防焊开窗，确保油墨不上pad和油墨不进孔.B：我们根据gerber制作，请确认可接受油墨进孔. （4）问题：See below figure,there i

28、s one pad on the bottom paste layer, but it without soldermask opening on the bottom solder layer. 见下图.贴片层上有一个pad没有开窗. 建议：A：follow the gerber. B:Add soldermask opening that is 8mil bigger than the pad. A：依gerber制作. B：加一个比pad大8mil的开窗. （5） 问题：The 1.0mm holes with soldermask opening on the top solderma

29、sk layer ,but the bottom layer.Please comfirm our suggestion 1.0mm的孔在顶层有开窗，但底层没开窗。请确认我们的建议. 建议：A：Follow the gerber to process. 按gerber生产. B：Add the soldermask opening for the holes on the bottom layer，the size is the same as the top. 在底层添加开窗，大小跟顶层一样.（6） 问题：The soldermask opening of dia.0.40mm holes

30、is only 8mil bigger than the via holes. 直径0.40mm的孔防焊开窗只比过孔大8mil.建议：A：Cancel the soldermask opening of via holes，the via holes plugged with solder mask is accepted. 取消过孔的防焊开窗，接受过孔塞油. B：follow the gerber，and accept solder mask into the hole but no plugging 依gerber制作，接受油墨入孔，但不塞孔.（7） 问题：The two dia.3.2m

31、m holes are specified as PTH in drill chart .But the soldermask opening is less than the pads on bottom soldermask layers.分孔表上直径3.2mm的孔是制作为PTH，但在底层防焊层里，开窗比pad小.建议：We will follow gerber to produce，and allow the solder mask encroach onto these pads. 我们将根据GERBER生产，然后接受油墨上pad.（8） 问题：Some solder mask ope

32、ning for the fiducial mark is too big that it caused nearboring trace exposed in the working gerber. 一些光学点的开窗太大，导致工作稿中他们邻近的导线露铜. 建议：We will trim the solder mask opening to avoid the trace exposed. 我们将修改防焊开窗来避免铜线外露.（9） 问题：There is no solder mask opening on one side for the via hole 16mil. 16mil的孔有一面防

33、焊没开窗. 建议：A：Plug these via holes with solder mask ink. B：Add solder mask opening both sides for the via hole 16mil. A:塞孔制作. B：16mil的孔双面开窗.4 线路（1） 问题：Fab spec indicates controlled impedance, but doesn't indicate the trace width/gap and which layer(s). 说明书要求控制阻抗，但没有指明阻抗线是哪层和线宽距. 建议：Please provide,

34、or please confirm if we can ignore the impedance request 请提供，或请确认我们是否可以忽略这个阻抗要求（2） 问题：The fiducial marks are isolated so they can easily peel off during production. 光学点是孤立的，所有生产时容易脱落.建议：We will add the protective copper ring around them. Please confirm is that acceptable. 我们将在他们周围添加保护环。请确认可否接受. （3）

35、问题：Vias to be covered per the additional requirement. 过孔制作方式按照特别要求. 建议：there are 8mil, 10mil and 12mil holes, so we will treat all of them as "vias", plug and cover them with solder mask by removing the solder mask openings on both sides if any, and leave the other holes (24mils and greate

36、r) solder mask as design, correct? 我们把8mil, 10mil和12mil的孔定为过孔，在每一面通过去掉防焊开窗来使他们塞油，像设计那样把其他的孔（24mil或更大的）开窗制作，正确吗？（4） 问题：3 tooling holes (3.2mm NPTH) to be added on rails per the additional requirement. 按照特殊要求添加3个3.2mmNPTH在工艺边上.建议：We suggest adding tooling holes on all 4 corners of the rails to provide

37、 more flexibilities during PCB manufacturing and assembly, and add 3 fiducials (1mm round pads, 3mm solder mask openings) on 3 corners to be "fool-proof", is that acceptable? 我们建议在工艺边的4个角添加定位孔，来使更适合PCB生产和装配.在3个角上添加3个光学点（1mm大小，3mm开窗）来防呆，能接受吗？ （5） 问题：In order to facilitated in production， we

38、 will remove the no-function isolated pads on the inner layers. 为方便生产，我们将删除内层里一些无功能的孤立pad. （6）问题：Some solder mask openings are very big and exposing the surrounding copper planes. 一些防焊开窗太大，会导致铜皮外露. 建议：We will reduce the solder mask openings to our default pad opening size, and if there's still a

39、 risk of exposing the surrounding copper, we will shave the copper plane a little to avoid exposure, is that acceptable? 我们将会对不正常的防焊开窗缩小，如果仍然有铜外露的风险，我们将会削一点铜皮来避免外露，能接受吗？ （7）问题：Outer layers to be 2.1mil (1.5oz, we consider it as nominal) per provided stackup, but due to the tight spacing (5.8mil only

40、) on this design we can only use 0.5oz base copper. 所提供的叠构中，外层铜厚为2.1mil（1.5oz，我们认为这是近似值），但由于设计上紧密的线距（只有5.8mil），我们只能用0.5oz的基铜来制作. 建议：We will use 0.5oz base copper and plate to minimum 1oz copper on outer layers, is that acceptable? 我们将使用0.5oz底铜，然后外层最少电镀到1oz铜厚，这能接受吗？（8） 问题：Inner layers to be 2oz per p

41、rovided stackup, but the spacing on inner layers is tight, also we can't follow the provided stackup on the dielectric thickness under outer layers because they are too thin for 2oz copper.根据所提供的叠构，内层要做2oz，但是内层的线太密，满足外层的阻抗的条件下，我们不能使用所提供的叠构.因为在2oz的铜厚条件下，介电物质太薄了. 建议：Option A: to use 1oz copper on

42、inner layers, and we don't need to change the stackup and impedance trace widths;Option B: to use 2oz copper on inner layers, but need to change the stackup and impdance trace widths. 建议A：内层使用1oz铜厚，这样我们就不需要调整叠构和阻抗线的线宽. 建议B：内层使用2oz铜厚，但需要调整叠构和阻抗线的线宽. （9）问题：The PAD is too closed to the outline, whi

43、ch will induce the copper exposed after process. Pad太靠近外形线，会导致加工后出现铜外露的现象. 建议：Shave the copper keep to the outline 8mil to avoid the copper exposed. 削铜保持距离外形线8mil，防止铜外露. （10） 问题：See your company provide the SPC, we are not sure whether to need to increase the fiducial mark on the breakaway rail.(Bec

44、ause the breakaway rail have not fiducial mark in the GERBER)根据贵司提供的说明书，我们不确定是否需要在工艺边上添加光学点.（因为gerber中的工艺边上没有光学点）建议：A) We will add the 2.0mm fiducial mark and 3.0mm solder mask opening of fiducial marks on breakaway rails（see fig）.B） Do not need add fiducial mark on the breakaway rail,follow the ger

45、ber to do.A：我们将在工艺边上添加2.0mm的光学点，开窗3mm.（见图）B：不需要再工艺边上加光学点，按gerber制作.（11） 问题：We will add the V-cut testing pads to avoid V-cut being missed. 我们将添加V-CUT测试pad来防止漏V-CUT.（12）问题：In order to balance the plating electric current, we would like to add dummy copper foil （copper pads）on the breakaway rails. 为了平

46、衡电镀的电流，我们想要在工艺边上添加铜皮.（铜pad） （13）问题：See below figure，the copper is too close to the outline，it would cause the copper exposed. 见下图，铜皮到外形线太近，这会导致铜皮外露. 建议：A：accept exposed copper. B：shaving the copper，keep it 10mil from outline and 16mil from V-CUT line.A：接受露铜.B：削铜，使之距离外形线10mil，距离V-CUT线16mil. （14）问题：In

47、ner and outer layers in the gerber have meaningless line. Gerber的内层和外层存在无意义的线. 建议：A：follow the gerber. 依gerber制作. B：Delete the meaningless line 删除无意义的线. （15）问题：This board is a bare board without copper.we will build without fiducials. 这是一个光板，我们将不加光学点.5 金手指（1）问题：In order to plate the gold on finger.W

48、e will add the leading plating line as the below picture. 为了电金手指，我们将添加如下图的电镀线.（2） 问题：We found the area of gold finger have solder mask dam in the Gerber. 我们在gerber中发现金手指位置有阻焊桥. 建议：To aviod the solder mask dam affects the function gold finger,we will cancel it and add the full solder mask opening for

49、 the area of gold finger. 为了避免阻焊桥影响金手指的功能，我们将删除阻焊桥和在金手指位置开通窗.（3） 问题：No specify the depth tolerance of gold finger bevel edge. We will build gold finger bevel edge depth tolerance as ±0.2mm. 没有说明金手指斜边的公差，我们将按+/-0.2mm制作.（4） 问题：The gold finger is too close to the outline.It will cause the copper e

50、xposed.金手指太靠近外形线，这会导致铜外露.建议：A:To clip gold finger to get 52mil (min) space to avoid copper exposed.B: Follow Gerber to do, please accept copper exposed.A：修剪金手指，保证离外形最少有52mil的距离，防止铜皮外露.B：依GERBER制作，请接收铜外露.（5） 问题：It does not specify the bevel angle tolerance. 没有说明斜边角度的公差. 建议：The bevel angle as ±5&

51、#176; to control. 斜边角度按+/-5°来管控.（6） 问题：The gold finger outside is the breakaway rail ，we can't make the gold finger chamfer.金手指边沿是工艺边，我们做不了金手指的斜边.建议：A：Canel the breakaway on gold finger side. B：Don't make the gold finger bevel edge. A：在金手指那边取消工艺边. B：不做金手指斜边.6 钻孔丶成型 （1）问题：The0.35mm holes

52、 diameter tolerance :±0.05mm is too hard to control. 0.35mm的孔公差+/-0.05mm太难管控. 建议：This kind of holes diamater tolerance：±0.076mm 这类孔的公差为+/-0.076mm （2）问题：The quantity of holes are different between excel spec and gerber file. Excel文档跟gerber的孔数不同. 建议：We will follow gerber file to do and ignore the difference 我们将根据gerber来制作，忽略这个不同点. （3）问题：some data can't measure in drawing , suggest to ignore it and follow the GERBER to do。 图纸上的一些数据测量不了，建议忽略他们，然后根据gerber来制作. （4）问题：Customer did not identify the