德尔福-新能源汽车高压电气系统架构

1、HEV/EV Electrical System Architecture 混合动力/纯电动车 高压电气系统架构 Packard Electrical/Electronic Architecture Agenda 目录 HEV/EV HV Electrical System:混合动力/纯电动车电气系统 HEV-EV HV System Comparison: 混合动力和纯电动车电气系统比较和电气特性 Technical Requirements to HV System:高压电气系统的技术要求 » » » » » Safety 安全性要求 Se

2、aling 密封性要求 Shielding 屏蔽性要求 Thermal Requirements 耐温度性要求 Charging System 充电系统标准 Delphi technical solution:德尔福的技术解决方案 High Power AL Cable 大功率铝导线的使用 Safety 安全性 EMC(Shielding EMC(屏蔽 Thermal Effect 温度影响 Development Trend技术发展趋势 Delphi Products Strategy 德尔福产品发展计划 Charging System Development 充电系统发展 Electric

3、al level Development 功率变化引发得电气性能变化 Delphi Be System Develop & Service Supplier for HEV/EV 为新能源汽 车打造系统平台 Packard Electrical/Electronic Architecture 2 Hybrid/Electric Vehicle Architecture Comparison 混合动力/纯电动车电气系统 MILD Hybrid 中混 Plug-In Hybrid 插电式混合动力 EV 纯电动汽车 HV DC HV AC 12V/42V DC Packard Electri

4、cal/Electronic Architecture 3 HEV/EV Voltages and Currents 混合动力/纯电动车电气特性 Define load by HEV/EV working condition 根据车辆情况定义负载电气特性 Define components level load condition 根据负载电气特性定义零件 AP Market Battery Motor (3 Phase AC RMS Inverter (DC Input DC/DC AC PTC Charger (AC Input B Class Vehicle Current Voltag

5、e Temp 300A 300V 150C 200A 250A 30A 30A 30A 30A 300V 300V 300V 300V 300V 220V 150C 125C 105C 105C 105C 105C C Class Vehicle Current Voltage Temp 320A 400V 150C 250A 300A 30A 40A 40A 30A 400V 400V 400V 400V 400V 220V 150C 125C 105C 105C 105C 105C HV AC Connection Motor/ AC/Inverter Connection System

6、Power PDB Power Distribution System Main Power Circuit Motor/ AC/Inverter Connection System EV Power PDB Battery Pack Connection System MSD Charging Connection System Packard Electrical/Electronic Architecture High Power Requirements Trend for high voltage/current 高功率下的电气要求变化 Packard Electrical/Elec

7、tronic Architecture Packard Electrical/Electronic ArchitectureSafety Requirements 高压电气系统的技术要求Technical Requirement Sealing: 密封性要求 IP55 IP67 IP69Dust protection level at least 6 防尘等级至少为6 Safety Issue caused by sealing 因密封失效导致的严重事故 Packard Electrical/Electronic ArchitectureEMC/EMI Requirements 高压电气系统的

8、技术要求 Shielding: 屏蔽Vehicle Level EMC Requirement:整车级EMC 要求»EMC/EMI/EMS»ISO7637/ISO10605/ISO11452»SAEJ1113Components Level EMC Requirement: 零部件级EMC 要求»BCI/TEM/ALSE »10KHZ 3.2GHZ Development: 发展趋势»Mores focus on wireless application than regular frequency 。面对越来越多无线网络的要求Shi

9、elding ComponentsShielding RequirementsShielding Tests Packard Electrical/Electronic ArchitectureTemperature Requirements 高压电气系统的技术要求Thermal Requirements:温度要求Vehicle temperature area definition 整车温度区»Different working area requirement »不同工作区的温度要求»Different working condition requiremen

10、t »不同工况下的温度要求Components working temperature definition 零部件温度要求»Based on general vehicle working temperature 基本要求为车辆工作的环境温度»Should match different working condition. 但应同时考虑同时再不同条件下工作的情况 Sunshine Working Temp AreaEngine Room Temp Packard Electrical/Electronic ArchitectureHigh Power AL c

11、able 大功率铝导线的使用AL Cable increase usage in HEV/EV electrical system:Advantages:优点»Cost Reduction 降低成本»Weight Reduction 降低重量Shortage:不足»Increase Gauge 线径,体积增加»MFG difficulty 加工困难TOYOTA Prius3 AL cableDELPHI Welding SolutionWeight Reduction Compare with Cooper CableAL Cable Usage dev

12、elop Trend Packard Electrical/Electronic ArchitectureDelphi Solution德尔福的技术解决方案Safety:安全性Creep Distance 保证爬电距离»Follow IEC60664 to design components »按照IEC60664 设计零件Sealing: 密封性能»From IP67 to IP69 保证IP67甚至IP69的防水等级Finger Proof 防触摸保护HVIL Circuit 高压互锁回路»Keep loop link in HV Electrica

13、l System »保证整车回路中得HVIL 串联»Include in each HV Connector »在零件设计中融入HVIL 回路的设计 Design Creep Distance based on Spec Finger Proof Design Different Sealing Design HVIL for different circuit position Packard Electrical/Electronic Architecture德尔福的技术解决方案EMC (Shielding:EMC (屏蔽Shielding Type:屏蔽种类

14、»Single Core shielding 单芯屏蔽»Braid Shielding 屏蔽网屏蔽Follow Test Spec:参照测试标准»SAEJ1113Advanced Study: 先进性尝试»New Material to Improve EMC quality »使用新材料已改善EMC 性能 External Shielding Can单芯屏蔽方案零件设计 屏蔽网方案设计不同屏蔽方式电磁波形图增加磁环滤波以改进EMC 性能 Packard Electrical/Electronic Architecture德尔福的技术解决方案T

15、hermal Effect:温度影响Define temp level:定义不同温度等级»65(Passenger Room»105 (Engine Room»120 (Engine Room»150 /200 (Engine RoomDefine Material level:根据温度定义不同材料»Cable: PVC/XLPE/Silicon »Terminal Plating: Zn/Ag/Au »Housing: PP/PF/PEAnalyze thermal effect root cause:分析温升来源

16、7;Cause by ambient temp »由环境温度引起»Cause by Current »由电流引起»Cause by resistance »有电阻引起 乘客舱温度变化曲线 发动机舱工况温度模拟改变零件设计适应电流温度要求先进工艺制造满足电流温度要求 Packard Electrical/Electronic ArchitectureDelphi Solution Products 德尔福产品发展计划Delphi HV products develop Strategy 德尔福高压产品发展规划Design & Manufa

17、ctory 设计与制造Cable 导线Complex (复杂(HEV/EVComponents 零部件Easy (简单(Regular VehicleElectrical Center 电气盒Wiring Harness 高压线束Products 产品高压屏蔽,带有控制逻辑和安全保护屏蔽,安全,高防水等级全新的设计,仿真,制造,质量控制体系大电流屏蔽导线以及相 关的加工工艺 更多品种,适用不同用电器优化的针对高压 产品的生产系统针对客户特殊需要的产品 Packard Electrical/Electronic ArchitectureDevelopment Trend 技术发展趋势Chargi

18、ng System:充电系统发展趋势Charging System Development 更方便,更安全,更智能,更系统更大的充电电流,更快的充电时间普通家用充电,16A简易充电桩,16A / 32A专用充电桩32A直流充电,80A 250A复合式充电接口无线充电技术智能小区能源网 Packard Electrical/Electronic ArchitectureDesign System 技术发展趋势Voltage/Current: 电压和电流的发展Higher Power cause higher Voltage 更高功率要求更高的电压»Safety Requirement 带来了更严格的安全性考虑Bigger load cause higher current 更大的负载也要求更高的电流»Higher Temp 温升更高»Higher Frequency request EMC protect 可能因更高的