PCBA可制造性设计规范

1、Global Invacom Manufacturing (Shanghai) Co., Ltd 2015 Confidential 1SMT PCB/Panel layout SMT Team2015-03-22Global Invacom Manufacturing (Shanghai) Co., Ltd 2015 2PCB Design GuidelineGlobal Invacom Manufacturing (Shanghai) Co., Ltd 2015 3Revision record Rev.DateChange Description02015/4/17New release

2、 Global Invacom Manufacturing (Shanghai) Co., Ltd 2015 4Purposel Based on the requirements of production process , In the layout and circuit board design process , There is a standard to follow , To achieve high efficiency in the production of assembly , Easy assembly, low cost, and high quality tar

3、get. l The content is only applicable to the related database, some are for reference only .Global Invacom Manufacturing (Shanghai) Co., Ltd 2015 5contentl PCB layout rulesl Text marking for silkscreen layerl PCB Fiducial Mark designl PCB fixed position holel SMT component PAD design l PTH component

4、 PAD designl Through-hole(Via)designl Trace designl other limitationGlobal Invacom Manufacturing (Shanghai) Co., Ltd 2015 6PCB layout rulesl V-Cut layout rule :l Chips to V-Cut line should be more than 1mm, otherwise will damage chips or will change to use Stamp Cut design , will add the PCB costl T

5、he distance to PCB edge 0.5mm, can not layout the trace, The distance to PCB edge 1.0mm,can not layout the any componentl The distance to PCB edge 5mm, can not layout the components height over 25mm, otherwise cuter will damage components1mmChipsChips1mmV-CUT25mm5cmmDe-panel CuterPCB V-CUT PCBGlobal

6、 Invacom Manufacturing (Shanghai) Co., Ltd 2015 7PCB layout rulesl V-Cut layout rules :l PCB trace to V-Cut should be more then S=0.5mm safety buffer, otherwise will have the risk to damage the trace.lWhen we use V-Cutl PCB thickness 1.0mm to 3mm(1.0mm to 0.5mm + SMT pallet)l PCB outline is square t

7、ype or rectangle type, irregular shape can not use the V-CutSTHStamp Cutirregular shapeGlobal Invacom Manufacturing (Shanghai) Co., Ltd 2015 8PCB layout rulesl Stamp design :l Stamp design only for irregular PCB, PCB to PCB layout distance is 2mm, V-Cut only 0.3mml Stamp design parameters Stamp Cut

8、Stamp Cut1.5mm2.0mm5.0mm2.8mm0.4mmNPTH hole 1.0mmPCBPCBPCBPCB1.5mm2.0mm5.0mm0.4mmNPTH hole1.0mmconveyorconveyor edge edgePCBPCBGlobal Invacom Manufacturing (Shanghai) Co., Ltd 2015 9PCB layout rulesl V-Cut VS Stamp layout :l PCS to PCS distance only 0.3mm for V-Cut, we can save the PCB layout costl

9、Stamp Cut design, PCB PCS to PCS distance is 2mml Base on same PCS design with different Cut type( stamp/V Cut), the PCB cost will impact 10- 25%l V-Cut PCB will be cut by machine, but Stamp Cut will broken by OP and have stress then damage the componentsV-Cut machineGlobal Invacom Manufacturing (Sh

10、anghai) Co., Ltd 2015 10PCB/panel layoutl Why dont choose single PCB for SMT process :l We need to put the each single PCB on carrier when do SMT processl But carrier cave and single PCB have tolerance , so always happen solder paste printing misalignment then will get the shift/tombstone process is

11、suel Sometimes will happen single PCB lift up from SMT carrier and will have the chips mounting shift/missing process issues PrinterMounterAOISPI/VIPCBReflow ovenAssembly FlowPut the single PCB on the carrierGlobal Invacom Manufacturing (Shanghai) Co., Ltd 2015 11PCB/panel layoutl Factors of impact

12、PCB Costl PCB layout l Fine pitch componentsl Panel V-Cut/Stamp Cut/PCB conveyor edge sizel PCB drill hole size/quantityl PCB material costl PCB process easy/complicated , process specl PCB surface finished process also impact cost, OSP/IMS/EING/IMTl PCB outline, regular shape is cheaper than irregu

13、lar shape ,Global Invacom Manufacturing (Shanghai) Co., Ltd 2015 12Text marking for silk layerThe current situation:l We received the gerber file for UK design team ,no silk layer be found lWe can not directly confirm Polarity of component on the PCB , can not confirm the location of component ,easi

14、ly to confirm IC shift or not .lIn the production adjustment X, Y coordinate and confirmation the location completely rely on engineering drawings ,Big waste of time.No silk layers in the gerber fileNo text mark on the pcbGlobal Invacom Manufacturing (Shanghai) Co., Ltd 2015 13Text marking for silk

15、layer l As the icon text marking design we can accept . We can quickly inspection location where there are problems.silkscreenText markingGlobal Invacom Manufacturing (Shanghai) Co., Ltd 2015 14Text marking for silk layer Component outline& polarity marking design definition:lText marking, keep

16、away from Via Hole or Through Hole as far as possiblelText marking , Silk screen printing character, polarity and polarity signs can not components be coveredlText height25 mil ,line width 5 millBeside the BGA/CSP ,component outline should not smaller than actual component size.lThe text does not ov

17、erlaplSMD/PTH component text marking include body outline , pin assignment ,component name ,polarity marking .as below:Global Invacom Manufacturing (Shanghai) Co., Ltd 2015 15lComponent outline& polarity markinga.Tantalum capacitor or diode 3 PINb.SOP/SSOPc. QFP Text marking for silk layerGlobal

18、 Invacom Manufacturing (Shanghai) Co., Ltd 2015 16lComponent outline& polarity markingd. QFNe. BGA, CSP marking -. outline size must the same as actual componentText marking for silk layerGlobal Invacom Manufacturing (Shanghai) Co., Ltd 2015 17l PCB number and version (i) PCB Model (ii) PCB Part

19、 number and version (iii) text height : 80mil PCB 板號說明如下：板號說明如下： 西元年度後兩碼西元年度後兩碼 ( 06 , 07 ) 全新全新 PCB 必需附予板號及必需附予板號及 -SA (Sample A) 版本，爾後修改版本依序為版本，爾後修改版本依序為 -SB、-SC，或，或 -1A 、-1B 、-1C .等，量產時版本必需為等，量產時版本必需為 -1、-2、-3等等 Text marking for silk layerGlobal Invacom Manufacturing (Shanghai) Co., Ltd 2015 18PC

20、B Fiducial Mark designlThe current situation: Many projects did not design fiducial mark-in, the machine can not recognize to position, cause no high precision print/mounted Global Invacom Manufacturing (Shanghai) Co., Ltd 2015 19PCB Fiducial Mark designDd= 1.0mmD=3.0mmd4.0mmHL5.0mmHLl Three fiducia

21、l mark-out located diagonally on board, and do follow related dimension requirement . fiducial mark dimension is 1mm(d) and solder mask is 3mm(D) . The diagonal fiducial mark should not be symmetrical, it should be keep away at 5 mm.l Fiducial PAD edge keep 4mm distance from the edge of PCB lSingle

22、board must have two fiducial mark in located diagonally on the board.Mark outMark inGlobal Invacom Manufacturing (Shanghai) Co., Ltd 2015 20PCB fixed position holel Tooling holes on all boards are called out with correct dimensions, tolerances, and are non-plated. ( 3.55mm +0.075/-0 or 2.18mm +0.05/

23、-0.05)l There should be 3.81 mm arc located at 4 corners of PCB to avoid stuck at conveyor and damage of packing material.Uniform fixed hole size and convenient tool for positioning Tooling holes 3.81 mm arc Global Invacom Manufacturing (Shanghai) Co., Ltd 2015 21lNG symptom: 0402 chip tombstonelFor

24、 example: D500+ FN700054 chip 0402 chip tombstone defect rate:1.0%lNG picture:lAnalysis: PAD to PAD space is too big caused the tombstone after IR . PAD to PAD : 16milPAD to PAD : 22milSMT component PAD design Global Invacom Manufacturing (Shanghai) Co., Ltd 2015 22SMT component PAD design lNon spec

25、ifications within RLC Pad design according to the following principles (i) B= max of W1, to prevent the shift(ii) C=10 + H(electrode width) + 15 mil(iv) restricted area L2: A+10mil ,W2=max: ( W1 + 8 + max of tolerance , B + 10 )Global Invacom Manufacturing (Shanghai) Co., Ltd 2015 23TYPEBody Size(mi

26、l)Component body tolerance(mm)Pad Size(mil）L1W1ABCD0201(0603)24120.0336121480402(1005)40200.05562222120603(1608)63320.1834031210805(2125)79500.21036137291206(3216)123630.251607350601210(3225)1231010.217111055612010(5025)197990.25230110451402512(6432)2521260.2529013870150ref.L2=A + 10；W2=max: ( W1 +

27、8 + max of tolerance , B + 10 )(1) Resistance and inductance components size list22 x 22 mil4mil fillet12 mil57 mil83614 mil 12mil2mil fillet0201 PAD design0402 PAD designNote: besides the chip 0201/0402,the rest of database is for reference only unit: milSMT component PAD design Global Invacom Manu

28、facturing (Shanghai) Co., Ltd 2015 24TYPEBody Size(mil)Component body tolerance(mm)Pad Size(min)Placement SizeareaL1W1ABCDL2W20201(0603)24120.033612148512211220402(1005)40200.0556222212753425500402(1005)40200.10.2602824120603(1608)63320.2834031211054648300805(2125)79500.2510361372914076106401206(321

29、6)126630.316073506018286156521210(3225)126990.31711105561190130247001808(4520)189800.32109050110230120276001812(4532)1821260.3207136608723716639342ref.L2=A + 10；W2=max: ( W1 + 8 + max of tolerance , B + 10 )(2) capacitance component size listNote: besides the chip 0201/0402,the rest is for reference

30、 only unit: milSMT component PAD design Global Invacom Manufacturing (Shanghai) Co., Ltd 2015 25TYPEBody SizePad SizePlacement SizeareaL1W1ABCDL2W232161246617666507622711225424352814211324090906028316446412603223213033410590154380180684007343282173338959015839020078000ref.L2=A + 30；W2=component body

31、 width+ 20；D=A - 2 x C; SMT component PAD design (3) STC32167343unit: milNote : No chips component that size below 0603 located beside 7347 and 6032 tantalum capacitor within 2.6mm pad to pad distance. If un-avoidable, the chip components should be vertical with the tantalum capacitor.Global Invacom

32、 Manufacturing (Shanghai) Co., Ltd 2015 26TYPEBody SizePad SizePlacement SizeL1W1abcL2W2SE31168.06.33.11.62.29.47.0 SE28116.35.0 2.81.61.48.05.7SE27166.05.0 2.71.61.4 7.8 5.7SE25165.54.0 2.51.61.0 7.0 4.7unit:mm(4)Electrolysis capacitor parts size listSMT component PAD design Global Invacom Manufact

33、uring (Shanghai) Co., Ltd 2015 27(5)Diode-3PINTYPEBody SizePad SizePlacement SizeL1W1a1a2bcdeL2W2SOT-23 48404012040136136156Diode-3PIN48404012040136136156ref.W2=e+20 , L2=max(c+16; L1+16)e = E+30d = D+6b = B-A2-6a1 = (e-d) / 2a2 =A2+6DA1A2EBA18mil R角A3a3 =A3+6unit: milSMT component PAD design Global

34、 Invacom Manufacturing (Shanghai) Co., Ltd 2015 28(6) Connector pin for Single side Pitch, bBody SizePad SizePlacement Size(mm)(mil)L1W1acL2W20.519.68512A+30L1+30W1+500.6350.65025.0025.5914A+30L1+30W1+500.6525.59B+4A+30L1+30W1+50Note* If the component pitch be defined by the metric unit , In English

35、 units should be considered for the calculation of the cumulative error of Pitch *The distance between connectors should at least have 2mm space from the outline edge of the Pad or Body.*For component higher than 5mm, need to keep same distance/clearance on pcb surface free from component to avoid s

36、hadow effect and causing AOI limiation.*The distance between smd type connector and chip should at least have 2mm space from the outline edge of the Pad or Body.*Boss pin hole size (NPTH) = Connector boss size + 0.15 mmunit: milSMT component PAD design Global Invacom Manufacturing (Shanghai) Co., Lt

37、d 2015 29Pitch, bBody SizePad SizePlacement Size(mm)(mil)L1W1acdL2W20.519.68512A+30W1+40L1+30d+300.6350.65025.0025.5914A+30W1+40L1+30d+300.6525.59B+4A+30W1+40L1+30d+30Note* If the component pitch be defined by the metric unit , In English units should be considered for the calculation of the cumulat

38、ive error of Pitch *The distance between connectors should at least have 2mm space from the outline edge of the Pad or Body.*For component higher than 5mm, need to keep same distance/clearance on pcb surface free from component to avoid shadow effect and causing AOI limiation.*The distance between s

39、md type connector and chip should at least have 2mm space from the outline edge of the Pad or Body.(7)Connector pin for two side unit: milSMT component PAD design Global Invacom Manufacturing (Shanghai) Co., Ltd 2015 30(8)IC types a. SSOP, SOP TypePitch, bBody SizePad SizePlacement Size(mm)(mil)L1W1

40、acdW2L2SSOP0.415.748860W1+30d+30L1+20SSOP0.519.68512SSOP0.6352514SSOP0.6525.59SSOP0.831.49616SOP1.275025Note* If the component pitch be defined by the metric unit , In English units should be considered for the calculation of the cumulative error of Pitch unit: milSMT component PAD design Global Inv

41、acom Manufacturing (Shanghai) Co., Ltd 2015 31(8)IC types b.QFPPitchBody SizePad SizePlacement SizebW1L1acd1d2W2L219.485(0.5mm) 1260W1+40L1+40d1+20d2+2025.59(0.65mm)1690W1+50L1+50d1+20d2+2031.496(0.8mm)1890W1+50L1+50d1+20d2+20NoteIf the component pitch be defined by the metric unit , In English unit

42、s should be considered for the calculation of the cumulative error of Pitch unit: milSMT component PAD designGlobal Invacom Manufacturing (Shanghai) Co., Ltd 2015 32IC types (9)QFNPitchBody SizePad SizePlacement SizebDEacd1d2L2W219.485(0.5mm)1260E+40(On both sides of the 20 )D+40(On both sides of th

43、e 20 )d1+30d2+3025.59(0.65mm)1460E+40(On both sides of the 20 )D+40(On both sides of the 20 )d1+30d2+30Note Ground pad at the bottom of the QFN : A - D2 = 0.4 mm; B - E2 = 0.4 mmunit: milSMT component PAD designGlobal Invacom Manufacturing (Shanghai) Co., Ltd 2015 33BGA, CSPPitch ,bBody SizePad Size

44、Placement Size(mm)(mil)L1W1aL2W2CSP = 5 mm 5mm 5mm L1+120W1+120Note*Dont overlap with any component.*Dont put the range of Connector, BGA and other large easy to heat parts. All of the Via Hole shall be double coverage of solder mask layersunit: milSMT component PAD designGlobal Invacom Manufacturin

45、g (Shanghai) Co., Ltd 2015 34PTH component PAD designl In order to simplify and improve the printing circuit welding (soldering) process , The special development of through-hole reflow technology (Pin-in-Paste) The through-hole type connector from Dipping process ,change to SMT printing solder past

46、e and reflow replaced . Place all thru-hole parts on topside of the board. (Avoid manual soldering process)l B : aperture sizepin diameter size +0.25 mm ( 10 mil )l A : The outer layer of the minimum pad size aperture size+ 0.36 mm (14 mil )l According to the manual soldering parts : Pad size (A) =

47、Hole size (B) + 40 milGlobal Invacom Manufacturing (Shanghai) Co., Ltd 2015 35lPTH design guidelinelParts of pin diameter and through the aperture ratio (PH) principle: Pin to hole rate (P / H) should fall within 0.60.8, shown as diagram:PH= 0.60.8 the best ; PH= 0.40.5 Acceptable ; PH 320 .Other li

48、mitationGlobal Invacom Manufacturing (Shanghai) Co., Ltd 2015 47lPIP parts limitlAll of the through hole part must be designed in second to avoid the use of hand soldering process The first surface is necessary to use the SMD TYPE part or through hole parts pin and parts body can not outstand PCB se

49、cond surface lThe spec of pin out of pcb surface in PIP process :pin length PCB thickness + 0.30.6 mmThe insert parts in PCB can not tilt, dumping or easy to loose state. Other limitationGlobal Invacom Manufacturing (Shanghai) Co., Ltd 2015 48Other limitationlChoose the component :The use of chip components in the SMT stage as far as possible, reduce the waste of human action. PTH parts to SMDPTH parts to SMDPTH parts to SMDPTH parts