新产品开发整体流程介绍（PPT 33页）.ppt

C-SystemIntroductionwillcover,Role&Responsibility(R&R)ProcessCxStage:C0:Proposalphase構想階段C1:Planningphase規劃階段C2:R&DDesignphase設計階段C3:LabPilotRunphase樣品試作階段C4:EngPilotRunphase工程試作階段C5:PDPilotRunphase試產階段C6:MassProductionphase量產階段,Role&Responsibility,-WistronCase,Role&Responsibility,-WistronCase,Role&Responsibility,-WistronCase,Role&Responsibility,-WistronCase,Role&Responsibility,-WistronCase,Role&Responsibility,-WistronCase,WistronC-SystemQualityControl,ProposalPhase,PlanningPhase,R&DDesignPhase,LabPilot-runPhase,EngineeringPilot-runPhase,ProductionPilot-runPhase,MassProductionPhase,C0,C1,C2,C3,C4,C5,CheckPoint,WistronC-Phase,Availability,Develop,Plan,Launch,FAI&SPCMTBFDemoCIP/CLCAParetoAnalysisEWGReadyAFR,TestReportsPre-QVLReadyDiagnosticsProgramBugList&ActionDCN/ECN/ECRFAIreportPFMEASQRC,TrainingMTBFReviewQMP/QPA/QSAFPYRPPAPServiceability,Design,TestPlansIntegrateDesignReviewSignalQualityDFXIndexInitialSupplierAuditMemorandumDFMEASimulationMTBFEstimateMVP,Concept/Proposal,MRSDefinitionScopeSCE,ProductLifeCycle,MDRR/C4Go/NoGo?,MRR/C5Go/NoGo?,C6,OOB/OBA,ORT/Stress,EWG/FQH,AFR/DOA,NewCSystemArchitecture,Progress,Time,DetailActivities,SubjectScopeDefinitionProcedure.,ActivitiesDefinition,Record&Report,FormatDefinition,EscalationRule,MeasurementStandard,ProjectManagement&SystemMaintenance,NewCSystemProductDevelopment,ProposalPhase,PlanningPhase,R&DDesignPhase,LabPilotRunPhase,Eng.PilotRunPhase,ProductionPilotrunPhase,Massproductionphase,C2meeting,C3meeting,C4meeting,C5meeting,C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport(prel.)ME/Artwork/packingdrawingPAL/ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus&buglistreview,C4checklistBOMQVLTimestandardSystemBIOS/KBCFWreleaseS/WDriver/AP/Utility/DiagnosticReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslist,C5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreport,PM,PM,C0meeting,C1meeting,PM,C1checklistInventiondisclosureTimescheduleProjectteamModelnumberdefineGreendesignguideandreviewchecklistNonQVL/Sampleapprovalrequestform,C2checklistPESEMC/SafetyRequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodulespecification,PM,NPI,C0,C1,C2,C3,C4,C5,C6,C6meeting,GCSD,C6checklistProductphaseoutnotice,C0ChecklistMRS,C0/PM,C0Meeting,C0-工作重點及檢核項目,NewCSystemProductDevelopment,ProposalPhase,PlanningPhase,R&DDesignPhase,LabPilotRunPhase,Eng.PilotRunPhase,ProductionPilotrunPhase,Massproductionphase,C2meeting,C3meeting,C4meeting,C5meeting,C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport(prel.)ME/Artwork/packingdrawingPAL/ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus&buglistreview,C4checklistBOMQVLTimestandardSystemBIOS/KBCFWreleaseS/WDriver/AP/Utility/DiagnosticReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslist,C5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreport,PM,PM,C0meeting,C1meeting,PM,C0ChecklistMRS,C2checklistPESEMC/SafetyRequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodulespecification,PM,NPI,C0,C1,C2,C3,C4,C5,C6,C6meeting,GCSD,C6checklistProductphaseoutnotice,C1checklistInventiondisclosureTimescheduleProjectteamModelnumberdefineGreendesignguideandreviewchecklistNonQVL/Sampleapprovalrequestform,C1/PM,C1Meeting,C1-工作重點及檢核項目,Case-bottleCocainEngland,開採鋁礦,一噸鋁土提鍊半噸氧化鋁半小時加工,半噸氧化鋁熔煉成1/4噸金屬鋁再加工二週成鋁錠,瑞典或梛威熔爐工廠,澳大利亞,澳大利亞化學還原工廠,加熱至華氏900度壓延成1/8inch薄片,瑞典和德國壓延廠,船運一個月,冷軋成1/80inch薄片,冷軋廠,英國易開罐廠,成型，清洗，烘乾，防鏽,裝填，印刷,英國可樂廠,消費,鋁罐回收儘16%,EcologicalRucksack(生態包袱),生產一片半導體晶片所產生之廢料為產品重量之十萬倍生產一台筆記型電腦所產生之廢料為產品重量之四千倍生產一公升佛羅里達橘子汁需要兩公升汽油及一千公升之水生產一噸紙需用掉九十八噸之其他資源資料來源:綠色資本主義天下出版社,EURoHSDirective,指令期程2003.01.27指令發布2003.02.13歐盟公報發行,指令生效2004.08.13轉為會員國當地法律,法規或行政指令2006.07.01新投入之產品不得含有禁用物質指令要求/禁用項目鉛(Pb)鎘(Cd)汞(Hg)六價鉻(Cr6+)多溴聯苯(PBB)多溴化二苯乙醚(PBDE),(Therestrictionoftheuseofcertainhazardoussubstancesinelectricalandelectronicequipment),EURoHS管制規格,重金屬：汞、鉛、鎘、六價鉻溴性耐燃劑：聚溴聯苯(PBBs)、溴聯苯醚(PBDEs),註：另有管制規範外的項目,EUWEEEDirective,Directive2002/96/EC期程2003.01.27指令發布2003.02.13歐盟公報發行，指令生效2004.08.13轉為會員國當地法律,法規或行政指令2005.08.13完成回收系統建構,製造商因應回收之財務規劃就緒2006.12.31回收再利用率達每人每年4kg2008.12.31訂定下階段目標回收TargetofRecoveryandRecycling,(WasteElectricalandElectronicEquipment),NewCSystemProductDevelopment,ProposalPhase,PlanningPhase,R&DDesignPhase,LabPilotRunPhase,Eng.PilotRunPhase,ProductionPilotrunPhase,Massproductionphase,C2meeting,C3meeting,C4meeting,C5meeting,C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport(prel.)ME/Artwork/packingdrawingPAL/ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus&buglistreview,C4checklistBOMQVLTimestandardSystemBIOS/KBCFWreleaseS/WDriver/AP/Utility/DiagnosticReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslist,C5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreport,PM,PM,C0meeting,C1meeting,PM,C0ChecklistMRS,PM,C1checklistInventiondisclosureTimescheduleProjectteamModelnumberdefineGreendesignguideandreviewchecklistNonQVL/Sampleapprovalrequestform,NPI,C0,C1,C2,C3,C4,C5,C6,C6meeting,GCSD,C6checklistProductphaseoutnotice,C2checklistPESEMC/SafetyRequestFormBOM/QVL(Prel.)PCBLayout(prel.)Outsourcingmodulespecification,C2/PM,C2Meeting,C2-工作重點及檢核項目,NewCSystemProductDevelopment,ProposalPhase,PlanningPhase,R&DDesignPhase,LabPilotRunPhase,Eng.PilotRunPhase,ProductionPilotrunPhase,Massproductionphase,C2meeting,C3meeting,C4meeting,C5meeting,C4checklistBOMQVLTimestandardSystemBIOS/KBCFWreleaseS/WDriver/AP/Utility/DiagnosticReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslist,C5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreport,PM,NPI,C0,C1,C2,C3,C4,C5,C6,C6meeting,GCSD,C6checklistProductphaseoutnotice,C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport(prel.)ME/ArtworkpackingdrawingPAL/ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus&buglistreview,C3/PM,C3Meeting,C3-工作重點及檢核項目,NewCSystemProductDevelopment,ProposalPhase,PlanningPhase,R&DDesignPhase,LabPilotRunPhase,Eng.PilotRunPhase,ProductionPilotrunPhase,Massproductionphase,C2meeting,C3meeting,C4meeting,C5meeting,C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport(prel.)ME/Artwork/packingdrawingPAL/ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus&buglistreview,C5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreport,PM,NPI,C0,C1,C2,C3,C4,C5,C6,C6meeting,GCSD,C6checklistProductphaseoutnotice,C4checklistBOMQVLTimestandardSystemBIOS/KBCFWreleaseS/WDriver/AP/Utility/DiagnosticreleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslist,C4/PM,C4Meeting,WistronMobileReliabilityTestPlan,EnvironmentThermalProfileTestTemperatureandHumidityTestVibration,Shock,DropTestsAltitudeTest,AcousticsTestsMTBFPrediction,EMCLightning/SurgeTestVoltageDipTestEFT,ESDTestHarmonicTestIEC1000-4-XXEMI/EMS,PowerLineInterferenceLineVoltage/FrequencyTestPowerSurgeTestVoltageDipandInterruptionPowerOn/OffTestEFT/BImmunityTestComplexMarginTest,TransportationVibrationTestAltitudeTestShockTestDropTest,UserInclineOperationTestBenchHandlingTestPowerSavingTestPressureTestAudioQualityTortureTest,ReliabilityTestLCDModule,WistronMobileReliabilityTestPlan,WistronMobileReliabilityTest-LCD,C4-工作重點及檢核項目,NewCSystemProductDevelopment,ProposalPhase,PlanningPhase,R&DDesignPhase,LabPilotRunPhase,Eng.PilotRunPhase,ProductionPilotrunPhase,Massproductionphase,C2meeting,C3meeting,C4meeting,C5meeting,C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport(prel.)ME/Artwork/packingdrawingPAL/ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus&buglistreview,C4checklistBOMQVLTimestandardSystemBIOS/KBCFWreleaseS/WDriver/AP/Utility/DiagnosticReleaseEEEng.P/RreportSMTWSP/RreportPCBAWSP/RreportMEEng.P/RreportEng.P/RQAreviewreportSchematics&jumpersettingTestprogram/ProcedureSOPforPCBA/FAUsermanualR/NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslist,PM,PM,C0,C1,C2,C3,C4,C5,C6,C6meeting,GCSD,C6checklistProductphaseoutnotice,C5checklistServiceGuideEMCSafetyreportPDP/RyieldrateanalysisrptPCBAinspectioninstructionProduc